Abstract: A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer.

Abstract: A manufacturing method of an organic light emitting diode (OLED) display device includes forming a thin film transistor and an organic light emitting diode in a display area of a first substrate, forming a thin film encapsulation layer that has a layering structure of an organic film and an inorganic film on one substrate of the first substrate and a second substrate, forming a sealing member by coating a sealing material that includes an inorganic sealant and an organic compound on an edge of the second substrate, removing the organic compound of the sealing member by baking the sealing member, layering the second substrate on the first substrate so that the sealing member contacts the first substrate, dissolving the sealing member by using a laser beam, solidifying the sealing member, attaching the sealing member to the first substrate, and removing the second substrate from the sealing member.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the display includes i) a substrate, ii) a driving circuit formed on the substrate, iii) an organic light emitting diode formed on the substrate and electrically connected to the driving circuit, iv) an encapsulation thin film formed on the driving circuit and organic light emitting diode and v) a spacer formed on the substrate and surrounding the encapsulation thin film.

Abstract: An organic light emitting display device includes a substrate; an organic light emitting unit formed on the substrate; and a sealing unit which seals the organic light emitting unit, wherein the sealing unit is formed by alternately stacking at least one first thin film and at least one second thin film, the first thin film being formed to surround a portion of the second thin film.

Abstract: A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes an organic light emitting element formed over a substrate and an encapsulation portion covering the organic light emitting element. Further, the encapsulation portion may include at least one organic layer and at least one inorganic layer, wherein ends of the inorganic layer and t he organic layer directly contact the substrate, and wherein the organic layer is thicker than the inorganic layer.

Abstract: Provided is a method of manufacturing an organic light emitting display device in which a laser beam is used. The method includes forming an organic light emitting unit on a substrate; forming a sealing unit that seals the organic light emitting unit; forming an protective film which is opaque on the sealing unit to protect the organic light emitting unit or the sealing unit by blocking the transmission of the laser beam; forming an optical pattern on the opaque protective film using the laser beam; and forming a transparent film from the opaque protective film by oxidizing the opaque protective film.

Abstract: Provided is a method of manufacturing an organic light emitting display device in which a laser beam is used. The method includes forming an organic light emitting unit on a substrate; forming a sealing unit that seals the organic light emitting unit; forming an protective film which is opaque on the sealing unit to protect the organic light emitting unit or the sealing unit by blocking the transmission of the laser beam; forming an optical pattern on the opaque protective film using the laser beam; and forming a transparent film from the opaque protective film by oxidizing the opaque protective film.

Abstract: An organic light emitting display includes a substrate, an OLED including an anode electrode, a cathode electrode and an organic thin film formed between the anode electrode and the cathode electrode, a reflective layer on the OLED, the reflective layer comprising a laminated first material and second material, the first material and the second material having different refractive indices, and an encapsulation layer on the reflective layer, the encapsulation layer comprising at least one of organic thin film and inorganic thin film.

Abstract: A method of aligning a substrate includes forming a first alignment hole in the substrate, preparing a mask with a second alignment hole narrower than the first alignment hole, modifying a surface reflectance around either the first alignment hole or the second alignment hole to form a treatment region, positioning the mask below the substrate, such that the first and second alignment holes overlap, and operating a sensor unit above the first alignment hole to examine alignment of the first and second alignment holes.

Abstract: Provided is an organic light emitting display apparatus in which process efficiency and contrast are increased. The organic light emitting display apparatus includes a substrate, a display unit that is formed on the substrate and includes an organic light emitting device, an encapsulation layer that is formed on the display unit so as to encapsulate the display unit, a color filter layer that is formed on the encapsulation layer, a protection layer that is formed on the color filter layer, and a black matrix that is formed on the protection layer. The black matrix is aligned not to overlap the color filter layer.

Abstract: An organic light emitting diode display includes a substrate having organic light emitting diodes thereon. A thin film encapsulation layer is formed on the substrate such that the thin film encapsulation layer covers the organic light emitting diodes. A nonorganic layer is formed under the thin film encapsulation layer along the edge of the thin film encapsulation layer.

Abstract: An OLED display includes a substrate on which OLEDs are formed, a TFE layer formed on the substrate so as to cover the OLEDs, and absorbers disposed at a distance from each other and preventing or inhibiting penetration of external foreign materials.

Abstract: An organic light-emitting display apparatus for encapsulating an organic light-emitting device and/or improving its electrical properties. The organic light-emitting display apparatus includes: a substrate; a display portion on the substrate and including an organic light-emitting device; a non-display portion on both the substrate and the peripheral region of the display portion; and an encapsulation portion on the display portion and including a first encapsulation layer formed of an inorganic material and a second encapsulation layer formed of an organic material that are alternately stacked on the display portion, wherein an end portion of the first encapsulation layer contacts the substrate.

Abstract: Provided is an organic light emitting apparatus that prevents voltage drop due to thin electrode and improves shock resistance. The organic light emitting apparatus includes a substrate, a first electrode formed on the substrate, an organic light emitting layer formed on the first electrode, a second electrode formed on the organic light emitting layer, and a conductive component disposed on the second electrode. The conductive component includes carbon nano-tubes.

Abstract: Provided is a method of manufacturing an organic light emitting display device in which a laser beam is used. The method includes forming an organic light emitting unit on a substrate; forming a sealing unit that seals the organic light emitting unit; forming an protective film which is opaque on the sealing unit to protect the organic light emitting unit or the sealing unit by blocking the transmission of the laser beam; forming an optical pattern on the opaque protective film using the laser beam; and forming a transparent film from the opaque protective film by oxidizing the opaque protective film.

Abstract: An organic light emitting display device includes a substrate; an organic light emitting unit formed on the substrate; and a sealing unit which seals the organic light emitting unit, wherein the sealing unit is formed by alternately stacking at least one first thin film and at least one second thin film, the first thin film being formed to surround a portion of the second thin film.

Abstract: A multi-vision display including first and second display panels having edges that at least partially overlap, the first and second display panels each including pixel regions, non-pixel regions disposed around the pixel regions, and driving circuits mounted on the non-pixel regions, to supply driving signals to the pixel regions. The driving circuits are located on edges of the first and second display panels that face the overlapped edges.

Abstract: A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer.

Abstract: A flexible substrate bonding and debonding apparatus is disclosed. In one embodiment, the apparatus includes i) a chamber, ii) a lower chuck disposed in a lower portion of the chamber and having a lower heating unit and a cooling conduit built therein, iii) an upper chuck disposed above the lower chuck and having an upper heating unit built therein, iv) a pressurizing unit disposed above the upper chuck and v) a separating unit corresponding to either side of bonding surfaces of a support substrate and a flexible substrate which are disposed between the lower chuck and the upper chuck. The flexible substrate bonding and debonding apparatus can pressurize the flexible substrate and the support substrate simultaneously using a heat-treatment process. Therefore, the flexible substrate can be more reliably bonded and debonded even at low temperature.