Abstract: An optical cable fixture includes a base and a cover. The base defines a receiving groove penetrating opposite sides of the base. The receiving groove includes a first receiving portion and a second receiving portion. The first receiving portion receives an optical cable. The second receiving portion receives first optical fibers extending from the optical cable. The cover covers the base and fixes the optical cable and the first optical fibers.

Abstract: An optical cable fixture includes a base and a cover. The base defines a receiving groove penetrating opposite sides of the base. The receiving groove includes a first receiving portion and a second receiving portion. The first receiving portion receives an optical cable. The second receiving portion receives first optical fibers extending from the optical cable. The cover covers the base and fixes the optical cable and the first optical fibers.

Abstract: Methods for fabricating integrated circuits are disclosed. In an exemplary embodiment, a method for fabricating an integrated circuit includes forming a silicon material layer over a semiconductor substrate. The semiconductor substrate includes a logic device region and a memory array region. The memory array region has a memory device formed on the semiconductor substrate. The method further includes forming a capping layer over the silicon material layer and over the memory device and removing the capping layer from over the memory device in the memory array region using a first chemical mechanical polishing process while leaving at least a first portion of the capping layer in place over the logic device region. Further, the method includes removing the first the silicon material layer from over the memory device in the memory array region using a second chemical mechanical polishing process.

Abstract: Methods for fabricating integrated circuits are disclosed. In an exemplary embodiment, a method for fabricating an integrated circuit includes forming a silicon material layer over a semiconductor substrate. The semiconductor substrate includes a logic device region and a memory array region. The memory array region has a memory device formed on the semiconductor substrate. The method further includes forming a capping layer over the silicon material layer and over the memory device and removing the capping layer from over the memory device in the memory array region using a first chemical mechanical polishing process while leaving at least a first portion of the capping layer in place over the logic device region. Further, the method includes removing the first the silicon material layer from over the memory device in the memory array region using a second chemical mechanical polishing process.

Abstract: A flash memory device (100) includes a movable housing (1) defining a receiving cavity (15), a control board (2) having a circuit board (21) and a plug (22) connecting with the circuit board (21), an outer shield defining an opening (64), and a sleeve (3) movably ringed on one side of the movable housing (1) and enclosing the plug (22). The circuit board (21) is retained in the receiving cavity (15). The plug (22) extends out of the receiving cavity (15). The movable housing (1) is movably mounted in the outer shield. The movable housing (1) has an elastic section (141) with a button (18) coupled thereon. The button (18) pushes the plug (22) moving in or out of the sleeve (3) and the outer shield.

Abstract: A multiple criteria decision making method in which a plurality of basic criteria are assessed in order to generate an assessment on a general criterion is provided. An example of such a method can include the steps of: making an assessment of the ith basic criterion under a set of grades; and transforming the assessment to an assessment of the general criterion under the set of grades using a matrix equation.

Abstract: A flash memory device (100) includes a movable housing (1) defining a receiving cavity (15), a control board (2) having a circuit board (21) and a plug (22) connecting with the circuit board (21), an outer shield defining an opening (64), and a sleeve (3) movably ringed on one side of the movable housing (1) and enclosing the plug (22). The circuit board (21) is retained in the receiving cavity (15). The plug (22) extends out of the receiving cavity (15). The movable housing (1) is movably mounted in the outer shield. The movable housing (1) has an elastic section (141) with a button (18) coupled thereon. The button (18) pushes the plug (22) moving in or out of the sleeve (3) and the outer shield.

Abstract: There is disclosed a multiple criteria decision analysing method in which a plurality of basic criteria are assessed in order to a general criterion, including the steps of: making an assessment of the lth basic criteria under a set of grades; and transforming the assessment to an assessment of the general criterion under a set of grades using the matrix equation.

Abstract: There is disclosed a multiple criteria decision analysing method in which a plurality L of basic criteria are assessed in order to a general criterion, comprising the steps of: