Patents by Inventor Jin-Churng Twu

Jin-Churng Twu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for a copper CMP endpoint detection system
    Patent number: 6517413
    Abstract: A new method is provided for endpoint detection of the polishing of a copper surface. The amount of copper dioxide that is removed from the surface that is being polished is monitored by means of a laser beam that is reflected off the polishing pad that is used for the polishing operation. The reflected light beam is analyzed for color content, based on this analysis it can be determined at what time no more copper dioxide is present on the surface of the polishing pad, which is the time that the process of removing copper from the surface that is being polished is complete. The polishing process is stopped at that time.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: February 11, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Tien-Chen Hu, Jin-Churng Twu, Chen-Fa Lu