Patents by Inventor Jin-Hee Won

Jin-Hee Won has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150233093
    Abstract: The present invention controls a proportional control valve controlling the maximum flow of the flow pump to perform controlling the maximum flow of the hydraulic oil pump after checking whether the pump joint control is normal, receiving a flow value of the flow pump controlled by the proportional control valve, checking an error when the flow value received during a control of the maximum flow has an error, and assigning a weight value to the checked error to compensate for the flow value. Therefore, the present invention may decrease a number of an engine revolution speed and lower a driving fuel consumption and reduce a driving noise.
    Type: Application
    Filed: August 7, 2013
    Publication date: August 20, 2015
    Applicant: HYUNDAI HEAVY INDUSTRIES CO., LTD.
    Inventors: Jin Hee Won, Jun Seong Lim, Moon Kyu Choi
  • Patent number: 9063216
    Abstract: A method and an apparatus for providing a location based service in a wireless communication system are provided. A method of a Base Station (BS) for a Location Based Service (LBS) in a wireless communication system includes allocating identifiers to a plurality of transmission devices in a service coverage area of the BS, generating a Reference Signal (RS) including the identifier of the corresponding transmission device and an identifier of the BS with respect to each of the transmission devices, and transmitting the RS generated for each of the transmission devices, to a Mobile Station (MS) via the corresponding transmission device.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: June 23, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-Hee Won, Sang-Heon Kim, Seong-Hyeon Chae, Hee-Won Kang
  • Patent number: 8503352
    Abstract: A method and apparatus for transmitting/receiving a reference signal for positioning in a wireless communication system are provided. In the method, a BS locates a PA preamble in a second frame among frames constituting each of multiple superframes, locates a SA preamble in first symbols of first and third frames among the frames constituting each of the multiple superframes, determines multiple consecutive first superframes belonging to an LBS zone from among the multiple superframes, includes a reference signal for LBS in a first symbol of a first subframe of a last frame among frames constituting each of the first superframes, includes data in a first symbol of a first subframe of a last frame among frames constituting each of second superframes that correspond to the multiple superframes excluding the first superframes when the data is to be transmitted, and communicates with an MS by using the first and second superframes.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: August 6, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Heon Kim, Jae-Weon Cho, Hee-Won Kang, Jin-Hee Won
  • Patent number: 8478302
    Abstract: A method, an Advanced Base Station (ABS) and an Advanced Mobile Station (AMS) for transmitting Location Based Service (LBS) resource allocation information by an ABS in a mobile communication system are provided. The ABS transmits LBS resource allocation information including LBS zone configuration information representing an LBS zone transmission period. The LBS zone configuration information includes at least one of first information indicating that LBS zone transmission is switched off, second information indicating that the LBS zone transmission period corresponds to a first number of super frames, third information indicating that the LBS zone transmission period corresponds to a second number of super frames, and fourth information indicating that the LBS zone transmission period corresponds to a third number of super frames.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: July 2, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-Hyeon Chae, Sang-Heon Kim, Hee-Won Kang, Jin-Hee Won
  • Patent number: 8315208
    Abstract: An apparatus and a method for detecting a femto Base Station (BS) of a Mobile Station (MS) in a wireless communication system including a macro BS and a femto BS are provided. The method includes receiving a request, from the macro BS, to monitor an UpLink (UL) signal of an MS permissible by the femto BS to access, and monitoring the UL signal of the MS permissible to access.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: November 20, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Hee Cho, Byung-Wook Jun, Jin-Hee Won, Yung-Soo Kim, Jong-Hyung Kwun, Ju-Mi Lee, Young-Bo Cho
  • Publication number: 20120040695
    Abstract: A method and an apparatus for providing a location based service in a wireless communication system are provided. A method of a Base Station (BS) for a Location Based Service (LBS) in a wireless communication system includes allocating identifiers to a plurality of transmission devices in a service coverage area of the BS, generating a Reference Signal (RS) including the identifier of the corresponding transmission device and an identifier of the BS with respect to each of the transmission devices, and transmitting the RS generated for each of the transmission devices, to a Mobile Station (MS) via the corresponding transmission device.
    Type: Application
    Filed: August 16, 2011
    Publication date: February 16, 2012
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Jin-Hee WON, Sang-Heon KIM, Seong-Hyeon CHAE, Hee-Won KANG
  • Publication number: 20120009945
    Abstract: A method, an Advanced Base Station (ABS) and an Advanced Mobile Station (AMS) for transmitting Location Based Service (LBS) resource allocation information by an ABS in a mobile communication system are provided. The ABS transmits LBS resource allocation information including LBS zone configuration information representing an LBS zone transmission period. The LBS zone configuration information includes at least one of first information indicating that LBS zone transmission is switched off, second information indicating that the LBS zone transmission period corresponds to a first number of super frames, third information indicating that the LBS zone transmission period corresponds to a second number of super frames, and fourth information indicating that the LBS zone transmission period corresponds to a third number of super frames.
    Type: Application
    Filed: July 6, 2011
    Publication date: January 12, 2012
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Seong-Hyeon CHAE, Sang-Heon KIM, Hee-Won KANG, Jin-Hee WON
  • Publication number: 20110103307
    Abstract: A method and apparatus for transmitting/receiving a reference signal for positioning in a wireless communication system are provided. In the method, a BS locates a PA preamble in a second frame among frames constituting each of multiple superframes, locates a SA preamble in first symbols of first and third frames among the frames constituting each of the multiple superframes, determines multiple consecutive first superframes belonging to an LBS zone from among the multiple superframes, includes a reference signal for LBS in a first symbol of a first subframe of a last frame among frames constituting each of the first superframes, includes data in a first symbol of a first subframe of a last frame among frames constituting each of second superframes that correspond to the multiple superframes excluding the first superframes when the data is to be transmitted, and communicates with an MS by using the first and second superframes.
    Type: Application
    Filed: October 26, 2010
    Publication date: May 5, 2011
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Sang-Heon KIM, Jae-Weon CHO, Hee-Won KANG, Jin-Hee WON
  • Publication number: 20100260052
    Abstract: An apparatus and a method for detecting a femto Base Station (BS) of a Mobile Station (MS) in a wireless communication system including a macro BS and a femto BS are provided. The method includes receiving a request, from the macro BS, to monitor an UpLink (UL) signal of an MS permissible by the femto BS to access, and monitoring the UL signal of the MS permissible to access.
    Type: Application
    Filed: April 8, 2010
    Publication date: October 14, 2010
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Jae-Hee CHO, Byung-Wook JUN, Jin-Hee WON, Yung-Soo KIM, Jong-Hyung KWUN, Ju-Mi LEE, Young-Bo CHO
  • Patent number: 7211467
    Abstract: A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: May 1, 2007
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Sang-Bae Park, Yong-Gill Lee, Hyung-Jun Park, Kyung-Soo Rho, Jin-Hee Won
  • Publication number: 20060199308
    Abstract: A process for manufacturing sawing type leadless semiconductor packages includes a post mold-curing step, which is performed after an encapsulant is formed and after connecting bars of a leadframe are removed. The connecting bars are formed between a plurality of package units of the leadframe to connect a plurality of leads in the package units. After die attachment and electrical connection, the encapsulant is formed over the package units and the connecting bars to encapsulate the chips. The connecting bars are removed prior to the post mold-curing step. Therefore the encapsulant can be cured without deformation or warpage, thereby facilitating the sequent processes.
    Type: Application
    Filed: March 2, 2005
    Publication date: September 7, 2006
    Inventors: Yong-Gill Lee, Jin-Young Hong, Hyung-Jun Park, Jin-Hee Won
  • Patent number: 6984878
    Abstract: A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: January 10, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Sang-Bae Park, Yong-Gill Lee, Hyung-Jun Park, Kyung-Soo Rho, Jin-Hee Won
  • Publication number: 20050260795
    Abstract: A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.
    Type: Application
    Filed: October 27, 2004
    Publication date: November 24, 2005
    Inventors: Sang-Bae Park, Yong-Gill Lee, Hyung-Jun Park, Kyung-Soo Rho, Jin-Hee Won
  • Publication number: 20050258521
    Abstract: A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.
    Type: Application
    Filed: May 24, 2004
    Publication date: November 24, 2005
    Inventors: Sang-Bae Park, Yong-Gill Lee, Hyung-Jun Park, Kyung-Soo Rho, Jin-Hee Won