Abstract: A transfer apparatus includes a multi-arm apparatus, a controller, and a vacuum part. The multi-arm apparatus has a plurality of blades for vacuum-absorbing or vacuum-retaining a semiconductor substrate, a fixed body joined to each of blades, and a positioning apparatus joined to each fixed body for rotational or straight-line movement of the fixed body and the blades. The apparatus further includes vacuum lines that are formed within the multi-arm apparatus. The vacuum lines are selectively opened and closed. Even when there is a vacant slot in the FOUP, a plurality of wafers can be concurrently unloaded.

Abstract: A rotary shaft and a rotating body are connected in such a way as to stably control the tilt of a wafer platen in an ion implanter. The rotary shaft has a key way and the rotating body has a boss into which the rotary shaft extends. A key integrates the rotary shaft and the rotary body so that they rotate together without slipping relative to each other. An end cap is screwed onto the rotary body over the end of the rotary shaft and the key. As a result, the wafer platen can be maintained at an accurate orientation or tilt relative to the ion beam produced by the implanter.

Abstract: A rotary shaft and a rotating body are connected in such a way as to stably control the tilt of a wafer platen in an ion implanter. The rotary shaft has a key way and the rotating body has a boss into which the rotary shaft extends. A key integrates the rotary shaft and the rotary body so that they rotate together without slipping relative to each other. An end cap is screwed onto the rotary body over the end of the rotary shaft and the key. As a result, the wafer platen can be maintained at an accurate orientation or tilt relative to the ion beam produced by the implanter.