Abstract: Certain fused pyrrole- and pyrazole-containing heterocyclic compounds are serotonin modulators useful in the treatment of serotonin-mediated diseases.

Abstract: Certain methods that are useful in the preparation of amidophenyl-sulfonylamino-quinoxaline compounds CCK2 modulators are disclosed.

Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.

Abstract: Certain fused pyrrole- and pyrazole-containing heterocyclic compounds are serotonin modulators useful in the treatment of serotonin-mediated diseases.

Abstract: Certain methods that are useful in the preparation of amidophenyl-sulfonylamino-quinoxaline compounds CCK2 modulators are disclosed.

Abstract: There are provided by the present invention certain pyrazole based CCK-1 receptor modulators which have the general formula: wherein Ar is an aromatic or heteroaromatic group, X is a hydrocarbon linker, Y is a bond or hydrocarbon linker and R1, R2, R3, R4 and R5 are certain organic substituents, and methods of making the same.

Abstract: There are provided by the present invention certain pyrazole based CCK-1 receptor modulators which have the general formula: wherein Ar is an aromatic or heteroaromatic group, X is a hydrocarbon linker, Y is a bond or hydrocarbon linker and R1, R2, R3, R4 and R5 are certain organic substituents, and methods of making the same.

Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.

Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.

Abstract: The invention is a semiconductor package (10) and to the method of making in which the backside (23) of a semiconductor die (13) is mounted to one part of a package (11) with an adhesive (12) which may be both thermally and electrically conductive. The face (22) of the semiconductor die (13) is attached to a second part of the package (18) to direct heat away form the face (22) of the semiconductor die (13).

Abstract: A semiconductor package which comprises a lead frame, a semiconductor chip secured to the lead frame and a mold composition encasing the lead frame and the semiconductor chip has a filler of ceramic particles. Each of the ceramic particles, preferably silica or alumina, has macroscopic pores of sufficient size to receive a resin binder therein, the pores extending from the surface of the particle to the particle interior. A permanently hardenable composition adherable to the ceramic particles preferably an epoxy cresol novolac, extends around the ceramic particles and into the pores. The ceramic particles are formed by providing ceramic particles having a macroscopically smooth surface and subjecting the surfaces of the particles to a composition capable of removing portions of the particles, preferably hydrofluoric acid, while agitating the particles to form the pores.