Patents by Inventor Jieh-I Taur

Jieh-I Taur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier device for a thermal pad of an information handling system
    Patent number: 11832378
    Abstract: In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Jieh-I Taur, Bo-Wei Chu, Li-Chung Liu, Hui-Huan Chien
  • CARRIER DEVICE FOR A THERMAL PAD OF AN INFORMATION HANDLING SYSTEM
    Publication number: 20230143361
    Abstract: In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.
    Type: Application
    Filed: November 8, 2021
    Publication date: May 11, 2023
    Inventors: Jieh-I Taur, Bo-Wei Chu, Li-Chung Liu, Hui-Huan Chien