Abstract: A memory device includes a transistor, an anti-fuse element, a source/drain contact, a first gate via, and a second gate via. The transistor is over a substrate. The anti-fuse element is over the substrate and is connected to the transistor in series. The source/drain contact is connected to a source/drain region of the transistor. The first gate via is connected to a first gate structure of the transistor. The first gate structure of the transistor extends along a first direction in a top view. The second gate via is connected to a second gate structure of the anti-fuse element. The second gate via is between the first gate via and the source/drain contact along the first direction in the top view.

Abstract: A magnesium alloy is disclosed. The magnesium alloy includes magnesium (Mg), 6-12 wt % of lithium (Li) and 1-10 wt % of aluminum (Al). A temperature range between a solidus and a liquidus of the magnesium alloy is equal to or larger than 50° C.

Abstract: The present invention is related to a manufacturing process for highly ductile magnesium alloy, which is processable under plasticization at ambient temperature. The process includes melting in vacuum melt furnace or inert gas protected furnace, teeming into ingot, extrusion or rolling into finished material. Such highly ductile magnesium alloy has extremely excellent plastic deformability at ambient temperature and improves completely the deficiency associated with traditional commercial magnesium alloy that lacks plastic deformability at ambient temperature. The material is suitable for the structural components in automobiles, 3C products, appliances and office automation products.

Abstract: The present invention is related to a manufacturing process for highly ductile magnesium alloy, which is processable under plasticization at ambient temperature. The process includes melting in vacuum melt furnace or inert gas protected furnace, teeming into ingot, extrusion or rolling into finished material. Such highly ductile magnesium alloy has extremely excellent plastic deformability at ambient temperature and improves completely the deficiency associated with traditional commercial magnesium alloy that lacks plastic deformability at ambient temperature. The material is suitable for the structural components in automobiles, 3C products, appliances and office automation products.