Patents by Inventor Jin-Hun Lee
Jin-Hun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12004296Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.Type: GrantFiled: April 4, 2022Date of Patent: June 4, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Lee, Chi Won Hwang, Eun Sun Kim, Yong Wan Ji, Young Hun You
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Patent number: 12004412Abstract: An inkjet printing apparatus, a dipole alignment method, and a display device manufacturing method are provided. The inkjet printing apparatus includes a stage, a print head part disposed above the stage, and an electric field generating part that provides an electric field to a space between the stage and the print head part. The dipole alignment method includes providing an electric field at an area above a target substrate, spraying ink including a dipole onto the target substrate through the area, and landing the dipole on the target substrate. The display device manufacturing method includes preparing a base layer on which first and second electrodes are disposed, spraying ink including a light emitting element onto the base layer through the area, landing the light emitting element between the first and second electrodes.Type: GrantFiled: April 8, 2019Date of Patent: June 4, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Heung Cheol Jeong, Byung Chul Lee, Myung Soo Huh, Jin Oh Kwag, Do Hun Lee
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Publication number: 20240179326Abstract: A method and an apparatus are disclosed for video coding using a nonrectangular block splitting structure prediction and transform accordingly. The video coding method and the apparatus additionally apply a nonrectangular block splitting structure, in addition to an existing splitting structure, to a current block. The video coding method and the apparatus generate reference samples according to the applied splitting structure and effectively perform prediction and transform on split blocks.Type: ApplicationFiled: February 2, 2024Publication date: May 30, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KWANGWOON UNIVERSITY INDUSTRY-ACADEMIC COLLABORATION FOUNDATIONInventors: Dong Gyu Sim, Min Hun Lee, Joo Hyung Byeon, Seung Wook Park, Jin Heo
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Publication number: 20240176959Abstract: Provided is a method of generating a language model using crossmodal information. The method includes: receiving language-based first modality information and non-language-based second modality information; converting the first modality information into a first byte sequence; converting the second modality information into a second byte sequence; converting the first and second byte sequences into a first embedding vector and a second embedding vector by applying an embedding technique for each modality; generating semantic association information between first and second modality information by inputting the first and second embedding vectors to a crossmodal transformer; and learning the language model by setting the generated semantic association information as training data.Type: ApplicationFiled: May 23, 2023Publication date: May 30, 2024Inventors: Jeong Heo, Young-Ae SEO, Jin SEONG, Jong Hun SHIN, Ki Young Lee, Soojong LIM, Young Kil Kim, Jihee Ryu
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Patent number: 11996554Abstract: A method for producing a high-nickel positive electrode active material, a positive electrode active material produced thereby, and a positive electrode and a lithium secondary battery including the same is provided. The method includes preparing a lithium composite transition metal oxide having a nickel content of 80 atm % or greater among transition metals, washing the lithium composite transition metal oxide, and mixing the washed lithium composite transition metal oxide with an aluminum raw material and heat treating the mixture at a temperature of 650° C. to 690° C. to obtain a positive electrode active material having a surface portion doped with aluminum.Type: GrantFiled: December 2, 2019Date of Patent: May 28, 2024Assignee: LG Energy Solution, Ltd.Inventors: Jin Tae Hwang, Dong Hun Lee, Sung Bin Park, Hyung Man Cho, Jung Min Han, Wang Mo Jung
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Publication number: 20240166611Abstract: The present invention relates to a novel triazole derivative or a salt thereof. The triazole derivative or the salt thereof according to the present invention induces or promotes browning of white adipocytes, and differentiates stem cells, embryonic cells, or preadipocytes to brown adipocytes or beige adipocytes. A composition comprising the triazole derivative or the salt thereof according to the present invention can treat, prevent, or alleviate obesity, obesity complications, diabetes, dyslipidemia, fatty liver, hypertension, metabolic syndrome, and insulin resistance syndrome.Type: ApplicationFiled: December 22, 2023Publication date: May 23, 2024Applicant: GYEONGGIDO BUSINESS & SCIENCE ACCELERATORInventors: Jin-Mo KU, Jin-Kyung IN, Jung-Hun LEE, Han-Na CHA
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Publication number: 20240153882Abstract: In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: January 18, 2024Publication date: May 9, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Khim, Won Chul Do, Sang Hyoun Lee, Ji Hun Yi, Ji Yeon Ryu
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Publication number: 20240142171Abstract: A substrate treating apparatus of the present disclosure comprises: a chamber member having an accommodation space configured to accommodate a vessel part where a substrate treatment region constituting a supercritical treatment space are formed, and an opening configured to move the substrate inside or outside; a shutter configured to open or close the chamber member; and a first exhaust part configured to discharge an internal air from the accommodation space to the outside, wherein the temperature of the substrate treatment region is increased.Type: ApplicationFiled: January 20, 2023Publication date: May 2, 2024Inventors: Seung Hoon OH, Ji Hyeong LEE, Jin Se PARK, Yong Joon IM, Young Hun LEE, Yong Sun KO
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Publication number: 20240145263Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed.Type: ApplicationFiled: January 20, 2023Publication date: May 2, 2024Inventors: Seung Hoon OH, Ki Bong KIM, Jong Doo LEE, Young Hun LEE, Mi So PARK, Jin Se PARK, Yong Sun KO
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Publication number: 20240140078Abstract: A textile fabric includes a textile fabric layer, a transparent film layer provided on the textile fabric layer, and a surface layer disposed on the transparent film layer. The transparent film layer has a two-layer structure including a first film layer having a first polyetherester-based copolymer and a second film layer having a second polyetherester-based copolymer disposed on the first film layer. The second film layer is provided on the textile fabric layer. A method of manufacturing the fabric includes preparing the textile fabric layer, forming the transparent film layer on the fabric layer, and laminating the textile fabric and transparent film layers through heat treatment.Type: ApplicationFiled: June 16, 2023Publication date: May 2, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, TKG ECO MATERIAL CO., LTD.Inventors: Hyun Dae Cho, Myoung Ryoul Lee, Seul Yi, Gu Hwan Kim, Jin Hun Cha
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Patent number: 11970613Abstract: Embodiments relate to a polymer film. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has a haze (HZ0) before autoclave treatment of 3% or less and a ?HZ24 represented by Equation 1a of 500% or less.Type: GrantFiled: June 26, 2020Date of Patent: April 30, 2024Assignee: SK MICROWORKS CO., LTD.Inventors: Jung Hee Ki, Sunhwan Kim, Sang Hun Choi, Dae Seong Oh, Han Jun Kim, Jin Woo Lee, Dong Jin Lim
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Publication number: 20240136531Abstract: A conductive composite material, a method of preparing the same, and a secondary battery including the same. The conductive composite material may increase the proportion of an active material when forming an electrode by chemically bonding a conductive material and a binder to each other. A method of preparing the conductive composite material comprises ionizing carbon-based particles in a predetermined polarity, ionizing PTFE particles in a polarity different from that of the carbon-based particles, and chemically bonding the ionized carbon-based particles and the ionized PTFE particles, which are ionized in different polarities, to each other.Type: ApplicationFiled: September 20, 2023Publication date: April 25, 2024Inventors: Seung Min Oh, Sung Ho Ban, Sang Hun Lee, Ko Eun Kim, Yoon Sung Lee, Chang Hoon Song, Hyeong Jun Choi, Jun Myoung Sheem, Jin Kyo Koo, Young Jun Kim
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Publication number: 20240128123Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.Type: ApplicationFiled: December 18, 2023Publication date: April 18, 2024Applicant: MagnaChip Semiconductor, Ltd.Inventors: Jin Won JEONG, Jang Hee LEE, Young Hun JUN, Jong Woon LEE, Jae Sik CHOI
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Publication number: 20240121945Abstract: A semiconductor memory device comprises a substrate including a first source/drain region and a second source/drain region, a trench between the first source/drain region and the second source/drain region and formed in the substrate, a cell gate insulating layer on sidewalls and a bottom surface of the trench, a cell gate electrode on the cell gate insulating layer, a work function control pattern on the cell gate electrode, including N-type impurities and a cell gate capping pattern on the work function control pattern. The work function control pattern includes a semiconductor material. The work function control pattern includes a first region and a second region between the first region and the cell gate electrode. A concentration of the N-type impurities in the first region is greater than a concentration of the N-type impurities in the second region.Type: ApplicationFiled: July 6, 2023Publication date: April 11, 2024Inventors: Jin-Seong Lee, Tai Uk Rim, Ji Hun Kim, Kyo-Suk Chae
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Patent number: 11940932Abstract: Provided is an operating method of a storage device. The method includes providing temperature information of each of a plurality of volatile memory devices in the storage device to a host device; and receiving a setting command related to a refresh operation of the plurality of volatile memory devices from the host device, wherein the plurality of volatile memory devices are classified into groups based on temperature information, and wherein the setting command indicates a number of rows of the plurality of volatile memory devices to be refreshed differently for each of the groups based on the temperature information.Type: GrantFiled: June 28, 2021Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo Hwan Oh, Seung-Hun Lee, Jin Hun Jeong, Chang Ho Yun, Kyung-Hee Han
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Publication number: 20240098390Abstract: The present disclosure provides a mobile communications system line number sheet management device and method. Provided, according to one aspect of the present disclosure, is a line number sheet management device and method, for automating access network-related line number sheet management by automatically collecting and updating line number information, the line number information being collected from a mobile communications base station management server (mobile communications system management server) and a fronthaul management server. Provided, according to another aspect of the present disclosure, is a fronthaul device for: acquiring unique information of a base station by receiving an optical signal from any one of a radio unit (RU) and a digital unit (DU); and transmitting the unique information of the base station to a fronthaul management server.Type: ApplicationFiled: November 26, 2020Publication date: March 21, 2024Inventors: Sun Ik LEE, Ka Yoon KIM, Jin Wook LEE, Sang Woo KIM, Jong Min LEE, Myung Hun SONG, Beum Geun CHO
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Publication number: 20240071690Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100?Cc2/Cc1?10,000.Type: ApplicationFiled: August 14, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop KIM, Jin Il KANG, Ji Hun LEE, Chang Hak CHOI
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Patent number: 11912902Abstract: The present invention relates to a composition for etching, comprising a first inorganic acid, a first additive represented by Chemical Formula 1, and a solvent. The composition for etching is a high-selectivity composition that can selectively remove a nitride film while minimizing the etch rate of an oxide film, and which does not have problems such as particle generation, which adversely affect the device characteristics.Type: GrantFiled: December 21, 2018Date of Patent: February 27, 2024Inventors: Jae-Wan Park, Jung-Hun Lim, Jin-Uk Lee
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Patent number: 11848465Abstract: An integrated cooling module of a fuel cell stack is attached to a housing of the fuel cell stack, and the integrated cooling module is connected to a plurality of components constituting a thermal management system of a fuel cell. In particular, the integrated cooling module includes: a first injection member defining flow paths guiding coolant into one or more components of the thermal management system of the fuel cell, and at least one second injection member coupled to the first injection member, and the coolants going through the components flow into the fuel cell stack through any one of the flow paths defined by the integrated cooling module.Type: GrantFiled: June 10, 2022Date of Patent: December 19, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Sun Ae Park, Jin Hun Lee, Hun Woo Park
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Publication number: 20230187661Abstract: Provided is an integrated structure of an ion filter and a reservoir according to an embodiment of the present disclosure. An integrated structure of an ion filter and a reservoir includes a reservoir storing coolant for cooling a fuel cell stack, an ion filter located inside the reservoir, and a control valve located inside the reservoir to be opened or closed so that the coolant flows into the ion filter, in which the reservoir is divided into a first region in which the ion filter is located by opening or closing the control valve and a second region that is a space other than the first region, and the first region and the second region are connected by an air vent unit through which air passes.Type: ApplicationFiled: November 8, 2022Publication date: June 15, 2023Inventors: Wook Il Jang, Tae Geum Kim, Soo Hwan Kim, Ji Hyun Lee, Jin Hun Lee, Oh Tak Kwon