Patents by Inventor Jijen Vazhaeparambil

Jijen Vazhaeparambil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TDI sensor in a darkfield system
    Patent number: 9891177
    Abstract: A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: February 13, 2018
    Assignee: KLA-Tencor Corporation
    Inventors: Jijen Vazhaeparambil, Guoheng Zhao, Daniel Kavaldjiev, Anatoly Romanovsky, Ivan Maleev, Christian Wolters, Stephen Biellak, Bret Whiteside, Donald Pettibone, Yung-Ho Alex Chuang, David W. Shortt
  • Laser with integrated multi line or scanning beam capability
    Patent number: 9678350
    Abstract: A method and system for providing illumination is disclosed. The method may include providing a laser having a predetermined wavelength; performing at least one of: beam splitting or beam scanning prior to a frequency conversion; converting a frequency of each output beam of the at least one of: beam splitting or beam scanning; and providing the frequency converted output beam for illumination.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: June 13, 2017
    Assignee: KLA-Tencor Corporation
    Inventors: Christian Wolters, Jijen Vazhaeparambil, Dirk Woll, Anatoly Romanovsky, Bret Whiteside, Stephen Biellak, Guoheng Zhao
  • TDI Sensor in a Darkfield System
    Publication number: 20160097727
    Abstract: A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 7, 2016
    Inventors: Jijen Vazhaeparambil, Guoheng Zhao, Daniel Kavaldjiev, Anatoly Romanovsky, Ivan Maleev, Christian Wolters, Stephen Biellak, Bret Whiteside, Donald Pettibone, Yung-Ho Alex Chuang, David W. Shortt
  • Multi-spot defect inspection system
    Patent number: 9182358
    Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 10, 2015
    Assignee: KLA-Tencor Corporation
    Inventors: Zhiwei Xu, Christian Wolters, Juergen Reich, Bret Whiteside, Guoheng Zhao, Jijen Vazhaeparambil, Stephen Biellak, Sam Shamouilian, Mehdi Vaez-Iravani
  • Laser with Integrated Multi Line or Scanning Beam Capability
    Publication number: 20130250385
    Abstract: A method and system for providing illumination is disclosed. The method may include providing a laser having a predetermined wavelength; performing at least one of: beam splitting or beam scanning prior to a frequency conversion; converting a frequency of each output beam of the at least one of: beam splitting or beam scanning; and providing the frequency converted output beam for illumination.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 26, 2013
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Christian Wolters, Jijen Vazhaeparambil, Dirk Woll, Anatoly Romanovsky, Bret Whiteside, Stephen Biellak, Guoheng Zhao