Patents by Inventor Jim Piszar

Jim Piszar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070073433
    Abstract: A tool used to direct the pressure applied to features of a plastic laminate part layup during co-curing or co-bonding is manufactured using direct digital manufacturing techniques. A CAD drawing representing the tool is generated and converted into digital data file suitable for controlling the operation of a rapid prototyping machine. The tool is formed in the rapid prototyping machine by additive layering of material until the features and dimensions of the layered material correspond to the CAD drawing. The resulting tool exhibits geometries and dimensions virtually identical to the theoretical dimensions of the CAD model of the tool.
    Type: Application
    Filed: September 23, 2005
    Publication date: March 29, 2007
    Inventors: Neal Froeschner, Jim Piszar
  • Publication number: 20060243382
    Abstract: An adhesive injection process for a Pi-joint assembly comprises the steps of: machining at least two ports into a female part of a Pi-joint assembly; inserting a filler into a gap between a male part and the female part; applying a sealant above the filler; creating a vacuum with a vacuum pump at one port; injecting an adhesive through another port; and drawing the adhesive towards the vacuum pump until the gap under the filler is completely filled with the adhesive. The adhesive injection process incorporates lean technologies that enable increased productivity during the assembly of a Pi-joint design using adhesive bonding. The adhesive injection process is suitable for, but not limited to, applications in the aerospace industry, such as the aircraft airframe assembly. The adhesive injection process may be used for the bonding of upper and lower skins to airframe structure as well as for structure-to-structure bonding.
    Type: Application
    Filed: April 21, 2005
    Publication date: November 2, 2006
    Applicant: The Boeing Company
    Inventors: Jeffrey Kilwin, Jim Piszar, Christopher Mathiesen