Abstract: A system and method for managing power usage of a data processing system subsystem are disclosed. According to one embodiment, a power-managed server data processing system is provided which comprises a bus configured to communicatively couple the power-managed server with a data processing system resource; and a bus controller coupled to the bus. In the described embodiment, the bus controller comprises bus control logic configured to process a plurality of access requests associated with the bus, and power management logic configured to inhibit processing of a current access request of the plurality by the bus control logic for a power management delay time period. The power management delay time period is determined utilizing a processing latency time period associated with a prior access request of the plurality of access requests.

Abstract: A hierarchical system and method for managing power usage among server data processing systems is disclosed. According to one embodiment, a hierarchical power management system is provided which comprises first and second power management controllers, a power management command combination element, a power management command terminator, a power-managed data processing system element, and a power management bus coupled between the power management controllers, power management command combination element, and power management command terminator.

Abstract: Within a group of components in a circuit, each component in the group has a thermal detector that describes whether that component is operating at a temperature that is normal, high or fatal. A first signal representing a first component's temperature is sent downstream to a second component in the group. If the second component is operating at the first component's temperature or lower, then the first signal is passed on downstream from the second component. However, if the second component is at a higher temperature, then the second component generates a second signal that represents the second component's temperature, and sends that second signal downstream. A signal representing the highest temperature detected in the group eventually reaches a master controller that, depending on the signal received from the group, lets the group continue to operate normally, throttles the group down, or else shuts the group down.

Abstract: A method and system for testing a computer is presented. The temperature of the computer is controlled by one or more on-board fans inside the computer's enclosure. Voltages are controlled at the Voltage Regulator Module (VRM) level. A test program is then run under varying temperature and VRM voltages, and the results of the test program are logged. The present invention can be used either at the manufacturer's location or the customer's site, either under local or remote control.

Abstract: A method and system for expanding the number of memory modules that can be coupled to a motherboard such as a server blade is presented. A stack of multiple Dual In-line Memory Modules (DIMMs) is formed using novel double-connector-edge DIMMs, which each have connector pins on their opposite edges. Alternatively, the double-connector-edge DIMM is used to couple the motherboard to a memory expansion card that has multiple single-edge pinned DIMMs coupled in a “daisy-chain.

Abstract: A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

Abstract: A method, system and computer program product for preventing inadvertent selection within a graphical user interface by temporarily intercepting any user input from a keyboard or graphical pointer which occurs within a specified short period of time following detection of an initial display of a dialog box. A second dialog box or other request for confirmation is then presented to the user, requesting confirmation of the intercepted user input prior to initiation thereof.

Abstract: An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB within the housing to define a substantially enclosed upper chamber above the lower chamber. The second PCB includes one or more airflow apertures defined therethrough and providing vertical air flow coupling between the upper and lower chambers. An airflow actuating device is utilized to generate a primary forced airflow within the upper chamber which is substantially parallel to the surface plane of the second PCB. The primary forced airflow further induces a negative air pressure in the upper chamber such that a mixed convection airflow is established between the upper and lower chambers via the second PCB apertures.

Abstract: A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process.

Abstract: A daughter card includes a number of circuit modules generating heat and a spring member transmitting the heat to a thermal bus extending along a circuit board adjacent to one side or to each side of a connector to which the daughter card is releasably attached. One or more contact surfaces of the spring member releasably contact one or more mating surfaces of a thermal bus at a side of the connector or at both sides of the connector. A heat pipe may additionally be used to direct heat from the thermal bus to a heat absorber.

Abstract: A structure for cooling an electronic component includes a heat sink attached to the component, an inner air duct extending into a central portion of the heat sink, and an outer air duct extending into an outer portion of the heat sink. In inner fan, within the inner air duct, moves air in one direction, while an outer fan, in the outer air duct, moves air in the other direction. The fans may be built as separate rotors, or as separate portions of a single rotor.

Abstract: A heat sink having graduated lengths of fins, with the tallest fins being in the center of the heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual fans impinge air against the fins, and particularly the tallest fins, to provide a highly efficient system for heat removal from the IC chip. By reducing the size of the lateral fins, additional space is made available for the dual fans. The use of the dual fans allows the fans to run at a lower speed that a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan system if one of the fans should fail.

Abstract: A heat sink having air flow directors on each of multiple fins attached to a heat sink base. The air flow directors direct air flow from dual fans towards a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. In one embodiment, a protrusion in the geometric center of the heat sink base provides additional cooling from air impingement, and also directs air towards the upper portions of the fins. The use of dual fans allows the fans to run at a lower speed than a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan if one of the fans should fail.

Abstract: A heat sink having an air flow director on each of multiple fins attached to a heat sink base. The air flow directors direct most of the air flow from dual push-pull fans towards a midline and a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. The rest of the air flow from the push-pull fans impinges against the air flow directors, providing additional cooling to the fins.