Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.

Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.

Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a resid

Abstract: A separator assembly for a fuel cell and a fuel cell stack including the same, is uniformly capable of forming a surface pressure of a region where a reaction gas flows when a stack is stacked by adjusting a height and shape of a gasket line for each region in which the reaction gas flows.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.