Abstract: An abrasive tool including a bonded abrasive article including a bond material comprising a metal or metal alloy, abrasive grains contained within the bond material, and a reaction agent dispersed within the bond material, wherein the reaction agent chemically reacting with a surface of the workpiece during abrasion to form a reaction product.

Abstract: A high-speed fully differential clock duty cycle calibration circuit applied to calibrating the clock duty cycle in a high-speed system. The circuit detects the duty cycle with a continuous time integrator, and directly adjusts the duty cycle on a clock transmission link so as to increase the working speed. Being of a fully differential circuit structure, the circuit can calibrate the duty cycle under a designated process within a higher and wider frequency range, and has relatively good constraining force for process mismatch and common mode noise. The circuit comprises adjustment level ADJ1 and ADJ2, a first buffer level BUF1, a second buffer level BUF2 and a duty cycle detection level DCD.

Abstract: A stochastic time-digital converter (STDC) including an input switching circuit, an STDC array, and an encoder. A clock circuit inputs two clock signals into two input terminals of the input switching circuit; the input switching circuit transmits the two clock signals in a cyclic cross-transposition form to two input terminals of the STDC array, and simultaneously outputs a trigger control signal to the encoder; each comparator in the STDC array independently judges the speeds of the two clock signals and sends the judgement results to the encoder for collection and processing; and the encoder outputs the size and positivity or negativity of the phase difference of the two clock signals. The technical solution utilizes the stochastic characteristic of the STDC to double the number of the equivalent comparators in the STDC array, eliminating the effects on the circuitry of device mismatching and processes, power supply voltage, and temperature.

Abstract: A return-type current-reuse mixer having a transconductance/amplification stage, a mixing stage, and a high-pass and a low-pass filter network. The transconductance/amplification stage has a current-reuse CMOS topology wherein an input frequency signal is converted into a frequency current, low-frequency components are removed from the frequency current by the high-pass filter network, the frequency current is fed into the mixing stage, modulation occurs in the mixing stage, and then an intermediate-frequency signal is generated and output. Once high-frequency components are removed from the intermediate-frequency signal by the low-pass filter network, the intermediate-frequency signal is sent again for input into the transconductance/amplification stage, then amplified in the transconductance/amplification stage and output. The mixer transconductance/amplification stage employs a current-reuse technique.

Abstract: Embodiments may generate a population of candidate rules including multiple rule conditions for detecting duplicates, each duplicate representing different sets of item description information that describe a common item. For each candidate rule of the population, embodiments may apply that rule to a reference data set including known duplicates and non-duplicates. Embodiments may assign each candidate rule a fitness score generated with a fitness function based on the performance of that candidate rule. Embodiments may, based on the fitness scores, select a subset of the population of candidate rules as parents for the new generation of candidate rules. Embodiments may perform crossover and/or mutation operations on the parent candidate rules to generate the new generation of candidate rules. Embodiments may select from the new generation of candidate rules (or from subsequent generations of candidate rules), rules for inclusion within a rule set for detecting duplicates within item description information.

Abstract: A transconductance-enhancing passive frequency mixer comprises a transconductance amplification stage, a frequency mixing stage, and an output transresistance amplifier. The transconductance amplification stage has a pre-amplification transconductance-enhancing structure, so that the transconductance is greatly enhanced, thereby obtaining the same transconductance value at a lower bias current. A radio-frequency current is modulated by the frequency mixing stage to generate an output mid-frequency current signal. The mid-frequency current signal passes through the transresistance amplifier, to form voltage output, and finally obtain a mid-frequency voltage signal. The transresistance amplifier has a transconductance-enhancing structure, thereby further reducing input impedance, and improving current utilization efficiency and port isolation. The frequency mixer has the characteristics of low power consumption, high conversion gain, good port isolation, and the like.

Abstract: A method of forming an abrasive article includes forming a mixture comprising a liquid carrier and a glass precursor material, wherein the glass precursor material comprises a material selected from the group of materials consisting of a hydrated metal compound, an organic silicate compound, or a combination thereof. The method further includes providing abrasive grains within the mixture, forming the mixture into a green ceramic body, and heating the green ceramic body to form a bonded abrasive article comprising the abrasive grains contained within a bond matrix, wherein the bond matrix comprises an amorphous phase formed from the glass precursor material.

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: A CMP pad conditioner is provided that includes a substrate having a surface and three dimensional structures protruding relative to the surface of the substrate. The three dimensional structures include CVD carbon-containing material selected from the group consisting of carbon nanotubes and diamond, and may be arranged in a ordered array or desired pattern. The CMP pad conditioner also includes a bonding layer overlying the three dimensional structures and the surface of the substrate. The condition may include a reinforcing layer disposed within gaps between the three dimensional structures. Techniques for manufacture and use are also disclosed.

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

Abstract: A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate.

Abstract: An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 ?m/m-° C. to about 5.0 ?m/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.

Abstract: A CMP pad conditioner is provided that includes a substrate having a surface and three dimensional structures protruding relative to the surface of the substrate. The three dimensional structures include CVD carbon-containing material selected from the group consisting of carbon nanotubes and diamond, and may be arranged in a ordered array or desired pattern. The CMP pad conditioner also includes a bonding layer overlying the three dimensional structures and the surface of the substrate. The condition may include a reinforcing layer disposed within gaps between the three dimensional structures. Techniques for manufacture and use are also disclosed.

Abstract: An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: An abrasive tool including a bonded abrasive article including a bond material comprising a metal or metal alloy, abrasive grains contained within the bond material, and a reaction agent dispersed within the bond material, wherein the reaction agent chemically reacting with a surface of the workpiece during abrasion to form a reaction product.

Abstract: A method of forming an abrasive article includes forming a mixture comprising a liquid carrier and a glass precursor material, wherein the glass precursor material comprises a material selected from the group of materials consisting of a hydrated metal compound, an organic silicate compound, or a combination thereof. The method further includes providing abrasive grains within the mixture, forming the mixture into a green ceramic body, and heating the green ceramic body to form a bonded abrasive article comprising the abrasive grains contained within a bond matrix, wherein the bond matrix comprises an amorphous phase formed from the glass precursor material.

Abstract: A CMP pad conditioner including a substrate having a transparency window represented by an average internal transmittance of not less than about 90% over a wavelength range extending from about 400 nm to about 500 nm along a path length extending through the substrate of not less than about 10 mm a bonding layer overlying a surface of the substrate, and abrasive grains contained within the bonding layer.