Patents by Inventor Jim Junshi Wang

Jim Junshi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7185760
    Abstract: Disclosed herein is a non-contact package useful when an article to be stored or shipped in the package includes a sensitive surface, the performance of which will be detrimentally affected if the sensitive surface is contacted with a nominal amount of mechanical force. A fluid environment which does not produce sufficient mechanical force to detrimentally affect the sensitive surface may be used in contact with the sensitive surface to prevent an undesirable chemical reaction on the sensitive surface. A fluid environment may also be used inside the package to support surrounding walls of the package so that such walls do not contact the sensitive surface and/or to dissipate force applied to the exterior of the package so that the sensitive surface will not be damaged.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: March 6, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Ronald Schauer, Jim Junshi Wang, Hong Wang, Brian West, Yongxiang He
  • Publication number: 20040251160
    Abstract: Disclosed herein is a non-contact package useful when an article to be stored or shipped in the package includes a sensitive surface, the performance of which will be detrimentally affected if the sensitive surface is contacted with a nominal amount of mechanical force. A fluid environment which does not produce sufficient mechanical force to detrimentally affect the sensitive surface may be used in contact with the sensitive surface to prevent an undesirable chemical reaction on the sensitive surface. A fluid environment may also be used inside the package to support surrounding walls of the package so that such walls do not contact the sensitive surface and/or to dissipate force applied to the exterior of the package so that the sensitive surface will not be damaged.
    Type: Application
    Filed: June 11, 2003
    Publication date: December 16, 2004
    Inventors: Ronald Schauer, Jim Junshi Wang, Hong Wang, Brian West, Yongxiang He