Patents by Inventor Jin Gul Hyun
Jin Gul Hyun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11636971Abstract: A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.Type: GrantFiled: February 10, 2020Date of Patent: April 25, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ye Eun Jung, Jin Gul Hyun, Han Lee
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Patent number: 11600430Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: GrantFiled: August 4, 2020Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Yoon Jang, Seok Hwan Ahn, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng
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Patent number: 11017930Abstract: An inductor includes a body structure, a first external electrode and a second external electrode disposed externally on the body structure and spaced apart from each other, and a conductive structure disposed inside the body structure and including a first end portion in contact with the first external electrode and a second end portion in contact with the second external electrode, wherein each of the first and second external electrodes includes an electroless plated layer and an electrolytic plated layer formed of a material different from that of the electroless plated layer and covering the electroless plated layer.Type: GrantFiled: August 28, 2018Date of Patent: May 25, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun Hwang, Jin Gul Hyun
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Publication number: 20210043359Abstract: A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.Type: ApplicationFiled: February 10, 2020Publication date: February 11, 2021Inventors: Ye Eun Jung, Jin Gul Hyun, Han Lee
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Publication number: 20200365313Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: ApplicationFiled: August 4, 2020Publication date: November 19, 2020Inventors: Jong Yoon JANG, Seok Hwan AHN, Jeong Min CHO, Tae Hoon KIM, Jin Gul HYUN, Se Woong PAENG
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Patent number: 10763031Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: GrantFiled: August 15, 2017Date of Patent: September 1, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Yoon Jang, Seok Hwan Ahn, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng
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Publication number: 20190244739Abstract: An inductor includes a body structure, a first external electrode and a second external electrode disposed externally on the body structure and spaced apart from each other, and a conductive structure disposed inside the body structure and including a first end portion in contact with the first external electrode and a second end portion in contact with the second external electrode, wherein each of the first and second external electrodes includes an electroless plated layer and an electrolytic plated layer formed of a material different from that of the electroless plated layer and covering the electroless plated layer.Type: ApplicationFiled: August 28, 2018Publication date: August 8, 2019Inventors: Mi Sun HWANG, Jin Gul HYUN
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Publication number: 20180061555Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: ApplicationFiled: August 15, 2017Publication date: March 1, 2018Inventors: Jong Yoon JANG, Seok Hwan AHN, Jeong Min CHO, Tae Hoon KIM, Jin Gul HYUN, Se Woong PAENG
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Publication number: 20140061864Abstract: Disclosed herein is a semiconductor substrate having a crack preventing structure, the semiconductor substrate including: a plurality of wiring layers and a plurality of insulating layers sequentially stacked on a device divided into integrated circuit device areas and a cutting area separating the device areas from each other; opening parts formed to spatially separate the insulating layers in the device areas and the insulating layers in the cutting area from each other; and chamfering parts formed at outer sides of the insulating layers in the device areas contacting the opening parts, wherein the plurality of wiring layers are formed between the insulating layers in the cutting area and the device.Type: ApplicationFiled: March 14, 2013Publication date: March 6, 2014Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Gul HYUN, Mi Jin Park, Kyung Seob Oh
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Publication number: 20130153275Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; circuit patterns formed in a circuit region on the base substrate; dummy patterns formed in a dummy region on the base substrate; and an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.Type: ApplicationFiled: March 21, 2012Publication date: June 20, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Gul Hyun, Jin Gu Kim, Young Do Kweon, Hyung Jin Jeon