Patents by Inventor Jian-Shian Chen
Jian-Shian Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230275126Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an epitaxial structure over a substrate and a cap element over the epitaxial structure. The cap element has a first thickness measured between a top surface of the cap element and a top surface of the epitaxial structure. The cap element has a second thickness measured between a side surface of the cap element and a side surface of the epitaxial structure. The first thickness and the second thickness are different from each other.Type: ApplicationFiled: May 10, 2023Publication date: August 31, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shing-Huang WU, Jian-Shian CHEN
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Patent number: 11688769Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a source/drain structure adjacent to the gate stack. The semiconductor device structure also includes a cap element over the source/drain structure. The cap element has a first top plane, and the source/drain structure has a second top plane. The first top plane of the cap element is wider than the second top plane of the source/drain structure. A surface orientation of the first top plane of the cap element and a surface orientation of a side surface of the cap element are different from each other. The surface orientation of the first top plane of the cap element is {311}.Type: GrantFiled: October 26, 2020Date of Patent: June 27, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shing-Huang Wu, Jian-Shian Chen
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Publication number: 20220406917Abstract: A semiconductor device with different isolation structures and a method of fabricating the same are disclosed. The a method includes forming first and second fin structures on a substrate, forming a dummy fin structure on the substrate and between the first and second fin structures, forming a polysilicon structure on the dummy fin structure, forming source/drain regions on the first and second fin structures, and replacing the polysilicon structure with a dummy gate structure. A top portion of the dummy gate structure is formed wider than a bottom portion of the dummy gate structure.Type: ApplicationFiled: May 6, 2022Publication date: December 22, 2022Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jian-Shian CHEN, Ru-Shang HSIAO
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Publication number: 20210043732Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a source/drain structure adjacent to the gate stack. The semiconductor device structure also includes a cap element over the source/drain structure. The cap element has a first top plane, and the source/drain structure has a second top plane. The first top plane of the cap element is wider than the second top plane of the source/drain structure. A surface orientation of the first top plane of the cap element and a surface orientation of a side surface of the cap element are different from each other. The surface orientation of the first top plane of the cap element is {311}.Type: ApplicationFiled: October 26, 2020Publication date: February 11, 2021Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shing-Huang WU, Jian-Shian CHEN
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Patent number: 10818752Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a source/drain structure adjacent to the gate stack. The semiconductor device structure also includes a cap element over the source/drain structure. The cap element has a first top plane and the source/drain structure has a second top plane. The first top plane of the cap element is wider than the second top plane of the source/drain structure. A surface orientation of the first top plane of the cap element and a surface orientation of a side surface of the cap element are different from each other.Type: GrantFiled: December 21, 2018Date of Patent: October 27, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shing-Huang Wu, Jian-Shian Chen
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Publication number: 20190115429Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a source/drain structure adjacent to the gate stack. The semiconductor device structure also includes a cap element over the source/drain structure. The cap element has a first top plane and the source/drain structure has a second top plane. The first top plane of the cap element is wider than the second top plane of the source/drain structure. A surface orientation of the first top plane of the cap element and a surface orientation of a side surface of the cap element are different from each other.Type: ApplicationFiled: December 21, 2018Publication date: April 18, 2019Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shing-Huang WU, Jian-Shian CHEN
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Patent number: 10164013Abstract: Formation methods of a semiconductor device structure are provided. The method includes forming a gate stack over a semiconductor substrate and forming a source/drain structure adjacent to the gate stack. The method also includes forming a cap element over the source/drain structure. The cap element has a top surface and a side surface, and a width ratio of the top surface to the side surface of the cap element is in a range from about 0.125 to about 1.Type: GrantFiled: August 29, 2016Date of Patent: December 25, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shing-Huang Wu, Jian-Shian Chen
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Publication number: 20160372549Abstract: Formation methods of a semiconductor device structure are provided. The method includes forming a gate stack over a semiconductor substrate and forming a source/drain structure adjacent to the gate stack. The method also includes forming a cap element over the source/drain structure. The cap element has a top surface and a side surface, and a width ratio of the top surface to the side surface of the cap element is in a range from about 0.125 to about 1.Type: ApplicationFiled: August 29, 2016Publication date: December 22, 2016Applicant: Taiwan Semiconductor Manufacturing Co., LtdInventors: Shing-Huang WU, Jian-Shian CHEN
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Publication number: 20160276481Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a source/drain structure adjacent to the gate stack. The semiconductor device structure also includes a cap element over the source/drain structure. The cap element has a top surface and a side surface. A width ratio of the top surface to the side surface of the cap element is in a range from about 0.125 to about 1.Type: ApplicationFiled: March 16, 2015Publication date: September 22, 2016Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Shing-Huang WU, Jian-Shian CHEN
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Patent number: 9431536Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a source/drain structure adjacent to the gate stack. The semiconductor device structure also includes a cap element over the source/drain structure. The cap element has a top surface and a side surface. A width ratio of the top surface to the side surface of the cap element is in a range from about 0.125 to about 1.Type: GrantFiled: March 16, 2015Date of Patent: August 30, 2016Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shing-Huang Wu, Jian-Shian Chen