Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.

Abstract: Disclosed herein are an apparatus and method for updating an Internet-based malware detection engine using virtual machine scaling. The method may include creating a scaling group and an update group set based on a first virtual machine image, creating a second virtual machine image for a running virtual machine in response to occurrence of a snapshot event in the virtual update group run based on the first virtual machine image, modifying the scale-out image of the scaling group to the second virtual machine image, updating the scaling group by triggering a scale-out event and a scale-in event in the scaling group in response to occurrence of an update event, and modifying the scale-in image of the scaling group to the second virtual machine image.

Abstract: Provided is a method of manufacturing a server room cooling apparatus, the method including: providing a housing; providing at least one frame in the housing; providing, on the at least one frame, a barrier wall configured to divide a space inside the housing into at least two spaces; forming a mist ejection unit configured to eject mist to an outer air supplied from outside the server room cooling apparatus, at a side of a supply unit that is formed by the barrier wall and supplies outer air to a server room; forming a filter unit configured to filter outer air supplied from outside the server room cooling apparatus, at a side of the mist ejection unit; and forming an outer air inflow unit into which outer air flows, at one side of the filter unit.

Abstract: A rack having scalability and compatibility may be configured to reversibly adjusted to be reversibly configured to support various computerized equipment having various sizes and power supply schemes without adjusting an outer volume boundary of the rack and without replacement of the rack. The rack may include a main frame and an additional frame. The main frame may structurally support computerized equipment having a particular dimension that is a first size within an enclosure that is a first enclosure at least partially defined by the main frame. The additional frame may reversibly couple with the main frame to adjust the enclosure to be a second enclosure at least partially defined by the at least one additional frame to reversibly configure the main frame to store computerized equipment having the particular dimension that is a second size that is different from the first size.

Abstract: A cooling system and associated method may be used to perform cooling using the hydrothermal energy of supply water stored in a supply water tank that is to be complementarily supplied to a cooling tower of a freezer.

Abstract: Provided is a server room cooling device including: an outer air inflow unit into which outer air flows; a filter unit provided at one side of the outer air inflow unit and filtering the outer air supplied through the outer air inflow unit; a mist ejection unit provided at one side of the filter unit and ejecting mist into the outer air that has passed through the filter unit; and a supply unit provided at one side of the mist ejection unit and supplying the outer air that has passed through the mist ejection unit to a server room.

Abstract: A semiconductor device according to an embodiment includes: a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, a second conductive semiconductor layer under the active layer, and a plurality of recesses exposing a lower portion of the first conductive semiconductor layer; at least one pad arranged outside the light emitting structure and arranged to be adjacent to at least one edge; and a plurality of insulation patterns arranged in the recesses and extending to a lower surface of the light emitting structure, in which widths of the plurality of insulation patterns are reduced as the insulation patterns become further away from the pad. The semiconductor device according to the embodiment may prevent a current from being focused on a recess area adjacent to the pad.

Abstract: A cooling air supplying booth apparatus for supplying cooling air to pieces of equipment in a rack unit includes a first frame and a plurality of plates. The first frame forms edges of a cuboid. The plates are fixed to the first frame and disposed at four of sides of the cuboid and form a cooling air moving path. A cooling plate includes at least one fan and is disposed at the bottom of the first frame opposite the top side of the first frame. Cooling air is supplied to the cooling air moving path through the fan, and supplied to the equipment through an outlet side in the cooling air supplying booth apparatus.

Abstract: A rack having scalability and compatibility may be configured to reversibly adjusted to be reversibly configured to support various computerized equipment having various sizes and power supply schemes without adjusting an outer volume boundary of the rack and without replacement of the rack. The rack may include a main frame and an additional frame. The main frame may structurally support computerized equipment having a particular dimension that is a first size within an enclosure that is a first enclosure at least partially defined by the main frame. The additional frame may reversibly couple with the main frame to adjust the enclosure to be a second enclosure at least partially defined by the at least one additional frame to reversibly configure the main frame to store computerized equipment having the particular dimension that is a second size that is different from the first size.

Abstract: A cooling system and associated method may be used to perform cooling using the hydrothermal energy of supply water stored in a supply water tank that is to be complementarily supplied to a cooling tower of a freezer.

Abstract: A semiconductor device according to an embodiment includes: a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, a second conductive semiconductor layer under the active layer, and a plurality of recesses exposing a lower portion of the first conductive semiconductor layer; at least one pad arranged outside the light emitting structure and arranged to be adjacent to at least one edge; and a plurality of insulation patterns arranged in the recesses and extending to a lower surface of the light emitting structure, in which widths of the plurality of insulation patterns are reduced as the insulation patterns become further away from the pad. The semiconductor device according to the embodiment may prevent a current from being focused on a recess area adjacent to the pad.

Abstract: A light-emitting device discloses a light emitting structure layer including an active layer between first and second conductive semiconductor layers, a first electrode electrically connected to the first conductive semiconductor layer, a contact layer disposed under the second conductive semiconductor layer, a reflective layer disposed under the contact layer, a capping layer disposed under the reflective layer, and a conductive supporting member disposed under the capping layer. The reflective layer comprises a thickness that is greater than the thickness of the second conductive semiconductor layer and 90 or more times greater than the thickness of the contact layer.

Abstract: A light-emitting device discloses a light emitting structure layer including an active layer between first and second conductive semiconductor layers, a first electrode electrically connected to the first conductive semiconductor layer, a contact layer disposed under the second conductive semiconductor layer, a reflective layer disposed under the contact layer, a capping layer disposed under the reflective layer, and a conductive supporting member disposed under the capping layer. The reflective layer comprises a thickness that is greater than the thickness of the second conductive semiconductor layer and 90 or more times greater than the thickness of the contact layer.

Abstract: Provided is a method of manufacturing a server room cooling apparatus, the method including: providing a housing; providing at least one frame in the housing; providing, on the at least one frame, a barrier wall configured to divide a space inside the housing into at least two spaces; forming a mist ejection unit configured to eject mist to an outer air supplied from outside the server room cooling apparatus, at a side of a supply unit that is formed by the barrier wall and supplies outer air to a server room; forming a filter unit configured to filter outer air supplied from outside the server room cooling apparatus, at a side of the mist ejection unit; and forming an outer air inflow unit into which outer air flows, at one side of the filter unit.

Abstract: Provided is a server room cooling device including: an outer air inflow unit into which outer air flows; a filter unit provided at one side of the outer air inflow unit and filtering the outer air supplied through the outer air inflow unit; a mist ejection unit provided at one side of the filter unit and ejecting mist into the outer air that has passed through the filter unit; and a supply unit provided at one side of the mist ejection unit and supplying the outer air that has passed through the mist ejection unit to a server room.

Abstract: A cooling air supplying booth apparatus for supplying cooling air to pieces of equipment in a rack unit includes a first frame and a plurality of plates. The first frame forms edges of a cuboid. The plates are fixed to the first frame and disposed at four of sides of the cuboid and form a cooling air moving path. A cooling plate includes at least one fan and is disposed at the bottom of the first frame opposite the top side of the first frame. Cooling air is supplied to the cooling air moving path through the fan, and supplied to the equipment through an outlet side in the cooling air supplying booth apparatus.