Patents by Inventor JIA YAN GO
JIA YAN GO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230337406Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.Type: ApplicationFiled: December 23, 2020Publication date: October 19, 2023Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
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Publication number: 20230108868Abstract: Methods, apparatus, systems, and articles of manufacture to increase rigidity of printed circuit boards are disclosed. An apparatus includes a stack of insulative layers. The stack includes a first face and a second face opposite the first face. The apparatus further includes a plurality of conductive layers. Ones of the conductive layers between adjacent ones of the insulative layers. The apparatus also includes a metal stiffener extending along a perimeter of a first one of the insulative layers. The metal stiffener has a thickness measured in a direction perpendicular to the first face. The thickness is less than a distance between the first and second faces.Type: ApplicationFiled: November 30, 2022Publication date: April 6, 2023Inventors: Jia Yan Go, Tin Poay Chuah, Juha Paavola, Twan Sing Loo, Sami Heinisuo, Kari Mansukoski
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Patent number: 11133261Abstract: An electronic device may be a first package. The first package may include a first substrate having a first mounting surface. A first die may be coupled to the first mounting surface. A first interconnect region may be laterally spaced from the first die. The first package may be interconnected with a second package. The second package may include a second die coupled to a second mounting surface. Interconnection of the first package with the second package may establish one or more electrical communication pathways between the first package and the second package. The interconnection of the first package with the second package may interconnect the first die with the second die such that the first die and second die are in communication only through the one or more electrical communication pathways.Type: GrantFiled: December 18, 2017Date of Patent: September 28, 2021Assignee: Intel CorporationInventors: Eng Huat Goh, Min Suet Lim, Chee Kheong Yoon, Jia Yan Go
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Patent number: 11006514Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer mounted on a motherboard. The semiconductor package also includes a hole in motherboard (HiMB) that is formed in the motherboard. The semiconductor package has one or more capacitors mounted on an electrical shield. The electrical shield may be embedded in the HiMB of the motherboard. Accordingly, the semiconductor package has capacitors vertically embedded between the electrical shield and the HiMB of the motherboard. The semiconductor package may also have one or more HiMB sidewalls formed on the HiMB, where each of the one or more HiMB sidewalls includes at least one or more plated through holes (PTHs) with an exposed layer. The PTHs may be electrically coupled to the capacitors as the capacitors are vertically embedded between the electrical shield sidewalls and the HiMB sidewalls (i.e., three-dimensional (3D) capacitors).Type: GrantFiled: March 30, 2017Date of Patent: May 11, 2021Assignee: Intel CorporationInventors: Jia Yan Go, Min Suet Lim, Tin Poay Chuah, Seok Ling Lim, Howe Yin Loo
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Patent number: 10856454Abstract: Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.Type: GrantFiled: August 8, 2019Date of Patent: December 1, 2020Assignee: Intel CorporationInventors: Min Suet Lim, Yew San Lim, Jia Yan Go, Tin Poay Chuah, Eng Huat Goh
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Publication number: 20190394871Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer mounted on a motherboard. The semiconductor package also includes a hole in motherboard (HiMB) that is formed in the motherboard. The semiconductor package has one or more capacitors mounted on an electrical shield. The electrical shield may be embedded in the HiMB of the motherboard. Accordingly, the semiconductor package has capacitors vertically embedded between the electrical shield and the HiMB of the motherboard. The semiconductor package may also have one or more HiMB sidewalls formed on the HiMB, where each of the one or more HiMB sidewalls includes at least one or more plated through holes (PTHs) with an exposed layer. The PTHs may be electrically coupled to the capacitors as the capacitors are vertically embedded between the electrical shield sidewalls and the HiMB sidewalls (i.e., three-dimensional (3D) capacitors).Type: ApplicationFiled: March 30, 2017Publication date: December 26, 2019Inventors: Jia Yan GO, Min Suet LIM, Tin Poay CHUAH, Seok Ling LIM, Howe Yin LOO
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Publication number: 20190364702Abstract: Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.Type: ApplicationFiled: August 8, 2019Publication date: November 28, 2019Inventors: Min Suet Lim, Yew San Lim, Jia Yan Go, Tin Poay Chuah, Eng Huat Goh
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Patent number: 10492299Abstract: The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.Type: GrantFiled: November 13, 2015Date of Patent: November 26, 2019Assignee: Intel CorporationInventors: Eng Huat Goh, Hoay Tien Teoh, Jia Yan Go, Jenny Shio Yin Ong
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Publication number: 20190103358Abstract: An electronic device may be a first package. The first package may include a first substrate having a first mounting surface. A first die may be coupled to the first mounting surface. A first interconnect region may be laterally spaced from the first die. The first package may be interconnected with a second package. The second package may include a second die coupled to a second mounting surface. Interconnection of the first package with the second package may establish one or more electrical communication pathways between the first package and the second package. The interconnection of the first package with the second package may interconnect the first die with the second die such that the first die and second die are in communication only through the one or more electrical communication pathways.Type: ApplicationFiled: December 18, 2017Publication date: April 4, 2019Inventors: Eng Huat Goh, Min Suet Lim, Chee Kheong Yoon, Jia Yan Go
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Patent number: 10163777Abstract: Interconnects for semiconductor packages are described. An apparatus may comprise a decoupling capacitor on a logic board, and a conductive interconnect element on the logic board, the conductive interconnect element to connect the decoupling capacitor on the logic board to a power conductor comprising a power pad of a semiconductor package, the conductive interconnect element at a different layer than a ground-potential layer of the logic board. Other embodiments are described and claimed.Type: GrantFiled: March 31, 2017Date of Patent: December 25, 2018Assignee: INTEL CORPORATIONInventors: Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go, Jiun Hann Sir, Min Suet Lim
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Publication number: 20180324951Abstract: The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.Type: ApplicationFiled: November 13, 2015Publication date: November 8, 2018Inventors: Penang Goh, Hoay Tien Teoh, Jia Yan Go, Jenny Shio Yin Ong
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Publication number: 20180286804Abstract: Interconnects for semiconductor packages are described. An apparatus may comprise a decoupling capacitor on a logic board, and a conductive interconnect element on the logic board, the conductive interconnect element to connect the decoupling capacitor on the logic board to a power conductor comprising a power pad of a semiconductor package, the conductive interconnect element at a different layer than a ground-potential layer of the logic board. Other embodiments are described and claimed.Type: ApplicationFiled: March 31, 2017Publication date: October 4, 2018Applicant: INTEL CORPORATIONInventors: SEOK LING LIM, ENG HUAT GOH, HOAY TIEN TEOH, JENNY SHIO YIN ONG, JIA YAN GO, JIUN HANN SIR, MIN SUET LIM