Patents by Inventor Ji Sok LEE

Ji Sok LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming planarization layer and pattern forming method using the same
    Patent number: 11651968
    Abstract: A method for forming a planarization layer includes: providing a substrate including a trench; coating a pre-thinner over a surface of the trench; forming a gap-filling material in the trench; coating a post-thinner over the gap-filling material; and performing a spinning process to rotate the substrate.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 16, 2023
    Assignee: SK hynix Inc.
    Inventors: Ji Sok Lee, Sung Koo Lee, Jae Hee Sim
  • METHOD FOR FORMING PLANARIZATION LAYER AND PATTERN FORMING METHOD USING THE SAME
    Publication number: 20210375632
    Abstract: A method for forming a planarization layer includes: providing a substrate including a trench; coating a pre-thinner over a surface of the trench; forming a gap-filling material in the trench; coating a post-thinner over the gap-filling material; and performing a spinning process to rotate the substrate.
    Type: Application
    Filed: October 28, 2020
    Publication date: December 2, 2021
    Inventors: Ji Sok LEE, Sung Koo LEE, Jae Hee SIM