Abstract: A tray feeding box includes a box body; a cover, arranged at a first end of the box body; and a bottom board, arranged at a second end of the box body away from the cover. The cover includes at least one first cover arranged at the first end of the box body. The at least one first cover is defined with a first opening. The box body is defined with a take-out gap communicated with the first opening.

Abstract: A camera module miniaturized in both width and length includes a baseplate, a lens assembly, and a bracket. The bracket includes a support plate and a support member disposed on the support plate. The support plate includes a first surface facing away from the baseplate and a second surface facing the baseplate. The support plate defines a first opening penetrating the first surface and the second surface. The lens assembly is disposed on the first surface and completely covers the first opening. The support member is located between the support plate and the baseplate. The support member includes a first support portion and a plurality of second support portions arranged at intervals, the first support portion is disposed on the second surface and surrounds the peripheral edge of the first opening. Each second support portion extends outwards from an outer surface of the first support portion.

Abstract: A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.

Abstract: A camera module includes a lens base, a lens group, and a switching mechanism. The lens base defines a through hole. The lens group is received within the through hole. The switching mechanism includes a switching base, an optical path conversion member, and a driving member. The switching base is mounted on the lens base and defines a light guide cavity communicating with the through hole. The switching base defines a front aperture and a rear aperture. The front aperture and the rear aperture communicate with the light guide cavity. The optical path conversion member includes a reflective surface. The driving member is mounted within the light guide cavity. The driving member drives the optical light conversion member to rotate to cause the reflective surface to reflect light entering through the front aperture or the rear aperture to the lens group.

Abstract: A lens module includes a lens holder, a filter, and a metal support. The lens holder includes a groove and sidewalls surrounding to form the groove. The metal support includes a support plate, heat dissipation plates, and heat transfer plates. At least one first mounting hole is formed on the sidewalls. The support plate comprises a support portion and a connecting portion connecting to each other. The connecting portion connects the support portion and each of the heat transfer plates. An opening is formed on the support portion and passes through the support portion. The filter is located on the support portion and covers the opening. The heat transfer plates are installed in the at least one first mounting hole. The support plate is received in the groove. The heat dissipation plates are located outside the lens holder. The disclosure also provides an electronic device having the lens module.

Abstract: A lens module includes a substrate, a base mounted on the substrate, a lens holder mounted on the base, and a lens mounted in the lens holder. The base is made of metal material by die casting, and an outer surface of the base is darkened by oxidation treatment. The disclosure also provides an electronic device having the lens module.

Abstract: A camera module includes a composite base, an optical lens arranged at a first side of the composite base; and a circuit board arranged at a second side of the composite base. The composite base includes a metal frame and a plastic frame. The metal frame includes a plurality of first metal strips connected end to end and at least one second metal strip corresponding extending from part of the plurality of first metal strips. The plastic frame includes a plurality of first plastic strips connected end to end and at least one second plastic strip extending from part of the plurality of first plastic strip. The first plastic strips are fixed to the first metal strips to form a top wall of the composite base, and the second plastic strips are connected to the second metal strips to form a side wall of the composite base.

Abstract: A lens holder with an air escape hole which cannot be fouled by adhesive includes a holder body and a lens barrel disposed on the holder body. The holder body includes a first surface away from the lens barrel and a second surface opposite to the first surface, the first surface defines a groove. The groove includes a first bottom surface, the first bottom surface defines a recess. The recess includes a second bottom surface, the second bottom surface defines an air escape hole. A cross-sectional size of the air escape hole is less than a cross-sectional size of the recess.

Abstract: A camera module with heat-dissipating structure includes a substrate, a cooling plate, a chip and a lens assembly. The substrate includes an upper surface, a lower surface opposite to the upper surface, and an opening. The opening penetrates the upper surface and the lower surface. The cooling plate is disposed on the lower surface and covered the opening. A portion of the cooling plate is exposed from the opening. A surface of the cooling plate facing away from the substrate forms a plurality of protrusions. The chip is disposed on the portion of the cooling plate exposed from the upper surface. The lens assembly is disposed on the upper surface and faces the chip. An electronic device using the module is also disclosed.

Abstract: A camera module includes a base, a circuit board bearing the base, and a metal plate bearing the circuit board and the base. The base includes a receiving portion and a bearing portion. The bearing portion surrounds the receiving portion. The bearing portion defines a cutout to receive an electronic component of the circuit board.

Abstract: A lens module includes a circuit board, a base mounted on the circuit board, and at least one electronic component mounted on the circuit board. The base comprises a first surface and a second surface facing away from the first surface. The second surface is mounted on the circuit board. The base further comprises at least one first hole passing through the first surface and the second surface. The at least one electronic component is received in the at least one first hole. The lens module further comprises a filling layer in each of the at least one first hole and located on a side of the at least one electronic component facing away from the circuit board. The disclosure also provides an electronic device having the lens module.

Abstract: A lens module with enhanced absorption of stray light includes a sensor and a mounting bracket. The sensor includes a photosensitive area and a non-photosensitive area arranged surrounding the photosensitive area. The sensor is received in the mounting bracket and a window is defined in the mounting bracket. An annular flange extends from an inner wall of the window towards a center axis of the window. The annular flange includes a reflecting surface facing away from the inner wall of the window and tilted towards the sensor. The photosensitive area is exposed in a through hole of the annular flange. Diffusing reflection structures are formed on the reflecting surface and are configured to diffuse light incident on the non-photosensitive area away from the photosensitive area.

Abstract: A single camera module able to swivel to capture images in front of and behind an electronic device includes a housing, a camera module, and a turnover element. The turnover element includes a support plate and a connecting portion. The housing is arranged on the support plate, thus forming a receiving space together with the support plate. The camera assembly is received in the receiving space. The connecting portion is arranged on the support plate and located on an outside of the housing. The disclosure further provides an electronic device including the camera module.

Abstract: A mechanism to render a lens module immune to trembling and jarring includes a carrier, a support element movably mounted on the carrier, and a driving element. The driving element includes a conductive structure arranged on the carrier, a plurality of positive pads on the carrier, and a plurality of shape memory alloy (SMA) wires. The SMA wires are electrically connected to the positive pads and the conductive structure. When currents flow into the SMA wires via the positive pads, the SMA wires deform upon heating and pull on the conductive structure, thus the conductive structure drives the support element to rotate in a plane parallel to the carrier. A lens module and an electronic device including the mechanism are also disclosed.

Abstract: A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.

Abstract: A camera module includes a composite base, an optical lens arranged at a first side of the composite base; and a circuit board arranged at a second side of the composite base. The composite base includes a metal frame and a plastic frame. The metal frame includes a plurality of first metal strips connected end to end and at least one second metal strip corresponding extending from part of the plurality of first metal strips. The plastic frame includes a plurality of first plastic strips connected end to end and at least one second plastic strip extending from part of the plurality of first plastic strip. The first plastic strips are fixed to the first metal strips to form a top wall of the composite base, and the second plastic strips are connected to the second metal strips to form a side wall of the composite base.

Abstract: A single camera module able to swivel to capture images in front of and behind an electronic device includes a housing, a camera module, and a turnover element. The turnover element includes a support plate and a connecting portion. The housing is arranged on the support plate, thus forming a receiving space together with the support plate. The camera assembly is received in the receiving space. The connecting portion is arranged on the support plate and located on an outside of the housing. The disclosure further provides an electronic device including the camera module.

Abstract: A robust lens module of reduced size includes an optical filter and a mounting bracket assembly. The mounting bracket assembly includes a first mounting frame and a second mounting frame. The first mounting frame is made of resin and includes side portions defining a receiving space. The second mounting frame includes a black oxidized metal sheet. The second mounting frame is divided into a first connecting ring, a second connecting ring, and a supporting ring. The first connecting ring is fixed on the side portions, the second connecting ring is connected to an inner side of the first connecting ring and protrudes into the receiving space, the supporting ring is connected to a side of the second connecting ring facing away from the first connecting ring. A device utilizing the lens module is also disclosed.

Abstract: A lens module includes a base and a filter. The base includes a through hole and a first thread. The through hole is surrounded by an inner surface of the base. The first thread is formed on the inner surface. The filter includes a sidewall and a second thread forming on the sidewall. The filter is received in the through hole, the second thread is engaged with the first thread. The disclosure also provides an electronic device having the lens module.

Abstract: A lens module includes a circuit board, a photosensitive chip, a filter, and a lens unit. The photosensitive chip is fixed on one surface of the circuit board. The filter faces the photosensitive chip. The lens unit includes a lens holder and a lens. The lens faces the filter. The lens holder is adhered to the circuit board and covers the photosensitive chip and the filter. The filter is fixed to an inner wall of a receiving hole defined in the lens holder.