Patents by Inventor Jianfen Cai

Jianfen Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH THERMALLY CONDUCTIVE LOW PRESSURE MOULDABLE HOTMELT
    Publication number: 20180094171
    Abstract: The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof. The adhesive composition of the present invention comprise at least one (co)polymer binder and at least one filler, as defined herein. The thermally conductive hotmelt adhesive composition according to the present invention is also intended to encapsulate heat generating devices such as printed circuit boards to provide better heat dissipation.
    Type: Application
    Filed: December 4, 2017
    Publication date: April 5, 2018
    Inventors: David BRIERS, Gunther Dreezen, Jianfen Cai, Callum Poole, Anthony Chapman, Dale R. Starkey