Abstract: Provided are an additive for resist represented by the following formula (1), and a resist composition containing the additive. The additive according to the present invention can suppress leaching caused by water during an immersion lithographic process by increasing hydrophobicity of the surface of the resist film in the exposure at the time of applying the additive to a resist composition, and can form a fine resist pattern having excellent sensitivity and resolution at the time of applying the additive to a resist composition. wherein the substituents respectively have the same meanings as defined above.

Abstract: A resist resin composition includes 100 parts by weight of a copolymer represented by Formula 3 below; 0.5 to 1.5 parts by weight of a photoacid generator and 700 to 1,500 parts by weight of a solvent: wherein R1, R2, and R3 are each independently a C1-30 alkyl group, a C3-30 cycloalkyl group, an ether group, an ester group, a carbonyl group, an acetal group, an epoxy group, a nitrile group, or an aldehyde group, R4, R5, and R6 are each independently hydrogen or a methyl group, and l, m, n, and o each independently refer to the number of repeating units in a main backbone and satisfy the conditions: l+m+n+o=1, 0?l/(l+m+n+o)<0.4, 0<m/(l+m+n+o)<0.6, 0?n/(l+m+n+o)<0.6, and 0<o/(l+m+n+o)<0.4.

Abstract: A photoacid generator represented by the following formula (1), a method for producing the photoacid generator, and a resist composition containing the photoacid generator are provided. wherein in the formula (1), Y1, Y2, X, R1, R2, n1, n2 and A+ have the same meanings as defined in the detailed description of the invention. The photoacid generator can maintain an appropriate contact angle at the time of ArF liquid immersion lithography, can reduce defects occurring during liquid immersion lithography, and has excellent solubility in resist solvents and excellent compatibility with resins. Furthermore, the photoacid generator can be produced by an efficient and simple method using an epoxy compound that is industrially easily available.

Abstract: A resist resin composition includes 100 parts by weight of a copolymer represented by Formula 3 below; 0.5 to 1.5 parts by weight of a photoacid generator and 700 to 1,500 parts by weight of a solvent: wherein R1, R2, and R3 are each independently a C1-30 alkyl group or a C3-30 cycloalkyl group that has or does not have hydrogen, an ether group, an ester group, a carbonyl group, an acetal group, an epoxy group, a nitrile group, or an aldehyde group, R4, R5, and R6 are each independently hydrogen or a methyl group, and l, m, n, and o each independently refer to the number of repeating units in a main backbone and satisfy the conditions: l+m+n+o=1, 0?l/(l+m+n+o)<0.4, 0<m/(l+m+n+o)<0.6, 0?n/(l+m+n+o)<0.6, and 0<o/(l+m+n+o)<0.4.

Abstract: A photoacid generator represented by the following formula (1), a method for producing the photoacid generator, and a resist composition containing the photoacid generator are provided. wherein in the formula (1), Y1, Y2, X, R1, R2, n1, n2 and A+ have the same meanings as defined in the detailed description of the invention. The photoacid generator can maintain an appropriate contact angle at the time of ArF liquid immersion lithography, can reduce defects occurring during liquid immersion lithography, and has excellent solubility in resist solvents and excellent compatibility with resins. Furthermore, the photoacid generator can be produced by an efficient and simple method using an epoxy compound that is industrially easily available.

Abstract: An acid generator represented by the following formula (1) is provided: wherein X represents an alkylene group having 1 to 10 carbon atoms, —X1—O—X2—, or a heteroatom selected from the group consisting of nitrogen, sulfur and fluorine; X1 and X2 each independently represent an alkylene group having 1 to 10 carbon atoms; Y represents a cyclic hydrocarbon group having 5 to 30 carbon atoms and containing one or more aromatic rings, while one or more hydrogen atoms on the ring of the cyclic hydrocarbon group may be substituted by one or more members selected from the group consisting of —O—Y1, —CO—Y2, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a perfluoroalkyl group having 1 to 4 carbon atoms, a perfluoroalkoxy group having 1 to 4 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a halogen atom, a hydroxyl group and a cyano group; Y1 and Y2 each independently represent an alkyl group having 1 to 6 carbon atoms; n represents an integer of 0 or 5; and A+

Abstract: An acid generator represented by the following formula (1) is provided: wherein X represents an alkylene group having 1 to 10 carbon atoms, —X1—O—X2—, or a heteroatom selected from the group consisting of nitrogen, sulfur and fluorine; X1 and X2 each independently represent an alkylene group having 1 to 10 carbon atoms; Y represents a cyclic hydrocarbon group having 5 to 30 carbon atoms and containing one or more aromatic rings, while one or more hydrogen atoms on the ring of the cyclic hydrocarbon group may be substituted by one or more members selected from the group consisting of —O—Y1, —CO—Y2, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a perfluoroalkyl group having 1 to 4 carbon atoms, a perfluoroalkoxy group having 1 to 4 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a halogen atom, a hydroxyl group and a cyano group; Y1 and Y2 each independently represent an alkyl group having 1 to 6 carbon atoms; n represents an integer of 0 or 5; and A+