Abstract: A header for opto-electronic applications is provided. The header includes a header base with a back face, a front face, and opening that extends from the back face through the base to the front face. The opening accommodates an electrically isolated pin through the opening. A pedestal is arranged at the front face and is below a center of the opening. The pedestal has a mounting face and a free face, which opposes the mounting face. The pedestal further includes an upper surface for mounting and carrying a pedestal submount. The mounting face is fixedly attached to the front face with an electrically conductive material that is at least partially arranged between the front face and the mounting face. An electrically isolating material is arranged in the opening between the base and the pin to electrically isolate the pin from the base.

Abstract: A header for an electronic component is provided. The header includes a base, a pedestal, and a submount. The base has a feedthrough with a feedthrough pin extending through the base and being electrically insulated from the base. The pedestal is connected to the base. The submount is connected to the pedestal. The pedestal is joined to the base via a pedestal substance-to-substance bond.

Abstract: A header for electronic components is provided. The header has a base with at least two electrical feedthroughs each having a feedthrough pin extending through the base and being electrically isolated to the base within the feedthrough. The further includes at least one pedestal connected to the base and two submounts. Each submount includes a carrier with a structured conductor plating that has at least two conductor traces with one of the conductor traces of each submount being electrically connected to one of the feedthrough pins. The submounts are equally formed but mounted in different orientations.