Abstract: The invention relates to a heatsink antenna array structure, which includes a fin-shaped metal heatsink, a metal bottom base of heatsink, and a substrate. The upper surface of substrate is connected with the metal bottom base of heatsink, the lower surface is connected with a chip. The chip works as heat source. There is a rectangular through-cavity array in the bottom base as radiation aperture. The substrate contains multiple metal layers and dielectric layers. The top metal layer has rectangular apertures corresponding to the rectangular through-cavity array in the bottom base. The dielectric layers contain metallic vias to construct a substrate integrated waveguide structure. The metallic vias effectively reduce the thermal resistance between the fin-shaped metal heatsink and the chip, and form the substrate integrated waveguide structure as the feeding network of heatsink antenna array.

Abstract: The invention relates to a heatsink antenna array structure, which includes a fin-shaped metal heatsink, a metal bottom base of heatsink, and a substrate. The upper surface of substrate is connected with the metal bottom base of heatsink, the lower surface is connected with a chip. The chip works as heat source. There is a rectangular through-cavity array in the bottom base as radiation aperture. The substrate contains multiple metal layers and dielectric layers. The top metal layer has rectangular apertures corresponding to the rectangular through-cavity array in the bottom base. The dielectric layers contain metallic vias to construct a substrate integrated waveguide structure. The metallic vias effectively reduce the thermal resistance between the fin-shaped metal heatsink and the chip, and form the substrate integrated waveguide structure as the feeding network of heatsink antenna array.