Abstract: The present invention relates to a system for monitoring the state of vigilance of an operator including: a camera furnished with a sensor responsive in the near infrared, a circuit for real-time processing of the signals delivered by the camera, so as to determine characteristic points for each of the images. By analysing the characteristic points, the information relates to a part at least of the indicators including: the inclination of the head in three orthogonal directions, the position of the pupil, the opening of the eye, and/or the configuration of the mouth. Furthermore, a computer controlled by a program determines the state of vigilance as a function of the indicators and of their temporal evolution.

Abstract: Mold pieces (105 and 110) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer (118) include a primary cavity (117) and secondary cavities (120) into which excess mold compound from the primary cavity (117) flows. The secondary cavities (120) include a plunger (130) that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity (117) is forced to flow into the secondary cavities (120), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (118), which can then be removed, for example by grinding in a relatively short time. Mould piece (105) further comprises a movable cavity bar (115) that can be moved away from mould piece (105) after molding and be cooled to detach the molded substrate that adheres to the cavity bar.