Patents by Inventor Jih-Jenn Huang

Jih-Jenn Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230090558
    Abstract: In some embodiments, a system for pre-wetting a filter includes a filter, a piping system, a first gas, a second gas, a first buffer tank, and a second buffer tank. The first gas drives the solvent to clean the filter. The two buffer tanks store the solvent discharged from the filter. The second gas selectively drives the solvent in the first buffer tank to return to the filter and then to be discharged into the second buffer tank. Alternatively, the second gas selectively drives the solvent in the second buffer tank to return to the filter and then to be discharged into the first buffer tank.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 23, 2023
    Inventors: Jui-Hsiung Hsu, Chi-Yi Lin, Yu-Liang Huang, Jih-Jenn Huang
  • Publication number: 20220301785
    Abstract: In this disclosure, antiferroelectric capacitors having one or more interfacial layer/antiferroelectric layer/interfacial layer stacked structures are proposed. The compressive chemical pressure of the proposed structure leads to a reduction of the hysteresis and thus a high ESD and a low energy loss. A provided antiferroelectric capacitor demonstrates a record-high ESD of 94 J/cm3 and a high efficiency of 80%, along with a high maximum power density of 5×1010 W/kg. The degradation of the energy storage performance as the film thickness increases is alleviated by the above multi-stacked structure, which presents a high ESD of 80 J/cm3 and efficiency of 82% with the thickness scaled up to 48 nm. This improvement is attributed to the enhancement of breakdown strength due to the barrier effect of interfaces on electrical treeing. Furthermore, the capacitors also exhibit an excellent endurance up to 1010 operation cycles.
    Type: Application
    Filed: January 25, 2022
    Publication date: September 22, 2022
    Inventors: Miin-Jang Chen, Sheng-Han Yi, Jih-Jenn Huang
  • Patent number: 11097299
    Abstract: A slurry spraying mask includes a holding portion and a mask portion. The holding portion includes a holding portion opening. The mask portion includes a first layer and a second layer. The first layer includes a first tapered structure, the second layer includes a second tapered structure. The first tapered structure and the second tapered structure are arranged coaxially. A gap exists between the first layer and the second layer. The apex of the first tapered structure includes a first aperture, the apex of the second tapered structure includes a second aperture, and the second aperture is overlapped with the first aperture. The apex of the second tapered structure passes through the holding portion opening such that the mask portion is localized to the holding portion.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 24, 2021
    Assignee: Hermes Epitek Corp.
    Inventors: Yung-Min Pai, Pao-Chi Chi, Jih-Jenn Huang
  • Publication number: 20190240691
    Abstract: A slurry spraying mask includes a holding portion and a mask portion. The holding portion includes a holding portion opening. The mask portion includes a first layer and a second layer. The first layer includes a first tapered structure, the second layer includes a second tapered structure. The first tapered structure and the second tapered structure are arranged coaxially. A gap exists between the first layer and the second layer. The apex of the first tapered structure includes a first aperture, the apex of the second tapered structure includes a second aperture, and the second aperture is overlapped with the first aperture. The apex of the second tapered structure passes through the holding portion opening such that the mask portion is localized to the holding portion.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 8, 2019
    Inventors: Yung-Min PAI, Pao-Chi CHI, Jih-Jenn HUANG
  • Patent number: 7592044
    Abstract: A method for manufacturing a patterned layer (106) on a substrate (100) includes the following steps: providing a substrate having a plurality of banks (102) formed thereon, the substrate and the banks cooperatively defining a plurality of accommodating spaces (104), wherein each of the accommodating spaces has a first edge (110) and a second edge (112) parallel to the first edge, a distance between the first edge and the second edge is b; the first nozzle (302) moving along a first path (306), and the first path is parallel to the first edge, a distance between the first path and the first edge is a; the first nozzle jetting ink into the accommodating space; the second nozzle (304) moving along a second path (310), a distance between the first path and the second path is c, and the distance c satisfies one of the two equations: 0<c<b?a, and 0<c<a.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: September 22, 2009
    Assignee: ICF Technology Limited
    Inventors: Ching-Yu Chou, Yu-Ning Wang, Jih-Jenn Huang, Yi-Ming Liao
  • Publication number: 20080259106
    Abstract: A method for manufacturing a patterned layer (106) on a substrate (100) includes the following steps: providing a substrate having a plurality of banks (102) formed thereon, the substrate and the banks cooperatively defining a plurality of accommodating spaces (104), wherein each of the accommodating spaces has a first edge (110) and a second edge (112) parallel to the first edge, a distance between the first edge and the second edge is b; the first nozzle (302) moving along a first path (306), and the first path is parallel to the first edge, a distance between the first path and the first edge is a; the first nozzle jetting ink into the accommodating space; the second nozzle (304) moving along a second path (310), a distance between the first path and the second path is c, and the distance c satisfies one of the two equations: 0<c<b?a, and 0<c<a.
    Type: Application
    Filed: December 26, 2007
    Publication date: October 23, 2008
    Applicant: ICF TECHNOLOGY LIMITED
    Inventors: CHING-YU CHOU, YU-NING WANG, JIH-JENN HUANG, YI-MING LIAO