Patents by Inventor Jie Diao

Jie Diao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11673226
    Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: June 13, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
  • Publication number: 20190291238
    Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 26, 2019
    Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, JR., Wei-Cheng Lee, Jeonghoon Oh
  • Patent number: 10350728
    Abstract: Polishing pad cleaning systems and related methods are disclosed. A rotatable platen comprising a polishing pad in combination with a fluid, such as a polishing fluid, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system introduces a spray system to remove debris from the polishing pad to prevent substrate damage and improve efficiency, a waste removal system for removing used spray, used polishing fluid, and debris from the polishing pad, and a polishing fluid delivery system for providing fresh polishing fluid to the polishing pad, such that the substrate only receives fresh polishing fluid upon each complete rotation of the platen. In this manner, within die performance is enhanced, the range of certain CMP processes is improved, scratches and contamination are avoided for each polished substrate and for later-polished substrates, and platen temperatures are reduced.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: July 16, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Jie Diao, Erik S. Rondum, Thomas Ho Fai Li, Bum Jick Kim, Christopher Heung-Gyun Lee
  • Patent number: 10322492
    Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: June 18, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
  • Publication number: 20180139413
    Abstract: A virtual conference system that allows private sessions to happen simultaneously as and within the public conference is presented. The system allows a participant to join a public conference, wherein a degraded version of the participant's image and no sound from the participant will be available to other conference participants of the public conference. The participant may, while being in the public conference, engage in a private session with a subgroup of the conference participants. The participant's image and sounds from the participant will be available to the subgroup in the private session in normal quality at the same time that the degraded version of the participant's image is made available to conference participants who are in the public conference but not the private session.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 17, 2018
    Inventor: Jie DIAO
  • Publication number: 20180021918
    Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.
    Type: Application
    Filed: July 24, 2017
    Publication date: January 25, 2018
    Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
  • Patent number: 9800831
    Abstract: A method of executing a virtual conference among a plurality of nodes including a first node, wherein there is a display device associated with the first node that is configured to display a virtual conference window containing images of participants at other nodes of the plurality of nodes, is presented. The method entails activating the virtual conference window in response to receiving a selection in the virtual conference window, wherein the activating of the virtual conference window triggers a process of identifying one of the nodes as an attention recipient and displaying the attention recipient's image differently than images of other nodes. Where private chat function is available, attention recipient may be identified based on who the participant at the first node is chatting with. Images may be augmented to add an illusion of space and distance.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: October 24, 2017
    Inventor: Jie Diao
  • Patent number: 9538133
    Abstract: A system and a method for executing a virtual conference that conveys gaze information are presented. Where there are three nodes, input from the first node indicating a gaze recipient of a first participant is received, the gaze recipient being associated with one of the second and third nodes. A virtual space is constructed in which representations of the first participant, a second participant who is associated with the second node, and a third participant who is associated with the third node are positioned in a predetermined order. The gaze angle of the first participant in the virtual space is determined based on the position of the representation of the first participant's gaze recipient in the virtual space. An image that includes the first participant looking at his gaze recipient in the virtual space, as seen from the position of the second participant in the virtual space, is generated.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: January 3, 2017
    Inventor: Jie Diao
  • Publication number: 20160373691
    Abstract: A method of executing a virtual conference among a plurality of nodes including a first node, wherein there is a display device associated with the first node that is configured to display a virtual conference window containing images of participants at other nodes of the plurality of nodes, is presented. The method entails activating the virtual conference window in response to receiving a selection in the virtual conference window, wherein the activating of the virtual conference window triggers a process of identifying one of the nodes as an attention recipient and displaying the attention recipient's image differently than images of other nodes. Where private chat function is available, attention recipient may be identified based on who the participant at the first node is chatting with. Images may be augmented to add an illusion of space and distance.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 22, 2016
    Inventor: Jie DIAO
  • Publication number: 20160167195
    Abstract: Polishing pad cleaning systems and related methods are disclosed. A rotatable platen comprising a polishing pad in combination with a fluid, such as a polishing fluid, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system introduces a spray system to remove debris from the polishing pad to prevent substrate damage and improve efficiency, a waste removal system for removing used spray, used polishing fluid, and debris from the polishing pad, and a polishing fluid delivery system for providing fresh polishing fluid to the polishing pad, such that the substrate only receives fresh polishing fluid upon each complete rotation of the platen. In this manner, within die performance is enhanced, the range of certain CMP processes is improved, scratches and contamination are avoided for each polished substrate and for later-polished substrates, and platen temperatures are reduced.
    Type: Application
    Filed: October 21, 2015
    Publication date: June 16, 2016
    Inventors: Jie DIAO, Erik S. RONDUM, Thomas Ho Fai LI, Bum Jick KIM, Christopher Heung-Gyun LEE
  • Patent number: 9369667
    Abstract: A system and a method for executing a virtual conference are presented. The method includes providing, to each participant, images of the plurality of nodes, receiving an active node selection input from a first participant of the plurality of participants, the active node selection input indicating which of the plurality of nodes the first participant selects as an active node for communication, and modifying an image quality of the active node provided to the first participant, so that the active node has a first image quality that is different from a second image quality that is assigned to other nodes, wherein image quality includes parameters that affect the perceived clarity of an image. Also provided is a system and method for obtaining the image of a participant from a desired angle by guiding the participant's gaze to a selected region of the screen relative to a camera.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 14, 2016
    Inventor: Jie Diao
  • Publication number: 20130271560
    Abstract: A system and a method for executing a virtual conference are presented. The method includes providing, to each participant, images of the plurality of nodes, receiving an active node selection input from a first participant of the plurality of participants, the active node selection input indicating which of the plurality of nodes the first participant selects as an active node for communication, and modifying an image quality of the active node provided to the first participant, so that the active node has a first image quality that is different from a second image quality that is assigned to other nodes, wherein image quality includes parameters that affect the perceived clarity of an image. Also provided is a system and method for obtaining the image of a participant from a desired angle by guiding the participant's gaze to a selected region of the screen relative to a camera.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 17, 2013
    Inventor: Jie DIAO
  • Patent number: 8439723
    Abstract: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: May 14, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Robert A. Marks, Christopher Heung-Gyun Lee, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum
  • Publication number: 20130076853
    Abstract: A system and a method for executing a virtual conference that conveys gaze information are presented. Where there are three nodes, input from the first node indicating a gaze recipient of a first participant is received, the gaze recipient being associated with one of the second and third nodes. A virtual space is constructed in which representations of the first participant, a second participant who is associated with the second node, and a third participant who is associated with the third node are positioned in a predetermined order. The gaze angle of the first participant in the virtual space is determined based on the position of the representation of the first participant's gaze recipient in the virtual space. An image that includes the first participant looking at his gaze recipient in the virtual space, as seen from the position of the second participant in the virtual space, is generated.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Inventor: Jie DIAO
  • Patent number: 8211325
    Abstract: A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: July 3, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Jie Diao, Garlen C. Leung, Christopher Heung-Gyun Lee, Lakshmanan Karuppiah
  • Publication number: 20100285666
    Abstract: A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity.
    Type: Application
    Filed: April 9, 2010
    Publication date: November 11, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: JIE DIAO, Garlen C. Leung, Christopher Heung-Gyun Lee, Lakshmanan Karuppiah
  • Publication number: 20100035515
    Abstract: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.
    Type: Application
    Filed: August 11, 2008
    Publication date: February 11, 2010
    Inventors: Robert Marks, Christopher Heung-Gyun Lee, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum
  • Patent number: 7504018
    Abstract: A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: March 17, 2009
    Assignee: Applied Materials, Inc.
    Inventors: You Wang, Stan D. Tsai, Lakshmanan Karuppiah, Jie Diao, Renhe Jia, Alpay Yilmaz
  • Patent number: 7422982
    Abstract: A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: September 9, 2008
    Assignee: Applied Materials, Inc.
    Inventors: You Wang, Jie Diao, Stan D. Tsai, Lakshmanan Karuppiah
  • Patent number: 7344432
    Abstract: An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: March 18, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid A. Mavliev, Stan D. Tsai, You Wang, Jie Diao, Renhe Jia, Lakshmanan Karuppiah, Robert Ewald