Abstract: This invention is about a detection device based on the piezoelectric property of geological minerals. The device has a vibration detector for compressing geological minerals to generate charges, so as to detect vibration and a physiotherapy jacket for carrying out quantitative physiotherapy on a human body by detecting the amount of charges. The system has the advantages of: being simple in structure, comprising the vibration detector and the physiotherapy jacket, using the piezoelectric property of geological minerals such as quartz and tourmaline, so as to realize detection of environmental vibration indoors, underground or in the field, and improving the safety factor of geological exploration operations.

Abstract: This invention is about a detection device based on the piezoelectric property of geological minerals. The device has a vibration detector for compressing geological minerals to generate charges, so as to detect vibration and a physiotherapy jacket for carrying out quantitative physiotherapy on a human body by detecting the amount of charges. The system has the advantages of: being simple in structure, comprising the vibration detector and the physiotherapy jacket, using the piezoelectric property of geological minerals such as quartz and tourmaline, so as to realize detection of environmental vibration indoors, underground or in the field, and improving the safety factor of geological exploration operations.

Abstract: A FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped FPC to exert pressure thereon; the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the FPC. The FPC flattening jig heats the pressurization mechanism by a heating mechanism, and then the heated planar base surface of the pressurization mechanism contacts the warped FPC and exerts pressure thereon. Therefore, the FPC can be flattened. As such, the FPC can be reused, facilitating the improvement on the recycling rate of FPC.

Abstract: A maintenance fixture for PCB?A and an operating method thereof are disclosed to mitigate the problems that the PCB?A may be scrapped upon removing a conductive adhesive. The maintenance fixture includes a cover plate and a support baseplate which is configured to support a PCB?A and provided with a stopper unit; the cover plate is movably connected to the support baseplate at a first end to be rotatable towards and away from the support baseplate, and is provided with a barrier layer at a first side which is perpendicular to the rotation direction and close to the support baseplate; the barrier layer is configured to be contacted with the PCB?A upon the cover plate being rotated towards the support baseplate to cover an electronic component zone and expose an electrode zone of the PCB?A.

Abstract: The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.

Abstract: An embodiment of the present invention provides a jig for detaching a display assembly. The display assembly comprises: a fixing module configured to fix a backlight module in the display assembly; and an absorbing module configured to absorb a display panel in the display assembly such that the display panel and the backlight module are separated from each other by an external force.

Abstract: A film-attaching apparatus comprising a base, a substrate bearing member configured to bear a substrate and a film bearing member configured to bear a film; the film bearing member is rotatable between a closed position and an open position; the film bearing member at the closed position has a bearing surface in opposite to that of the substrate bearing member such that a first portion of the film is contacted with a first portion of the substrate; and the substrate bearing member is movable in translational motion along a direction of the bearing surface of the substrate bearing member upon the film bearing member being at the closed position such that the bearing surfaces of the substrate bearing member and of the film bearing member are movable with respect to each other to attach a second portion of the film onto a second portion of the substrate.

Abstract: A maintenance fixture for PCB?A and an operating method thereof are disclosed to mitigate the problems that the PCB?A may be scrapped upon removing a conductive adhesive. The maintenance fixture includes a cover plate and a support baseplate which is configured to support a PCB?A and provided with a stopper unit; the cover plate is movably connected to the support baseplate at a first end to be rotatable towards and away from the support baseplate, and is provided with a barrier layer at a first side which is perpendicular to the rotation direction and close to the support baseplate; the barrier layer is configured to be contacted with the PCB?A upon the cover plate being rotated towards the support baseplate to cover an electronic component zone and expose an electrode zone of the PCB?A.

Abstract: Disclosure provides a FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped FPC to exert pressure thereon; the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the FPC. The FPC flattening jig heats the pressurization mechanism by a heating mechanism, and then the heated planar base surface of the pressurization mechanism contacts the warped FPC and exerts pressure thereon. Therefore, the FPC can be flattened.

Abstract: The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.

Abstract: A film-attaching apparatus comprising a base, a substrate bearing member configured to bear a substrate and a film bearing member configured to bear a film; the film bearing member is rotatable between a closed position and an open position; the film bearing member at the closed position has a bearing surface in opposite to that of the substrate bearing member such that a first portion of the film is contacted with a first portion of the substrate; and the substrate bearing member is movable in translational motion along a direction of the bearing surface of the substrate bearing member upon the film bearing member being at the closed position such that the bearing surfaces of the substrate bearing member and of the film bearing member are movable with respect to each other to attach a second portion of the film onto a second portion of the substrate.

Abstract: An embodiment of the present invention provides a jig for detaching a display assembly. The display assembly comprises: a fixing module configured to fix a backlight module in the display assembly; and an absorbing module configured to absorb a display panel in the display assembly such that the display panel and the backlight module are separated from each other by an external force.