Patents by Inventor Jiaqi Tang

Jiaqi Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for decapsulation of plastic integrated circuit packages
    Patent number: 11295968
    Abstract: System and method for decapsulation of plastic integrated circuit packages by providing a microwave generator, providing a Beenakker resonant cavity connected to the microwave generator, which cavity comprises a coupling antenna loop, providing the cavity with a tube or tubes for supply of plasma gas and etchant gas or gases and with means for igniting the plasma gas, and providing that the cavity is set at a predefined value of its Q factor by embodying the coupling antenna loop and/or a wire optionally attached to the coupling antenna loop in a metal or metal alloy, or providing that at least at part of its surface area the coupling antenna loop and/or the wire is coated with a metal or metal alloy different than copper and with a higher resistivity than copper.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: April 5, 2022
    Assignee: JIACO Instruments Holding B.V.
    Inventor: Jiaqi Tang
  • Decapsulation of electronic devices
    Patent number: 10879079
    Abstract: The invention is directed to a method for treating an electronic device that is encapsulated in a plastic package, said method comprising the steps of providing a gas stream comprising a hydrogen source; inducing a hydrogen-containing plasma stream from said gas; and directing the hydrogen-containing plasma stream to the plastic package to etch the plastic package.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: December 29, 2020
    Assignee: JIACO Instruments Holding B.V.
    Inventors: Jiaqi Tang, Cornelis Ignatius Maria Beenakker, Willibrordus Gerardus Maria Van Den Hoek
  • Decapsulation of Electronic Devices
    Publication number: 20200279749
    Abstract: The invention is directed to a method for treating an electronic device that is encapsulated in a plastic package, said method comprising the steps of providing a gas stream comprising a hydrogen source; inducing a hydrogen-containing plasma stream from said gas; and directing the hydrogen-containing plasma stream to the plastic package to etch the plastic package.
    Type: Application
    Filed: July 20, 2017
    Publication date: September 3, 2020
    Applicant: JIACO Instruments Holding B.V.
    Inventors: Jiaqi Tang, Cornelis Ignatius Maria Beenakker, Willibrordus Gerardus Maria Van Den Hoek
  • System and Method for Decapsulation of Plastic Integrated Circuit Packages
    Publication number: 20170365494
    Abstract: System and method for decapsulation of plastic integrated circuit packages by providing a microwave generator, providing a Beenakker resonant cavity connected to the microwave generator, which cavity comprises a coupling antenna loop, providing the cavity with a tube or tubes for supply of plasma gas and etchant gas or gases and with means for igniting the plasma gas, and providing that the cavity is set at a predefined value of its Q factor by embodying the coupling antenna loop and/or a wire optionally attached to the coupling antenna loop in a metal or metal alloy, or providing that at least at part of its surface area the coupling antenna loop and/or the wire is coated with a metal or metal alloy different than copper and with a higher resistivity than copper.
    Type: Application
    Filed: September 6, 2017
    Publication date: December 21, 2017
    Inventor: Jiaqi Tang