Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a resid

Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a resid

Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a resid

Abstract: Provided herein is a capacitive torque sensor, which can completely offset forces/torques in all axial directions, except for force/torque in a direction of a central axis, by measuring variations in capacitances of four sensing cells arrayed at angular intervals of 90 degrees on the basis of a center of the sensor and can offer a sensing value for the torque in a central axis direction.

Abstract: Provided herein is a capacitive torque sensor, which can completely offset forces/torques in all axial directions, except for force/torque in a direction of a central axis, by measuring variations in capacitances of four sensing cells arrayed at angular intervals of 90 degrees on the basis of a center of the sensor and can offer a sensing value for the torque in a central axis direction.

Abstract: A winder for an electrode assembly of a rechargeable battery for improving space usage is disclosed. The winder includes a plurality of spools supplying a negative electrode member, a positive electrode member, a first separator member, and a second separator member, a mandrel stacking and spirally winding the first separator member, the negative electrode member, the second separator member, and the positive electrode member supplied by the spool, a first frame accommodating a predetermined number of spools from among the plurality of spools and the mandrel, a second frame connected to the first frame and accommodating other spools from among the plurality of spools, a reorienter installed between the first frame and the second frame and reorienting a progressing direction of one of the members, and a position controller controlling a position of the member that passes through the reorienter and progresses towards the mandrel.

Abstract: Disclosed is a winder for an electrode assembly of a rechargeable battery for improving space usage. The winder includes a plurality of spools supplying a negative electrode member, a positive electrode member, a first separator member, and a second separator member, a mandrel stacking and spirally winding the first separator member, the negative electrode member, the second separator member, and the positive electrode member supplied by the spool, a first frame accommodating a predetermined number of spools from among the plurality of spools and the mandrel, a second frame connected to the first frame and accommodating other spools from among the plurality of spools, a reorienter installed between the first frame and the second frame and reorienting a progressing direction of one of the members, and a position controller controlling a position of the member that passes through the reorienter and progresses towards the mandrel.

Abstract: A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.

Abstract: In a semiconductor device including a plurality of memory units and a method of testing the same, the semiconductor device includes a plurality of memory units each comprising a plurality of input lines; and an input unit configured to provide a plurality of test signals to the input lines, respectively, included in each of the memory units in response to a test enable signal. A data input/output unit can be configured to receive Z-bit data from test equipment and to distribute the Z-bit data to the plurality of memory units in response to the test enable signal, where Z is a natural number. The data input/output unit outputs K-bit data, which are output from each of the plurality of memory units, through data input/output lines included in the plurality of memory units in response to the test enable signal, where K?Z and K is a natural number.

Abstract: A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.

Abstract: In a semiconductor device including a plurality of memory units and a method of testing the same, the semiconductor device includes a plurality of memory units each comprising a plurality of input lines; and an input unit configured to provide a plurality of test signals to the input lines, respectively, included in each of the memory units in response to a test enable signal. A data input/output unit can be configured to receive Z-bit data from test equipment and to distribute the Z-bit data to the plurality of memory units in response to the test enable signal, where Z is a natural number. The data input/output unit outputs K-bit data, which are output from each of the plurality of memory units, through data input/output lines included in the plurality of memory units in response to the test enable signal, where K?Z and K is a natural number.

Abstract: A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.

Abstract: A refresh control circuit and semiconductor devices that may include an address counter for generating a counting address, a repetition address selector for generating a repetition address, a repetition refresh controller for generating a refresh repetition signal based on the counting address and repetition address, and a row decoder for selecting a row of a memory bank based on the counting address and the refresh repetition signal. A method for performing a refresh operation on a semiconductor device that may include receiving a refresh trigger, generating a counting address, generating a repetition address corresponding to a row having a degraded memory cell, providing a refresh repetition signal based on a comparison of the counting address and repetition address, and selecting a row to be refreshed based on one or more of the counting address, repetition address, and the refresh repetition address.

Abstract: Memory modules and methods of testing memory modules are provided that include at least one memory device responsive to a memory clock signal having a memory clock frequency and a data buffer. The data buffer is responsive to a buffer clock signal having a first buffer clock frequency that is different from the memory clock frequency during a normal mode of operation and having a second buffer clock frequency that is equal to the memory clock frequency during a test mode of operation.

Abstract: An electronic system having a plurality of dynamic semiconductor memory devices and a refresh method for the same. The system comprises a plurality of dynamic semiconductor memory devices and a controller. Each of the dynamic semiconductor memory devices includes a storage device for storing a designated number designating an order for performing a refresh operation, a refresh enable signal generating circuit for generating a refresh enable signal in response to a refresh control command supplied from the controller and a delaying circuit for delaying the refresh enable signal by different time intervals determined by the designated number.

Abstract: An integrated circuit device includes a delay circuit that is configured to delay a clock signal and is further configured to generate an output data signal in response to the delayed clock signal and an input data signal. Multiple devices are configured to respectively receive the output data signal in response to the clock signal.

Abstract: An electronic system having a plurality of dynamic semiconductor memory devices and a refresh method for the same. The system comprises a plurality of dynamic semiconductor memory devices and a controller. Each of the dynamic semiconductor memory devices includes a storage device for storing a designated number designating an order for performing a refresh operation, a refresh enable signal generating circuit for generating a refresh enable signal in response to a refresh control command supplied from the controller and a delaying circuit for delaying the refresh enable signal by different time intervals determined by the designated number.

Abstract: Memory modules and methods of testing memory modules are provided that include at least one memory device responsive to a memory clock signal having a memory clock frequency and a data buffer. The data buffer is responsive to a buffer clock signal having a first buffer clock frequency that is different from the memory clock frequency during a normal mode of operation and having a second buffer clock frequency that is equal to the memory clock frequency during a test mode of operation.

Abstract: An integrated circuit device includes a delay circuit that is configured to delay a clock signal and is further configured to generate an output data signal in response to the delayed clock signal and an input data signal. Multiple devices are configured to respectively receive the output data signal in response to the clock signal.

Abstract: A semiconductor memory device is disclosed that programmably varies an output pin transmitting output data from a comparator during a test mode. Also disclosed is a read method for the test mode. The semiconductor memory device includes a comparator that compares a plurality of output data read from the memory cell array and an output pin determining unit that programmably varies a pin transmitting an output of the comparator during the test mode. Thus, when multiple semiconductor memory devices are installed in a single memory module, the output pins of the semiconductor memory devices are variously determined using the output pin determining unit so that data can be simultaneously read from more than one semiconductor memory device at a time during a test of a memory module, to thereby reduce the module test time.