Patents by Inventor Ji Seok Lim

Ji Seok Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240091730
    Abstract: The present invention relates to the stabilization of an effective ingredient by using a mineral material. In the present invention, the effective ingredient can be stably supported using the mineral material, and a microcapsule obtained by the manufacturing method according to the present invention, when discharged to nature, causes no environmental problems due to encapsulation ingredients thereof being the same as soil ingredients, and thus can avoid micro-plastic issues.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 21, 2024
    Applicants: LG HOUSEHOLD & HEALTH CARE LTD., IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Jun Seok YEOM, Eun Chul CHO, Ji Won LIM, Hyo Jin BONG, Seon A JEONG, No Jin PARK, Woo Sun SHIM
  • Patent number: 8300328
    Abstract: A lens unit composed of different materials includes a base and a lens. A part of a camera module of a different material from the lens is used as the base. The lens of optical resin is directly replicated on the base such that the lens is integrally formed on the base. A camera module is provided with the lens unit. The lens/lenses is/are formed on the single base/multiple bases to form the lens unit/units, using a die whose surface contacting the base slopes in relation to its central axis to allow the base to self-align.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: October 30, 2012
    Assignee: Optomecha Co., Ltd.
    Inventors: Shinill Kang, Ji Seok Lim, Min Seok Choi
  • Patent number: 8294229
    Abstract: A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: October 23, 2012
    Assignee: Industry-Academic Co-Operation Foundation, Yonsei University
    Inventors: Shinill Kang, Ji Seok Lim, Min Seok Choi, Ho Kwan Kim
  • Publication number: 20110085070
    Abstract: A lens unit composed of different materials includes a base and a lens. A part of a camera module of a different material from the lens is used as the base. The lens of optical resin is directly replicated on the base such that the lens is integrally formed on the base. A camera module is provided with the lens unit. The lens/lenses is/are formed on the single base/multiple bases to form the lens unit/units, using a die whose surface contacting the base slopes in relation to its central axis to allow the base to self-align.
    Type: Application
    Filed: July 3, 2008
    Publication date: April 14, 2011
    Applicant: OPTOMECHA CO. LTD.
    Inventors: Shinill Kang, Ji Seok Lim, Min Seok Choi
  • Publication number: 20100283113
    Abstract: A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.
    Type: Application
    Filed: January 12, 2009
    Publication date: November 11, 2010
    Applicant: Industry-Academic Co-Operation Foundation, Yonsei Unversity
    Inventors: Shinill Kang, Ji Seok Lim, Min Seok Choi, Ho Kwan Kim