Patents by Inventor Jin Lee

Jin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240191911
    Abstract: An embodiment thermal management system of a vehicle includes an air supply device that draws and supplies ambient air. An air cycle apparatus connected to the air supply device that compresses or expands the air to be changed to a high or low temperature air. An air distribution device is connected to the air cycle apparatus and a cabin room connected to the air distribution device that receives the high or low temperature air. A first heat-exchanger connected to the air cycle apparatus performs heat-exchange on the high temperature air and a second heat-exchanger connected to the first heat-exchanger and the air cycle apparatus performs heat-exchange on the air. The second heat-exchanger and the air distribution device are selectively connected and the air having heat-exchanged while passing through the second heat-exchanger is selectively supplied to the air distribution device.
    Type: Application
    Filed: April 24, 2023
    Publication date: June 13, 2024
    Inventors: Man Hee Park, Hochan An, Wan Je Cho, Yeonho Kim, Jeawan Kim, Hoyoung Jeong, Yeong Jun Kim, Jae Yeon Kim, Gwi Taek Kim, Ki Cheol Park, Kyeong Su Kim, Tea Jin Lee
  • Publication number: 20240194127
    Abstract: Provided are a display device and a tiled display comprising the same. The display device includes PWM data lines for respectively receiving PWM data voltages, first to third data lines for respectively receiving first to third data voltages, sub-pixels respectively connected to the PWM data lines, respectively connected to the first to third data lines, and respectively including at least one light-emitting element, a global power supply line for receiving a global power supply voltage, and a first demultiplexer between the PWM data lines and the global power supply line, wherein the PWM data voltages have grayscale voltages from a black grayscale voltage to a white grayscale voltage, the black grayscale voltage being greater than or equal to the global power supply voltage.
    Type: Application
    Filed: October 13, 2023
    Publication date: June 13, 2024
    Inventors: Sang Jin JEON, Min Chul SHIN, Jung Hwan HWANG, Sung Hwan KIM, Ji Youn SEO, Kye Uk LEE
  • Publication number: 20240193701
    Abstract: A communication system retrieves profile data corresponding to a user profile of a second user, identifies a status message in the profile data, display, via a user interface of the instant messenger application, the status message; in response to receiving, via the user interface, a user input associated with the status message: query, based on the status message, a database to identify one or more items, and display, via the user interface of the instant messenger application, item data corresponding to the one or more items, receive, via the user interface, a user input associated with the one or more items, instantiate a transaction authentication of the one or more items by causing transmission of transaction information data associated with the first user, and cause, based on the transaction authentication of the one or more items, delivery of the one or more items to an account of the second user.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 13, 2024
    Inventors: Sul Gi Kim, Ji Hwi Park, Yun Jin Kim, Nam Hee Ko, Hye Seon Kim, Bo Young Jang, Sun Je Bang, Ji On Chu, Seung Yong Ji, Jae Ick Hwang, Eun Ho Son, Sang Min Seo, Jeong Ryeol Choi, Hye Mi Lee, Shin Young Lee, Seung Uk Jeong
  • Publication number: 20240194269
    Abstract: A memory device includes a memory cell array having a plurality of memory blocks therein, including a target memory block. A voltage generator is provided, which is configured to generate an erase voltage and row line voltages, which are provided to the target memory block upon which an erase operation is to be performed. Control logic is provided, which is configured to control the memory cell array and the voltage generator. In addition, during operation, the erase voltage is provided to at least one of a bitline or a common source line associated with the target memory block, and a gate line of a transistor provided with the erase voltage is precharged before the erase voltage is provided to the at least one of the bitline or the common source line of the target memory block.
    Type: Application
    Filed: November 22, 2023
    Publication date: June 13, 2024
    Inventors: Byungsoo KIM, Yohan LEE, Hyunggon KIM, Sang Soo PARK, Bongsoon LIM, Jin-Young CHUN
  • Publication number: 20240193741
    Abstract: Provided are a method and apparatus for correcting a colored image. The method of correcting a colored image includes obtaining a colored image by inputting a sketch image to a first artificial neural network, receiving user input data for a target area in the colored image, and obtaining a corrected image in which a color state of the target area has been changed, by inputting the sketch image and the user input data to a second artificial neural network.
    Type: Application
    Filed: November 10, 2023
    Publication date: June 13, 2024
    Inventors: Kwang Jin LEE, Jae Gul CHOO, Eung Yeup KIM, Sang Hyeon LEE, Jeong Hoon PARK, So Mi CHOI
  • Patent number: 12007333
    Abstract: A system for inspecting thin glass includes: a housing including a body and a cover; a first shuttle which fixes an edge portion of the thin glass and reciprocates in a first axis direction; a first inspection part disposed on the body and which measures a position of a defect formed in the thin glass by taking a picture of the thin glass; a transport shuttle which separates the thin glass from the first shuttle, a second shuttle which separates the thin glass from the transport shuttle, fixes the thin glass, and reciprocates the upper surface of the body; and a second inspection part disposed on the body and spaced apart from the first inspection part and which inspects the position of the defect by taking an enlarged picture of the position of the defect. The first shuttle tensions and fixes the thin glass.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: June 11, 2024
    Assignees: SAMSUNG DISPLAY CO., LTD., DIGITAL IMAGING TECHNOLOGY
    Inventors: Janghoon Lee, Jin Woo Kim, Cheol Hyun Cho, Jayoung Cho, Leegu Han
  • Patent number: 12006117
    Abstract: Provided is a container including a container portion configured to form a storage space in which contents are stored, a head portion disposed at an upper side of the container portion and configured to promote discharge of the contents, which enter the head portion from the container portion, through an internal pressure change caused by a pressing portion which is formed at one side of the head portion and made of an elastic material, and a nozzle configured to discharge the contents, which enter the nozzle from the head portion, in fixed amounts.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: June 11, 2024
    Assignee: YONWOO CO., LTD.
    Inventors: Chang Soo Lee, Sang In Han, Hye Jin Jung, Hee Yoon Kim
  • Patent number: 12006384
    Abstract: The present application relates to a pinning composition, a laminate comprising the same, and a method for producing the same. The pinning composition of the present application can impart directionality and location selection properties to a polymer membrane comprising a self-assembly structure of a block copolymer. The pinning composition of the present application exhibits excellent reaction selectivity, whereby it can form a vertical lamella structure with a high degree of alignment. In addition, the pinning composition of the present application may be suitable for application to low temperature processes.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: June 11, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Se Jin Ku, Mi Sook Lee, Na Na Kang, Eung Chang Lee, Sung Soo Yoon, No Jin Park, Je Gwon Lee, Eun Young Choi, Hyung Ju Ryu, Yoon Hyung Hur
  • Patent number: 12006592
    Abstract: The invention is directed to products and methods for preparing self-seeding vascular constructs generated as a bi-layered electrospun matrices, conjugated with EPC-specific antibodies and anti-thrombogenic agents on the inner surfaces of their lumens.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: June 11, 2024
    Assignee: Wake Forest University Health Sciences
    Inventors: Sang Jin Lee, James J. Yoo, Young Min Ju, Anthony Atala
  • Patent number: 12005999
    Abstract: A ship comprises: a liquefied gas storage tank; a multi-stage compressor for compressing a boil-off gas discharged from a storage tank and comprising a plurality of compression cylinders; a second heat exchanger for heat exchanging a fluid, which has been compressed by the multi-stage compressor, and thus cooling same; a first decompressing device for expanding a flow (“flow a1”) partially branched from the flow (“flow a”) that has been cooled by the second heat exchanger; a third heat exchanger for heat exchanging, by “flow a1” which has been expanded by the first decompressing device as a refrigerant, the remaining flow (“flow a2”) of “flow a” after excluding “flow a1” that has been branched and thus cooling same; and a second decompressing device for expanding “flow a2” which has been cooled by the third heat exchanger.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: June 11, 2024
    Assignee: HANWHA OCEAN CO., LTD.
    Inventors: Seung Chul Lee, Seon Jin Kim
  • Patent number: 12006757
    Abstract: Disclosed herein is an over-slam bumper for a vehicle. The over-slam bumper includes: a bumper unit (100) of which an end portion protrudes toward a door to absorb shock generated between a vehicle body and the door; and a mounting unit (200) coupled with the bumper unit (100) to fix the bumper unit to the vehicle body, wherein the bumper unit (100) includes: an elastic part for absorbing shock generated when getting in contact with the door; and a coupling part (116) connected to the elastic part and coupled with the mounting unit (200). The elastic part includes a buckling part (111) for absorbing shock by buckling; a compression part (130) for absorbing shock by compression; and an elastic air compression part for absorbing shock by sealing the inside air to compress inside air.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: June 11, 2024
    Assignee: DMC, INC
    Inventors: Hyung Joon Kim, Hyung Jin Kim, Jung Un Jung, Byung Gu Jang, Jong Hyun Park, Won Wook Lee, Gi Uk Seo
  • Patent number: 12008952
    Abstract: A pixel includes: a light-emitting element including an anode and a cathode, a first transistor including a first and a second electrode and a gate electrode connected with a first node, a third transistor connected between the second electrode of the first transistor and the first node and including a gate electrode connected with a first scan line, a sixth transistor connected between the second electrode of the first transistor and the anode and including a gate electrode connected with a first emission line, and a seventh transistor connected between the anode and an initialization voltage line and including a gate electrode connected with a second scan line. During an initialization period, the third, sixth, and seventh transistors are turned on such that an initialization voltage from the initialization voltage line is transferred to the gate electrode of the first transistor.
    Type: Grant
    Filed: July 20, 2023
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jin-Wook Yang, Yu-Chol Kim, Donggyu Lee, Jae-Hyeon Jeon
  • Patent number: 12009150
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Woo Chul Shin, Seung Heui Lee, Beom Seock Oh
  • Patent number: 12010912
    Abstract: A novel heterocyclic compound of Chemical Formula 1 and organic light emitting device including the same.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: June 11, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Min Woo Jung, Dong Hoon Lee, Boonjae Jang, Jungha Lee, Su Jin Han, Seulchan Park, Sunghyun Hwang
  • Patent number: 12009154
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hye Han, Jung Min Kim, Byung Woo Kang, Hong Je Choi, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
  • Patent number: 12008443
    Abstract: A method for training an analysis model according to an embodiment includes receiving synthetic data for original data from a client apparatus, determining a hyperparameter value for analysis model training using the synthetic data, receiving a ciphertext for the original data from the client apparatus, and training the analysis model using the determined hyperparameter value and the received cipher text.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Eun Kyung Kim, Hyo Jin Yoon, Ji Hoon Cho, Min Jung Kim, Young Seon Lee
  • Patent number: 12009288
    Abstract: Disclosed are interconnection structures and semiconductor packages. The interconnection structure includes a first dielectric layer and a first hardmask pattern that are sequentially stacked, and a first interconnection pattern that penetrates the first hardmask pattern and the first dielectric layer. The first hardmask pattern includes a dielectric material having an etch selectivity with respect to the first dielectric layer. The first interconnection pattern includes a via part, a first pad part, and a line part that are integrally connected to each other. The first pad part vertically overlaps the via part. The line part extends from the first pad part. A level of a bottom surface of the first pad part is lower than a level of a bottom surface of the line part.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: June 11, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dongjoon Oh, Junyun Kweon, Jumyong Park, Jin Ho An, Chungsun Lee, Hyunsu Hwang
  • Patent number: 12009289
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: June 11, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Patent number: 12010795
    Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: June 11, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Il Sik Nam, Yong Suk Kim, Dong Keun Lee, Tae Ki Kim, Hye Jin Jo
  • Patent number: D1030859
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: June 11, 2024
    Assignee: LG HOUSEHOLD & HEALTH CARE LTD.
    Inventors: Ji Hee Lee, Hyeon Jin Kweon, Sung Hyoun Jang