Patents by Inventor Jin-Biao Ji

Jin-Biao Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160105999
    Abstract: A cooling device includes a cooler. The cooler includes a base, a plurality of cooling fins secured to the base, and a heat pipe inserting through the cooling fins. Each cooling fin includes a fin body and a pressed portion extending from the fin body. The fin body includes a hole area, which defines a receiving hole. A portion of the heat pipe extends through the receiving hole; the pressed portion includes at least one guiding portion, which is configured to guide air to flow towards the hole area from the fin body.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 14, 2016
    Inventors: XIN HE, JIN-BIAO JI, ZHI-JIANG YAO
  • Patent number: 8967586
    Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 3, 2015
    Assignees: Hong Fu Jin Precision Industry (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chao-Jun Zhu, Jin-Biao Ji, Zhi-Jiang Yao
  • Patent number: 8593814
    Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: November 26, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jin-Biao Ji, Zhi-Jiang Yao, Li-Fu Xu
  • Patent number: 8537535
    Abstract: An exemplary data storage device cage includes a main body and an electrical connector positioned on the main body. The main body includes a rectangular flat plate and two side plates respectively extending upward from opposite edges of the flat plate. The flat plate has at least a pair of tabs opposite to each other. The at least two tabs are respectively contiguous with but offset inward from the two side plates and positioned to cooperatively hold a data storage device therebetween. The electrical connector is positioned between the two side plates for electrically connecting the data storage device to an external device.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: September 17, 2013
    Assignees: Hong Fu Jin Precision (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yue-Xia Zhang, Jin-Biao Ji, Zhi-Jiang Yao
  • Publication number: 20130070414
    Abstract: An exemplary data storage device cage includes a main body and an electrical connector positioned on the main body. The main body includes a rectangular flat plate and two side plates respectively extending upward from opposite edges of the flat plate. The flat plate has at least a pair of tabs opposite to each other. The at least two tabs are respectively contiguous with but offset inward from the two side plates and positioned to cooperatively hold a data storage device therebetween. The electrical connector is positioned between the two side plates for electrically connecting the data storage device to an external device.
    Type: Application
    Filed: November 8, 2011
    Publication date: March 21, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: YUE-XIA ZHANG, JIN-BIAO JI, ZHI-JIANG YAO
  • Publication number: 20130052937
    Abstract: A heat dissipation apparatus includes a heat dissipating device, a fan and an air guiding duct. The heat dissipating device includes a heat conduction core, a plurality of fins, and a pair of securing fin assemblies. The pair of securing fin assemblies includes a first securing fin, and a first securing hole defined in the first securing fin. The fan includes a bottom panel and a plurality of fan blades. The bottom panel defines a fixing hole. The air guiding duct is hollow and defines an air guiding opening communicating with the plurality of fan blades. The first securing hole is aligned with the fixing hole, a fixing member is engaged in the first securing hole and the fixing hole, and the fan is secured to the heat dissipating device.
    Type: Application
    Filed: June 18, 2012
    Publication date: February 28, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: JIN-BIAO JI, ZHI-JIANG YAO
  • Publication number: 20130048820
    Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.
    Type: Application
    Filed: April 26, 2012
    Publication date: February 28, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: CHAO-JUN ZHU, JIN-BIAO JI, ZHI-JIANG YAO
  • Publication number: 20130043002
    Abstract: A heat dissipating module supporting apparatus includes a bracket, a heat conducting member, and a latch member. The bracket includes a securing portion. The securing portion defines a holding hole. The heat conducting member is engaged in the holding hole and comprises a body. The body comprises a first touching surface and a second touching surface opposite to the first touching surface. The first touching surface is configured to abut a heat dissipating module, and the second touching surface is configured to abut a heat generating part. The latch member secures the body to the securing portion and is removable from the securing portion to disengage the body from securing portion.
    Type: Application
    Filed: May 30, 2012
    Publication date: February 21, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: CHAO-JUN ZHU, JIN-BIAO JI, ZHI-JIANG YAO
  • Publication number: 20130014910
    Abstract: An installation member includes at least two installation portions located on the installation member, each defining an installation hole, at least two resilient members, at least two blocking members, and at least two fasteners. Each fastener comprises a head and a shank. The head defines a receiving groove for preventing a hand tool from disengaging from the head during rotating the fastener. The shank is received the installation hole. Each resilient member is fit on the shank and elastically engaged between the head and the installation portion. Each blocking member is secured on the shank and abuts against a nearest end of the installation portion.
    Type: Application
    Filed: March 8, 2012
    Publication date: January 17, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: MAO-HE ZHU, JIN-BIAO JI, ZHI-JIANG YAO
  • Publication number: 20120293957
    Abstract: A heat dissipating system includes an enclosure, which includes a rear plate and a side plate. A heat sink is mounted on the side plate. A power supply unit is mounted on the rear plate. A first fan is mounted in an inner room of the power supply unit. The power supply unit includes a bottom wall which defines a plurality of first vent holes and a rear wall which defines a plurality of second vent holes. The first fan is aligned to the plurality of second vent holes. The bottom wall is located above the heat sink. The first fan is adapted to rotate to drive air flowing in the power supply unit via the plurality of first vent holes from the heat sink, and following out of the power supply unit via the plurality of second vent holes.
    Type: Application
    Filed: November 15, 2011
    Publication date: November 22, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.
    Inventors: Jin-Biao JI, Zhi-Jiang YAO, Li-Fu XU
  • Publication number: 20120227938
    Abstract: A heat sink apparatus includes a fin module, a base, a first heat pipe, and a second heat pipe. The base includes an upper surface and a lower surface. The first heat pipe includes a first connection portion having a first end and a second end. The first end is connected to a first receiving portion. The second end is connected to a first body. The first receiving portion is in contact with the upper surface. The first body extends through the fin module in a first direction. The second heat pipe includes a second connection portion having a first end connected to a second receiving portion and a second end connected to a second body. The second receiving portion is in contact with the upper surface. The second body extends through the fin module in a second direction substantially opposite to the first direction.
    Type: Application
    Filed: October 31, 2011
    Publication date: September 13, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: LIANG DU, JIN-BIAO JI, ZHI-JIANG YAO, LI-FU XU
  • Publication number: 20120188722
    Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.
    Type: Application
    Filed: July 12, 2011
    Publication date: July 26, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: JIN-BIAO JI, ZHI-JIANG YAO, LI-FU XU
  • Publication number: 20120171012
    Abstract: A fan module includes a fan, a temperature sensor, and a shield. The temperature sensor includes a cable. The shield is mounted on the fan. The shield includes a clip. The clip includes two elastic pieces. A restricting slot and a receiving space are located between the two elastic pieces. The cable has an outer diameter which is wider than the restricting slot but narrower than the receiving space. The two elastic pieces can be elastically deformed to expand the restricting slot so that the cable can be placed in the receiving channel via the restricting slot.
    Type: Application
    Filed: July 20, 2011
    Publication date: July 5, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: MAO-HE ZHU, JIN-BIAO JI, ZHI-JIANG YAO, LI-FU XU
  • Patent number: 8199502
    Abstract: A heat dissipating device includes a heat sink and a fan. The heat sink includes a base configured to contact a heat generating element, and a plurality of fins extending from the base. The base defines an axis. Each fin includes an end portion extending about the axis of the base in one of a clockwise direction and an anti-clockwise direction. The fan is placed on the heat sink. The fan defines a first opening and a second opening adjacent to the base. The fan is operating and pivoted about the axis of the base in the other one of a clockwise direction and an anti-clockwise direction.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: June 12, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jin-Biao Ji, Zhi-Guo Zhang, Li-Fu Xu
  • Patent number: 8144459
    Abstract: A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: March 27, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jin-Biao Ji, Zhi-Guo Zhang, Li-Fu Xu
  • Publication number: 20110149514
    Abstract: A heat dissipating device includes a heat sink and a fan. The heat sink includes a base configured to contact a heat generating element, and a plurality of fins extending from the base. The base defines an axis. Each fin includes an end portion extending about the axis of the base in one of a clockwise direction and an anti-clockwise direction. The fan is placed on the heat sink. The fan defines a first opening and a second opening adjacent to the base. The fan is operating and pivoted about the axis of the base in the other one of a clockwise direction and an anti-clockwise direction.
    Type: Application
    Filed: March 15, 2010
    Publication date: June 23, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JIN-BIAO JI, ZHI-GUO ZHANG, LI-FU XU
  • Publication number: 20110090636
    Abstract: A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating.
    Type: Application
    Filed: December 30, 2009
    Publication date: April 21, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JIN-BIAO JI, ZHI-GUO ZHANG, LI-FU XU
  • Publication number: 20110073287
    Abstract: A heat dissipating device includes a heat sink and a heat sink cover. The heat sink includes a base and a plurality of fins extending from the base. Each of the plurality of fins includes a corner projection. The heat sink cover covers the corner projections of the heat sink.
    Type: Application
    Filed: December 30, 2009
    Publication date: March 31, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JIN-BIAO JI, ZHI-GUO ZHANG, LI-FU XU