Patents by Inventor Jia-Wen Chen

Jia-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240165170
    Abstract: The present invention provides a method for preventing and/or treating a NSAID-induced gastric ulcer. The method comprises administrating an effective amount of a lactic acid bacterium set to a subject. The lactic acid bacterium set comprises Lactobacillus plantarum GKD7 and Pediococcus acidilactici GKA4.
    Type: Application
    Filed: March 6, 2023
    Publication date: May 23, 2024
    Applicant: GRAPE KING BIO LTD.
    Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shin-Wei LIN, You-Shan TSAI, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, Zi-He WU, Yen-Po CHEN, Tzu Chun LIN
  • Patent number: 11989005
    Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: May 21, 2024
    Assignee: MediaTek Inc.
    Inventors: Bo-Jr Huang, Jia-Wei Fang, Jia-Ming Chen, Ya-Ting Chang, Chien-Yuan Lai, Cheng-Yuh Wu, Yi-Pin Lin, Wen-Wen Hsieh, Min-Shu Wang
  • Publication number: 20240139262
    Abstract: The present disclosure relates to a complex probiotic composition and a method for improving exercise performance of a subject with low intrinsic aerobic exercise capacity. The complex probiotic composition, which includes Lactobacillus rhamnosus GKLC1, Bifidobacterium lactis GKK24 and Clostridium butyricum GKB7, administered to the subject with the low intrinsic aerobic exercise capacity in a continuation period, can effectively reduce serum lactic acid and serum urea nitrogen after aerobic exercise, reduce proportion of offal fat and/or increase liver and muscle glycogen contents, thereby being as an effective ingredient for preparation of various compositions.
    Type: Application
    Filed: October 13, 2023
    Publication date: May 2, 2024
    Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, You-Shan TSAI, Zi-He WU
  • Publication number: 20240045411
    Abstract: Various embodiments of the teachings herein include anomaly detection methods for a dynamic control system. An example method includes: using a g network to initialize a hidden state distribution of the system; receiving a measurement value of a sensor and a state value of a trigger at a current point of time; receiving a sampling point into an f network to perform a prediction to obtain a second sampling point; using an h network to map the second sampling point into a sensor measurement value space to perform a prediction to obtain a probability distribution of a measurement value of the sensor in the dynamic control system at the current point of time; and determining whether an anomaly exists in the dynamic control system by comparing the measurement value obtained from real-time monitoring and the probability distribution obtained from a prediction.
    Type: Application
    Filed: December 27, 2021
    Publication date: February 8, 2024
    Applicant: Siemens Aktiengesellschaft
    Inventors: Cheng Feng, Fan Wang, Cong Chao Li, Jia Wen Chen, Peng Wei Tian
  • Patent number: 11144097
    Abstract: An all-in-one computer including a main body and an electronic assembly is provided. The main body includes a first casing part and a second casing part. The second casing part is movably connected to the first casing part and configured to move between a first position and a second position in relative to the first casing part, and the first casing part has an engaging portion and an electrical connection portion. The electronic assembly is disposed in the second casing part. When the second casing part is located at the first position, the second casing part is engaged with the engaging portion and the electronic assembly is connected to the electrical connection portion, and when the second casing part is located at the second position, the second casing part is departed from the engaging portion and the electronic assembly is departed from the electrical connection portion.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: October 12, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Zung-Ting Hu, Wen-Hsien Chin, Hsuan-Liang Lin, Yen-Kang Chen, Jia-Wen Chen, Cheng-Min Chen, Tze-Chiang Cheng
  • Patent number: 11144089
    Abstract: An electronic device including a main body, a frame and a display is provided. The frame is pivotally connected to the main body. The display is detachably assembled to the frame and configured to rotate between a first state and a second state in relative to the main body with the frame. When the display is rotated in relative to the main body to the first state, the display closes the main body. When the display is rotated in relative to the main body to the second state, the display is departed from the main body, so as to be detached from the main body and the frame.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: October 12, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Zung-Ting Hu, Hsuan-Liang Lin, Wen-Hsien Chin, Yen-Kang Chen, Jia-Wen Chen, Cheng-Min Chen, Tze-Chiang Cheng
  • Publication number: 20210303030
    Abstract: An all-in-one computer including a main body and an electronic assembly is provided. The main body includes a first casing part and a second casing part. The second casing part is movably connected to the first casing part and configured to move between a first position and a second position in relative to the first casing part, and the first casing part has an engaging portion and an electrical connection portion. The electronic assembly is disposed in the second casing part. When the second casing part is located at the first position, the second casing part is engaged with the engaging portion and the electronic assembly is connected to the electrical connection portion, and when the second casing part is located at the second position, the second casing part is departed from the engaging portion and the electronic assembly is departed from the electrical connection portion.
    Type: Application
    Filed: June 11, 2020
    Publication date: September 30, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Zung-Ting Hu, Wen-Hsien Chin, Hsuan-Liang Lin, Yen-Kang Chen, Jia-Wen Chen, Cheng-Min Chen, Tze-Chiang Cheng
  • Publication number: 20210303022
    Abstract: An electronic device including a main body, a frame and a display is provided. The frame is pivotally connected to the main body. The display is detachably assembled to the frame and configured to rotate between a first state and a second state in relative to the main body with the frame. When the display is rotated in relative to the main body to the first state, the display closes the main body. When the display is rotated in relative to the main body to the second state, the display is departed from the main body, so as to be detached from the main body and the frame.
    Type: Application
    Filed: June 18, 2020
    Publication date: September 30, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Zung-Ting Hu, Hsuan-Liang Lin, Wen-Hsien Chin, Yen-Kang Chen, Jia-Wen Chen, Cheng-Min Chen, Tze-Chiang Cheng
  • Patent number: 7964420
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: June 21, 2011
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Ping-Chou Yang, Jia-Wen Chen
  • Patent number: 7876593
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: January 25, 2011
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Ping-Chou Yang, Jia-Wen Chen
  • Publication number: 20110003409
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Application
    Filed: September 7, 2010
    Publication date: January 6, 2011
    Applicant: HARVATEK CORPORATION
    Inventors: BILY WANG, PING-CHOU YANG, JIA-WEN CHEN
  • Publication number: 20090316315
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Application
    Filed: October 1, 2008
    Publication date: December 24, 2009
    Applicant: HARVATEK CORPORATION
    Inventors: BILY WANG, PING-CHOU YANG, JIA-WEN CHEN
  • Patent number: 6336931
    Abstract: An automatic bone drilling apparatus for surgery operation uses a computer to control a hand tool drilling device to drill opening in skeleton. The computer has a fuzzy logic software to control the hand tool operation through a control box and a manual-automatic mode switch box. The hand tool drilling device may be securely mounted on the patient. Drilling location and size and depth may be precisely controlled to enhance surgical operation safety. It is particularly useful for drilling patient skeleton for brain surgery operation.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: January 8, 2002
    Inventors: Yeh-Liang Hsu, Shih-Tseng Lee, Chong-Fai Wang, Jia-Wen Chen, Hao-Wei Lin, Tsung-Cheng Huang
  • Patent number: D595674
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: July 7, 2009
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Chao-Yuan Huang, Ping-Chou Yang, Jia-Wen Chen, Hsiu-Wen Wang
  • Patent number: D595675
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: July 7, 2009
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Chao-Yuan Huang, Ping-Chou Yang, Jia-Wen Chen, Hsiu-Wen Wang