Patents by Inventor Jim C Lo

Jim C Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate having porous dielectric layer
    Patent number: 11973017
    Abstract: A multilayer package substrate includes a plurality of dielectric layers including a top dielectric layer on a top side and a bottom dielectric layer on a bottom side. A top patterned metal layer is on the top dielectric layer and a bottom patterned metal layer is on the bottom dielectric layer. At least one of the top dielectric layer and the bottom dielectric layer is a porous dielectric layer having a plurality of pores including an average porosity of at least 5% averaged over its thickness.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: April 30, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jaimal Mallory Williamson, Jim C Lo