Abstract: A method of forming at least one layer on a substrate surface by vacuum deposition of particles onto the substrate surface, the method comprising the step of moving at least part of the substrate at high speed during vacuum deposition in a first direction parallel to the substrate surface. The method reduces the amount of macroparticles in a layer or layers deposited on the substrate, and controls the microstructure and crystallographic structure of the deposited layer or layers. Also disclosed are devices for performing the method, and resulting products, for example a hard disk thin film media.

Abstract: An oblique sputtering deposition apparatus is provided for preparing a thin film. A collimator having angled passages for filtering out particles from stray directions is placed between the substrate and the incident particle flux. The angle of the passages can be adjusted from about 0 to about 90° with respect to the substrate normal according to requirements. The oblique incidence of particle flux brings forms a column structure which is also angled.