Patents by Inventor Jin BAO
Jin BAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150145546Abstract: A coated probe is provided. The probe includes a probe body and a cladding layer. The probe body has a terminal. The cladding layer covers the surface of the terminal of the probe body, wherein the cladding layer includes a carbon nano-material layer, and the carbon nano-material layer includes a carbon nano-material.Type: ApplicationFiled: September 24, 2014Publication date: May 28, 2015Inventors: Shih-Chun Tseng, Ren-Jye Wu, Ping-Hsing Yang, Li-Duan Tsai, Jin-Bao Wu
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Publication number: 20140186716Abstract: A protected active metal electrode and a device with the electrode are provided. The protected active metal electrode includes an active metal substrate and a protection layer on a surface of the active metal substrate. The protection layer at least includes a metal thin film covering the surface of the active metal substrate and an electrically-conductive thin film covering a surface of the metal thin film. A material of the metal thin film is Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, or W. A material of the electrically-conductive thin film is selected from nitride of a metal in the metal thin film, carbide of a metal in the metal thin film, a diamond-like carbon (DLC), and a combination thereof.Type: ApplicationFiled: December 25, 2013Publication date: July 3, 2014Applicant: Industrial Technology Research InstituteInventors: Jin-Bao Wu, Li-Duan Tsai, Jia-Jen Chang, Ming-Sheng Leu, Jenn-Yeu Hwang, Chun-Lung Li
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Patent number: 8708557Abstract: An apparatus for measuring thermal diffusivity includes a Raman spectroscope, a heating device, and a signal analyzing unit. The Raman spectroscope is utilized to measure a Raman scattering intensity of different sites of a film to be measured. The heating device is utilized to provide a controllable thermal driving wave. The signal analyzing unit is utilized to analyze the Raman scattering intensity from the Raman spectroscope and the thermal driving wave so as to evaluate the thermal diffusivity of the film to be measured.Type: GrantFiled: June 15, 2012Date of Patent: April 29, 2014Assignee: Industrial Technology Research InstituteInventors: Chih-Chao Shih, Jin-Bao Wu, Ming-Sheng Leu
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Patent number: 8663441Abstract: A vacuum coating apparatus is disclosed. The apparatus includes a cathode target, a plurality of anodes, a transiting device, a pulsed arc discharge device, and a pulsed laser device. The plurality of anodes is placed on the transiting device and successively passes though a working position by the transiting device. The pulsed arc discharge device is electrically connected to the cathode target and the anode at the operable position to form plasma in a vacuum chamber for film coating. The pulsed laser device is located outside of the vacuum chamber and provides a pulsed laser beam onto the surface of the cathode surface to serve as a plasma trigger. A coating method for the vacuum coating apparatus is also disclosed.Type: GrantFiled: August 26, 2009Date of Patent: March 4, 2014Assignee: Industrial Technology Research InstituteInventors: Jin-Bao Wu, Chao-Ying Chen, Chin-Te Shih, Ming-Sheng Leu
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Patent number: 8644006Abstract: A composite cathode foil is provided. The composite cathode foil includes an aluminum substrate, a metal layer formed thereon, a metal carbide layer formed on the metal layer, and a carbon layer formed on the metal carbide layer, wherein the metal of the metal layer is selected from the group consisting of IVB, VB and VIB groups. The invention also provides a solid electrolytic capacitor including the composite cathode foil.Type: GrantFiled: December 26, 2008Date of Patent: February 4, 2014Assignee: Industrial Technology Research InstituteInventors: Jenn-Yeu Hwang, Jin-Bao Wu, Li-Duan Tsai, Ming-Sheng Leu
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Patent number: 8556155Abstract: A solder paste mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole extending through the first surface and the second surface, a first chip accommodating portion, and positioning pillars. The first chip accommodating portion and the positioning pillars are located on the first surface, and the position of the first chip accommodating portion is corresponding to the position of the through hole. The positioning plate includes a second chip accommodating portion and first positioning holes corresponding to the positioning pillars. The screen plate includes a mesh region and second positioning holes corresponding to the positioning pillars. The pushing element is movably disposed in the through hole and includes a first end portion and a second end portion.Type: GrantFiled: March 16, 2012Date of Patent: October 15, 2013Assignee: Compal Information (Kunshan) Co., Ltd.Inventor: Jin-Bao Xu
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Publication number: 20130266038Abstract: An apparatus for measuring thermal diffusivity includes a Raman spectroscope, a heating device, and a signal analyzing unit. The Raman spectroscope is utilized to measure a Raman scattering intensity of different sites of a film to be measured. The heating device is utilized to provide a controllable thermal driving wave. The signal analyzing unit is utilized to analyze the Raman scattering intensity from the Raman spectroscope and the thermal driving wave so as to evaluate the thermal diffusivity of the film to be measured.Type: ApplicationFiled: June 15, 2012Publication date: October 10, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Chao Shih, Jin-Bao Wu, Ming-Sheng Leu
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Patent number: 8491245Abstract: A positioning assembly includes a fastener and a pin. The fastener includes a latching portion and a fixing portion coaxially connected to the latching portion. The pin is movably received and fixed in the fastener. The fixing portion defines a threaded portion in a side surface of the fixing portion and a pinhole in an end surface of the fixing portion. The pin is received in the pinhole.Type: GrantFiled: September 29, 2010Date of Patent: July 23, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Chun-Jen Lin, Mi-Chien Chen, Jin-Bao Huang
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Publication number: 20130140344Abstract: A solder ball mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole extending through the first surface and the second surface, a first chip accommodating portion, and positioning pillars. The first chip accommodating portion and the positioning pillars are located on the first surface, and the position of the first chip accommodating portion is corresponding to the position of the through hole. The positioning plate includes a second chip accommodating portion and first positioning holes corresponding to the positioning pillars. The screen plate includes a mesh region and second positioning holes corresponding to the positioning pillars. The pushing element is movably disposed in the through hole and includes a first end portion and a second end portion.Type: ApplicationFiled: March 16, 2012Publication date: June 6, 2013Inventor: Jin-Bao Xu
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Patent number: 8406914Abstract: An injection molding controller controls an injection molding apparatus and peripheral devices of the injection molding apparatus. The injection molding controller includes an integral interface and a storage unit. The integral interface includes an injection molding control page and peripheral control pages. The integral interface shows the injection molding control page and the peripheral control pages simultaneously. The storage unit communicates with the integral interface and stores data related to the integral interface. The disclosure further provides a method for manufacturing the injection molding controller and an injection molding system using the injection molding controller.Type: GrantFiled: June 30, 2010Date of Patent: March 26, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Mi-Chien Chen, Chun-Jen Lin, Jin-Bao Huang
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Patent number: 8242372Abstract: Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.Type: GrantFiled: July 13, 2010Date of Patent: August 14, 2012Assignee: Industrial Technology Research InstituteInventors: Ming-Sheng Leu, Chun-Kai Liu, Jenn-Dong Hwang, Jin-Bao Wu, Chih-Kuang Yu
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Publication number: 20110217142Abstract: A positioning assembly includes a fastener and a pin. The fastener includes a latching portion and a fixing portion coaxially connected to the latching portion. The pin is movably received and fixed in the fastener. The fixing portion defines a threaded portion in a side surface of the fixing portion and a pinhole in an end surface of the fixing portion. The pin is received in the pinhole.Type: ApplicationFiled: September 29, 2010Publication date: September 8, 2011Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen)CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHUN-JEN LIN, MI-CHIEN CHEN, JIN-BAO HUANG
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Publication number: 20110160895Abstract: An injection molding controller controls an injection molding apparatus and peripheral devices of the injection molding apparatus. The injection molding controller includes an integral interface and a storage unit. The integral interface includes an injection molding control page and peripheral control pages. The integral interface shows the injection molding control page and the peripheral control pages simultaneously. The storage unit communicates with the integral interface and stores data related to the integral interface. The disclosure further provides a method for manufacturing the injection molding controller and an injection molding system using the injection molding controller.Type: ApplicationFiled: June 30, 2010Publication date: June 30, 2011Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MI-CHIEN CHEN, CHUN-JEN LIN, JIN-BAO HUANG
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Publication number: 20110149521Abstract: Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.Type: ApplicationFiled: July 13, 2010Publication date: June 23, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Sheng Leu, Chun-Kai Liu, Jenn-Dong Hwang, Jin-Bao Wu, Chih-Kuang Yu
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Patent number: 7816011Abstract: A structural material of diamond like carbon (DLC) composite layers is provided. The structural material includes a composite material which is consisted of a metal layer, a first metal nitride layer, and a DLC thin film. The metal layer includes aluminum (Al), copper (Cu), zirconium (Zr), nickel (Ni), or vanadium (V). The first metal nitride layer includes aluminum nitride (Al—N), zirconium nitride (Zr—N), vanadium nitride (V—N), or nickel nitride (Ni—N). The DLC thin film of the structural material of DLC composite layers has high quality tetragonally bonded amorphous carbon (ta-C) with a sp3(C—C) bonding ratio of more than 30%. Therefore, it is suitable for the work pieces in the mechanical, chemical, electricity, photoelectric, and heat transfer fields.Type: GrantFiled: March 12, 2008Date of Patent: October 19, 2010Assignee: Industrial Technology Research InstituteInventors: Ming-Sheng Leu, Jin-Bao Wu, Jia-Jen Chang
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Publication number: 20100213054Abstract: A vacuum coating apparatus is disclosed. The apparatus includes a cathode target, a plurality of anodes, a transiting device, a pulsed arc discharge device, and a pulsed laser device. The plurality of anodes is placed on the transiting device and successively passes though a working position by the transiting device. The pulsed arc discharge device is electrically connected to the cathode target and the anode at the operable position to form plasma in a vacuum chamber for film coating. The pulsed laser device is located outside of the vacuum chamber and provides a pulsed laser beam onto the surface of the cathode surface to serve as a plasma trigger. A coating method for the vacuum coating apparatus is also disclosed.Type: ApplicationFiled: August 26, 2009Publication date: August 26, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jin-Bao Wu, Chao-Ying Chen, Chin-Te Shih, Ming-Sheng Leu
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Publication number: 20100128416Abstract: A composite cathode foil is provided. The composite cathode foil includes an aluminum substrate, a metal layer formed thereon, a metal carbide layer formed on the metal layer, and a carbon layer formed on the metal carbide layer, wherein the metal of the metal layer is selected from the group consisting of IVB, VB and VIB groups. The invention also provides a solid electrolytic capacitor including the composite cathode foil.Type: ApplicationFiled: December 26, 2008Publication date: May 27, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jenn-Yeu HWANG, Jin-Bao WU, Li-Duan TSAI, Ming-Sheng LEU
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Publication number: 20090169845Abstract: A structural material of diamond like carbon (DLC) composite layers is provided. The structural material includes a composite material which is consisted of a metal layer, a first metal nitride layer, and a DLC thin film. The metal layer includes aluminum (Al), copper (Cu), zirconium (Zr), nickel (Ni), or vanadium (V). The first metal nitride layer includes aluminum nitride (Al—N), zirconium nitride (Zr—N), vanadium nitride (V—N), or nickel nitride (Ni—N). The DLC thin film of the structural material of DLC composite layers has high quality tetragonally bonded amorphous carbon (ta-C) with a sp3(C—C) bonding ratio of more than 30%. Therefore, it is suitable for the work pieces in the mechanical, chemical, electricity, photoelectric, and heat transfer fields.Type: ApplicationFiled: March 12, 2008Publication date: July 2, 2009Applicant: Industrial Technology Research InstituteInventors: Ming-Sheng Leu, Jin-Bao Wu, Jia-Jen Chang
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Publication number: 20050281956Abstract: A thermal spraying method is provided for manufacturing anti-sliding plates. The method uses a mask located upon a plate with a specific height. The mask has plural openings of a specific shape. When a thermal spraying device thermal-sprays thread material from the upper side of the mask, melted thread material passes through the openings to form anti-sliding spots of a specific shape on the plate. By means of thermal spraying on the mask with the openings, an anti-sliding plate with high roughness is efficiently produced.Type: ApplicationFiled: June 18, 2004Publication date: December 22, 2005Inventors: Chia-Hua Chang, Jen-Chin Wu, Jin-Bao Liu
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Patent number: D616365Type: GrantFiled: September 16, 2009Date of Patent: May 25, 2010Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Lin-Yi Wang, Mi-Chien Chen, Chun-Jen Lin, Jin-Bao Huang