Patents by Inventor Jimmy Clidaras

Jimmy Clidaras has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070281639
    Abstract: A system can include an enclosure having an exterior surface and an interior region that is characterized by a width and a length that is longer than the width; a plurality of trays mounted in racks that line a majority of each side of the length of the interior region and that define an aisle therebetween which is suitable for passage by one or more human occupants; cooling coils configured to capture heat generated by the plurality of trays and exhaust the heat outside the interior region; a plurality of connections on the exterior surface for supplying electrical power to the plurality of trays, supplying cooling fluid to the cooling coils, and for receiving cooling fluid discharged from the cooling coils; and doors at either end of the aisle configured and positioned to facilitate emergency egress from the enclosure by a human occupant.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 6, 2007
    Inventors: Jimmy Clidaras, William Hamburgen, Andrew Carlson, Steven Y. Chow, Winnie Leung, Montgomery Sykora, Donald L. Beaty
  • Publication number: 20050002166
    Abstract: A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
    Type: Application
    Filed: August 3, 2004
    Publication date: January 6, 2005
    Inventors: Jimmy Clidaras, Kenneth Kitlas
  • Patent number: 6781844
    Abstract: A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: August 24, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: Jimmy Clidaras, Kenneth Kitlas
  • Patent number: 6760637
    Abstract: A method capable of interconnecting modular computer system components includes attaching a secondary chassis to a primary chassis, attaching a motherboard to an interior portion of the primary chassis, and attaching an external device to an interior portion of the secondary chassis. The method further includes connecting a first electrical connector on a bridgeboard with an electrical connector on the motherboard, connecting a second electrical connector on the bridgeboard with an electrical connector on the external device, and attaching the bridgeboard to at least one of the primary chassis and the secondary chassis.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: July 6, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: Jimmy Clidaras, Robert Alden Cook
  • Patent number: 6636421
    Abstract: A method for datum sharing between modular computer system components, includes determining a position and orientation of a motherboard, defining at least one datum feature in a primary chassis describing the position and orientation of the motherboard, and defining at least one datum feature in a secondary chassis corresponding to the at least one datum feature in the primary chassis. An apparatus for datum sharing includes at least one datum feature of the primary chassis, at least one datum feature of the motherboard, wherein a location of the at least one datum feature of the primary chassis is based upon the at least one datum feature of the motherboard, and at least one datum feature of the secondary chassis, wherein a location of the at least one datum feature of the secondary chassis is based upon the location of the at least one datum feature of the primary chassis.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: October 21, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: Jimmy Clidaras, Matthew Schutte
  • Publication number: 20030043537
    Abstract: A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
    Type: Application
    Filed: October 22, 2002
    Publication date: March 6, 2003
    Applicant: Sun Microsystems, Inc.
    Inventors: Jimmy Clidaras, Kenneth Kitlas
  • Patent number: 6493230
    Abstract: A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: December 10, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: Jimmy Clidaras, Kenneth Kitlas
  • Publication number: 20020163788
    Abstract: A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
    Type: Application
    Filed: May 1, 2001
    Publication date: November 7, 2002
    Applicant: Sun Microsystems,Inc
    Inventors: Jimmy Clidaras, Kenneth Kitlas
  • Publication number: 20020163779
    Abstract: A method for datum sharing between modular computer system components, includes determining a position and orientation of a motherboard, defining at least one datum feature in a primary chassis describing the position and orientation of the motherboard, and defining at least one datum feature in a secondary chassis corresponding to the at least one datum feature in the primary chassis. An apparatus for datum sharing includes at least one datum feature of the primary chassis, at least one datum feature of the motherboard, wherein a location of the at least one datum feature of the primary chassis is based upon the at least one datum feature of the motherboard, and at least one datum feature of the secondary chassis, wherein a location of the at least one datum feature of the secondary chassis is based upon the location of the at least one datum feature of the primary chassis.
    Type: Application
    Filed: May 1, 2001
    Publication date: November 7, 2002
    Applicant: Sun Microsystems, Inc.
    Inventors: Jimmy Clidaras, Matthew Schutte
  • Publication number: 20020165991
    Abstract: A method capable of interconnecting modular computer system components includes attaching a secondary chassis to a primary chassis, attaching a motherboard to an interior portion of the primary chassis, and attaching an external device to an interior portion of the secondary chassis. The method further includes connecting a first electrical connector on a bridgeboard with an electrical connector on the motherboard, connecting a second electrical connector on the bridgeboard with an electrical connector on the external device, and attaching the bridgeboard to at least one of the primary chassis and the secondary chassis.
    Type: Application
    Filed: May 1, 2001
    Publication date: November 7, 2002
    Applicant: Sun Microsystems, Inc.
    Inventors: Jimmy Clidaras, Robert Alden Cook