Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.

Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a non-ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The non-ventilated blade has a roughness between 5 ?m and 1.25 mm, or a specific surface area of the non-ventilated blade exceeds a geometric area of the non-ventilated blade by more than 10%.

Abstract: A wafer-measuring apparatus and a wafer-transferring method of the wafer-measuring apparatus. The wafer-measuring apparatus includes a body, a wafer-measuring unit, a wafer storage, and a robot. The robot is disposed on the body and configured to move a wafer from a first wafer container to the wafer-measuring unit. The first wafer container is disposed on a load port area. The robot moves the wafer from the wafer-measuring unit to the wafer storage after the wafer-measuring unit measures the wafer.

Abstract: A wafer handling apparatus includes at least one load port, an image capturing device and a processor. The load port is configured to receive a wafer carrier. The image capturing device is configured to capture an image of the wafer carrier received in the load port before one or more wafers are inserted into the wafer carrier. The processor is communicably connected to the image capturing device and is configured to determine whether the wafer carrier is in a condition that is unsafe for wafer placement based on the image captured by the image capturing device.

Abstract: A wafer handling apparatus includes at least one load port, an image capturing device and a processor. The load port is configured to receive a wafer carrier. The image capturing device is configured to capture an image of the wafer carrier received in the load port before one or more wafers are inserted into the wafer carrier. The processor is communicably connected to the image capturing device and is configured to determine whether the wafer carrier is in a condition that is unsafe for wafer placement based on the image captured by the image capturing device.

Abstract: The present disclosure provides a load port device, a gas gate and a gas-providing method. The load port device includes a gas-providing nozzle and the gas gate. The gas-providing nozzle is used for providing gas to a wafer container. The gas gate includes a plurality of gas inlet ports, a gas-providing port and a controller. Each gas inlet port connects to a gas source. The gas-providing port connects to the gas-providing nozzle. The controller is configured to: select one of the plurality of gas inlet ports; and connect the selected gas inlet port to the gas-providing port.

Abstract: A wafer carrier dry cleaner includes a receiver, a tool and a movable nozzle. The receiver includes a clean room. The clean room includes a port used to load a wafer carrier. The wafer carrier comprises a box and a door closing an opening of the box. The tool is located in the clean room and configured to separate the door from the box. The movable nozzle is located in the clean room. The movable nozzle is configured to purge clean gas towards the box and the door at a first position between the box and the door when the box and the door are separated.

Abstract: The present disclosure provides a dual-sided wafer imaging apparatus and methods thereof. The dual-sided wafer imaging apparatus includes one or more load ports, one or more mechanical arms for transporting a wafer, a wafer transfer stage, a first line scan camera mounted below the wafer transfer stage, a second line scan camera mounted above the wafer transfer stage, a first optical lens mounted on the first line scan camera, a second optical lens mounted on the second line scan camera, and line light sources respectively mounted below and above the wafer transfer stage. The load ports are configured for an automated load operation or unload operation of a wafer pod of an automated transport equipment. The wafer transfer stage includes vacuum suction points in contact with a backside of the wafer, and the wafer transfer stage further includes a drive motor producing a linear reciprocating motion for moving the wafer.

Abstract: The present disclosure provides a wafer-measuring apparatus and a wafer-transferring method of the wafer-measuring apparatus. The wafer-measuring apparatus includes a body, a wafer-measuring unit, a wafer storage and a robot. The robot is disposed on the body and configured to: move a wafer from a first wafer container to the wafer-measuring unit, wherein the first wafer container is disposed on a load port area; and move the wafer from the wafer-measuring unit to the wafer storage after the wafer-measuring unit measures the wafer.

Abstract: The present disclosure provides a load port device, a gas gate and a gas-providing method. The load port device includes a gas-providing nozzle and the gas gate. The gas-providing nozzle is used for providing gas to a wafer container. The gas gate includes a plurality of gas inlet ports, a gas-providing port and a controller. Each gas inlet port connects to a gas source. The gas-providing port connects to the gas-providing nozzle. The controller is configured to: select one of the plurality of gas inlet ports; and connect the selected gas inlet port to the gas-providing port.

Abstract: The present disclosure provides a dual-sided wafer imaging apparatus and methods thereof. The dual-sided wafer imaging apparatus includes one or more load ports, one or more mechanical arms for transporting a wafer, a wafer transfer stage, a first line scan camera mounted below the wafer transfer stage, a second line scan camera mounted above the wafer transfer stage, a first optical lens mounted on the first line scan camera, a second optical lens mounted on the second line scan camera, and line light sources respectively mounted below and above the wafer transfer stage. The load ports are configured for an automated load operation or unload operation of a wafer pod of an automated transport equipment. The wafer transfer stage includes vacuum suction points in contact with a backside of the wafer, and the wafer transfer stage further includes a drive motor producing a linear reciprocating motion for moving the wafer.

Abstract: The present disclosure provides an image processing system and method. The system includes an image capturing unit and an image processing unit. The image capturing unit includes a camera, a light source, and a wafer transfer stage. The camera captures an image of a wafer mark. The light source is capable of projecting through a plurality of chemical residues on the wafer mark. The image processing unit includes an image processor and an object matching subsystem. The image processor is configured to perform calculations of the image processing unit to generate an output result. The object matching subsystem includes an object matching unit and a memory unit. The object matching unit includes an artificial intelligence (AI) statistical model for identifying each character of the wafer mark. The memory unit stores a set of probabilities of the object matching unit detecting each character of the wafer mark in each image.