Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.

Abstract: An electronic device including a main body, a heat dissipation fan and at least one block is provided. The main body has a side shell and a bottom shell. The side shell has a first air inlet and a first air outlet. The heat dissipation fan is disposed in the main body and has at least one second air inlet and at least one second air outlet. The second air outlet is aligned to the first air outlet. The block is disposed in the main body to form a channel with the bottom shell and the dissipation fan. The channel is extended between the second air inlet and the first air inlet, so as to guide airflow to pass through the first air inlet and the second air inlet sequentially and enter the heat dissipation fan.

Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.

Abstract: The present invention relates to a method of controlling a heat-dissipating fan of a computer device, which is provided with a heat-dissipating fan, a controller, a first sensor unit, and a second sensor unit. The method of the present invention includes the following steps. First, the controller accepts a first signal and a second signal and controls the rotating speed of the heat-dissipating fan according to the first signal. Subsequently, the controller determines the first signal and the second signal. Next, the controller reduces the rotating speed of the heat-dissipating fan corresponding to the first signal to temporarily maintain the rotating speed at a constant to thereby reduce a noise value produced by the heat-dissipating fan.

Abstract: An electronic apparatus includes a casing, a separation structure, a fan, a first heat generating element and a heat conducting module. The casing has an air inlet and an air outlet. An inner portion of the casing includes first and second areas connected to the air inlet and the air outlet respectively. The separation structure is disposed at a border between the first and the second areas to separate the first and second areas. The fan is disposed in the first area adjacent to the air inlet and adapted to provide a heat dissipation airflow. The heat dissipation airflow flows through the air inlet, the first area, the second area and the air outlet sequentially. The first heat generating element is disposed in the second area. The heat conducting module is connected between the fan and the first heat generating element.

Abstract: An electronic device including a main body, a heat dissipation fan and at least one block is provided. The main body has a side shell and a bottom shell. The side shell has a first air inlet and a first air outlet. The heat dissipation fan is disposed in the main body and has at least one second air inlet and at least one second air outlet. The second air outlet is aligned to the first air outlet. The block is disposed in the main body to form a channel with the bottom shell and the dissipation fan. The channel is extended between the second air inlet and the first air inlet, so as to guide airflow to pass through the first air inlet and the second air inlet sequentially and enter the heat dissipation fan.

Abstract: The present invention relates to a method of controlling a heat-dissipating fan of a computer device, which is provided with a heat-dissipating fan, a controller, a first sensor unit, and a second sensor unit. The method of the present invention includes the following steps. First, the controller accepts a first signal and a second signal and controls the rotating speed of the heat-dissipating fan according to the first signal. Subsequently, the controller determines the first signal and the second signal. Next, the controller reduces the rotating speed of the heat-dissipating fan corresponding to the first signal to temporarily maintain the rotating speed at a constant to thereby reduce a noise value produced by the heat-dissipating fan.