Abstract: A bonding means for electrically coupling a first component and a second component at an interface. The bonding means including at least one electrically conductive bonding puck positioned between the first component and the second component. The bonding puck being disposed within a recess formed in at least one of the first component and the second component. The at least one electrically conductive bonding puck providing electrical bonding between the first component and the second component and establishing electrical continuity therebetween.

Abstract: Valves are provided that include a flowbody, a sealing element, and an insulating member. The flowbody has a channel and an outer surface. The sealing element is disposed in the flowbody channel. The insulating member surrounds the flowbody and includes an inner surface and an annular spacer extending radially inwardly therefrom and integrally formed therewith. The annular spacer is in contact with the flowbody outer surface to thereby form an airgap between the insulating member inner surface and the flowbody outer surface. Methods of manufacturing the valves are also provided.