Patents by Inventor Jin Hyun Park

Jin Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163466
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. Coding decision information of a representative channel of a target block is shared as coding decision information of a target channel of the target block, and decoding of the target block is performed using the coding decision information of the target channel. Since the coding decision information of the representative channel is shared with an additional channel, repeated signaling of identical coding decision information may be prevented. By means of this prevention, the efficiency of encoding and decoding of the target block or the like may be improved.
    Type: Application
    Filed: December 27, 2023
    Publication date: May 16, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, RESEARCH AND BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Dong-San JUN, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Jin-Ho Lee, Ha-Hyun Lee, Byeung-Woo Jeon, Hui-Yong Kim, Jee-Yoon Park
  • Publication number: 20240164217
    Abstract: The present invention relates to a piezoelectric ceramic stacked structure, and the piezoelectric ceramic stacked structure includes at least one first layer including a KNN-based ceramic; and at least one second layer including a BFO-based ceramic, wherein a ratio of a number (n1) of the first layers stacked to a number (n2) of the second layers stacked in the piezoelectric ceramic stacked structure satisfies Equation (1) below: 0.8×|q|/|p|?n1/n2?1.2×|q|/|p|??(1) (Equation (1) is as defined in the Description).
    Type: Application
    Filed: September 21, 2023
    Publication date: May 16, 2024
    Inventors: Min Ku LEE, Kyu Hyun PARK, Gyoung Ja LEE, Byung Hoon KIM, Jin Ju PARK
  • Publication number: 20240158669
    Abstract: Provided are: an optical laminate comprising a second adhesive layer, a second adhesive layer laminated on the second adhesive layer, and a light shield part laminated between the first adhesive layer and the second adhesive layer; an optical member comprising same; and an optical display device including same.
    Type: Application
    Filed: February 24, 2022
    Publication date: May 16, 2024
    Inventors: Ji Ho KIM, Sung Hyun MUN, Kyoung Gon PARK, Jin Young LEE, Jae Hyun HAN, Il Jin KIM, Dong Myeong SHIN
  • Publication number: 20240162120
    Abstract: A semiconductor device is provided. The semiconductor device includes first through third active patterns extending in and spaced apart from each other along a first direction on a first surface of a substrate; a first gate electrode extending in a second direction on the first active pattern; a first active cut between the first and second active patterns, wherein the first active cut extends in the second direction, and the first active cut is spaced apart from the first gate electrode in the first direction; a second active cut between the second and third active patterns, wherein the second active cut extends in the second direction, and the second active cut is spaced apart from the first active cut in the first direction; and a first through via extending vertically through the second active pattern between the first and second active cuts, and into the substrate.
    Type: Application
    Filed: June 5, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kern RIM, Doo Hyun LEE, Heon Jong SHIN, Jin Young PARK
  • Publication number: 20240161212
    Abstract: Disclosed are a guardian information-based animal integrated management server and an animal integrated management method thereof.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 16, 2024
    Inventors: Jong Ho Park, Jin Hyun Baek
  • Publication number: 20240162113
    Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 11, 2022
    Publication date: May 16, 2024
    Applicants: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Hyeon Park, Yun Ah Kim, Seok Ho Na, Won Ho Choi, Dong Su Ryu, Jo Hyun Bae, Min Jae Kong, Jin Young Khim, Jae Yeong Bae, Dong Hee Kang
  • Patent number: 11982618
    Abstract: A method of calibrating an optical sensor may include acquiring a first characteristic for an external light source through a detector of an optical sensor while an internal light source of the optical sensor is turned off; driving the internal light source; acquiring a second characteristic for the internal light source and the external light source through the detector, based on driving the internal light source; and acquiring a reference characteristic of the internal light source, for calculation of an absorbance of an object, based on the first characteristic and the second characteristic.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Hyun Nam, Hyeong Seok Jang, Jin Young Park
  • Patent number: 11973022
    Abstract: A semiconductor device includes a line; a source structure on the line; a stack structure on the source structure; a first slit structure penetrating the stack structure; a second slit structure penetrating the stack structure; and a contact plug adjacent to the first slit structure in a first direction. The first slit structure and the second slit structure may be spaced apart from each other by a first distance in a second direction that is perpendicular to the first direction. The contact plug penetrates the source structure, the contact plug being electrically connected to the lower line. The first slit structure and the contact plug may be spaced apart from each other by a second distance in the first direction, and the second distance may be longer than the first distance.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 30, 2024
    Assignee: SK hynix Inc.
    Inventors: Sang Yong Lee, Sae Jun Kwon, Sang Min Kim, Jin Taek Park, Sang Hyun Oh
  • Publication number: 20240136674
    Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 25, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
  • Publication number: 20240130670
    Abstract: The present invention relates to a wearable pressure ulcer detection sensor, and the wearable pressure ulcer detection sensor according to the present invention includes a pressure sensor measuring pressure based on a change in capacitance caused by physical force, a temperature sensor measuring temperature based on a change in electrical conductivity due to electron hopping, and an impedance sensor including two electrodes spaced apart from each other and in contact with skin.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 25, 2024
    Inventors: Jin-Woo Park, Seung-Rok KIM, Hye-Jun Kil, Jin-Hoon KIM, Soyeon LEE, Ju-Hyun Yoo, Je-Heon Oh, Ey-In Lee
  • Publication number: 20240123548
    Abstract: Embodiments relate to laser welding methods, monitoring methods, and monitoring systems for a secondary battery. A laser welding method for a secondary battery includes performing laser welding on a positive electrode base having a thin-film shape in which a plurality of positive electrode base tabs are formed at a side, a negative electrode base having a thin-film shape in which a plurality of negative electrode base tabs are formed at a side, and a thin-film multi-tab to be joined to each of the positive electrode base and the negative electrode base, a welded portion in which the multi-tab is welded with the positive electrode base and the negative electrode base being melting-joined by using a laser such that a plurality of welding spots is formed on the welded portion.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 18, 2024
    Inventors: Jae Hoon ROH, Sang Hyun RYU, Myung Jun PARK, Seong Bae AN, Yong Gyu AN, Hee Dong JUNG, Jin Gyu HEO
  • Publication number: 20240124627
    Abstract: An encapsulant composition for an optical device; comprises an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance. An encapsulant film for an optical device using the same is also provided.
    Type: Application
    Filed: November 10, 2022
    Publication date: April 18, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Jin Kuk Lee, Eun Jung Lee, Sang Eun Park, Sang Hyun Hong, Young Woo Lee, Jung Ho Jun
  • Publication number: 20240128517
    Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 18, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
  • Publication number: 20240120211
    Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.
    Type: Application
    Filed: September 15, 2023
    Publication date: April 11, 2024
    Inventors: Jin Young Kim, Doo Hyun Park, Seung Jae Lee
  • Patent number: 11956426
    Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 9, 2024
    Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Industry-Academia Cooperation Group of Sejong University
    Inventors: Jin-Ho Lee, Jae-Gon Kim, Jung-Won Kang, Do-Hyeon Park, Yung-Lyul Lee, Ha-Hyun Lee, Sung-Chang Lim, Hui-Yong Kim, Ji-Hoon Do, Yong-Uk Yoon
  • Publication number: 20240109398
    Abstract: Provided is a vehicle thermal management system, including: an HVAC subsystem thermally connected to a passenger compartment; and a powertrain cooling subsystem thermally connected to a powertrain component.
    Type: Application
    Filed: March 8, 2023
    Publication date: April 4, 2024
    Inventors: Ki Hyun Kim, Jin Hwan Lee, Wan Je Cho, Jung Ha Park
  • Patent number: 11944998
    Abstract: A method of fabricating a capacitive micromachined ultrasonic transducer (CMUT) according to one aspect of the present invention may include forming, on a semiconductor substrate, a first region implanted with impurity ions at a first average concentration and a second region implanted with no impurity ions or implanted with the impurity ions at a second average concentration lower than the first average concentration, forming an insulating layer by oxidizing the semiconductor substrate wherein the insulating layer includes a first oxide layer having a first thickness on at least a part of the first region and a second oxide layer having a second thickness smaller than the first thickness on at least a part of the second region, and forming a membrane layer on the insulating layer such that a gap is defined between the second oxide layer and the membrane layer.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: April 2, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Byung Chul Lee, Dong-Hyun Kang, Jin soo Park, Tae Song Kim
  • Publication number: 20240107002
    Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Se Yoon JEONG, Hui Yong KIM, Sung Chang LIM, Jin Ho LEE, Ha Hyun LEE, Jong Ho KIM, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Gwang Hoon PARK, Kyung Yong KIM, Tae Ryong KIM, Han Soo LEE
  • Publication number: 20240081393
    Abstract: A sidestream smoke removal device and a control method thereof are provided. The sidestream smoke removal device according to some embodiments of the present disclosure may include a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, and a heating portion disposed inside the housing to heat the smoking space. The heating portion may heat the smoking space to remove a smell generated due to by-products of smoking, and accordingly, the cleanliness of the sidestream smoke removal device can be improved.
    Type: Application
    Filed: July 11, 2022
    Publication date: March 14, 2024
    Applicant: KT&G CORPORATION
    Inventors: Seung Kyu HAN, Jin Won PARK, Jae Hyun KIM, Tae Heon KIM
  • Publication number: 20240088158
    Abstract: A display device includes: a substrate; a polycrystalline silicon film on the substrate; and a first buffer film between the substrate and the polycrystalline silicon film and having one surface contacting the polycrystalline silicon film and another surface opposite to the one surface, wherein the one surface of the first buffer film has a first root mean square (RMS) roughness range, and the first RMS roughness range is 1.5 nm or less.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Inventors: Ki Hyun KIM, Young Gil PARK, Jin Suk LEE, Jai Sun KYOUNG, Sug Woo JUNG