Abstract: A coil component includes a magnetic body including first and second coil patterns respectively disposed on first surfaces of two substrates spaced apart from each other and having cores and third and fourth coil patterns respectively disposed on second surfaces of the two substrates; and first to fourth external electrodes disposed on outer peripheral surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates while being located in at least one of upper and lower regions of the magnetic body in a thickness direction.

Abstract: A coil-embedded integrated circuit substrate includes a core substrate having an at least partially machined space formed herein, a coil disposed in the at least partially machined space, a filling material filling air gaps in a space around the coil in the at least partially machined space, and insulating layers formed on upper and lower surfaces of the core substrate.

Abstract: A multilayer ceramic capacitor includes a body including an active region including first and second internal electrodes, and an upper cover region disposed on the active region, and a lower cover region disposed below the active region. First and second external electrodes are disposed on first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively. At least one stress dispersion pattern occupying an area equal to 30% to 95% of an area of the first or second internal electrode is disposed in the cover region.

Abstract: A power inductor includes: a substrate on which an internal electrode coil pattern is formed; and composite layers formed by alternately stacking first sheets formed of a mixture of coarse metal powder and fine metal powder and second sheets formed of fine metal powder on the internal electrode coil pattern of the substrate, thereby obtaining high inductance.

Abstract: A multilayer ceramic capacitor includes a body including an active region including first and second internal electrodes, and an upper cover region disposed on the active region, and a lower cover region disposed below the active region. First and second external electrodes are disposed on first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively. At least one stress dispersion pattern occupying an area equal to 30% to 95% of an area of the first or second internal electrode is disposed in the cover region.

Abstract: A coil component includes a magnetic body including first and second coil patterns disposed on first surfaces of two substrates spaced apart from each other and third and fourth coil patterns disposed on second surfaces of the two substrates, respectively, the substrates having respective cores; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates and in a central portion of the magnetic body in a thickness direction thereof.

Abstract: A coil-embedded integrated circuit substrate includes a core substrate having an at least partially machined space formed herein, a coil disposed in the at least partially machined space, a filling material filling air gaps in a space around the coil in the at least partially machined space, and insulating layers formed on upper and lower surfaces of the core substrate.

Abstract: A coil component includes a magnetic body including first and second coil patterns disposed on first surfaces of two substrates spaced apart from each other and third and fourth coil patterns disposed on second surfaces of the two substrates, respectively, the substrates having respective cores; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates and in a central portion of the magnetic body in a thickness direction thereof.

Abstract: A coil component includes a magnetic body including first and second coil patterns respectively disposed on first surfaces of two substrates spaced apart from each other and having cores and third and fourth coil patterns respectively disposed on second surfaces of the two substrates; and first to fourth external electrodes disposed on outer peripheral surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates while being located in at least one of upper and lower regions of the magnetic body in a thickness direction.

Abstract: An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. The lead parts include a plurality of protruding portions spaced apart from each other and connected to the ends of the internal coil parts to protrude externally from the ends of the internal coil parts.

Abstract: A power inductor includes: a substrate on which an internal electrode coil pattern is formed; and composite layers formed by alternately stacking first sheets formed of a mixture of coarse metal powder and fine metal powder and second sheets formed of fine metal powder on the internal electrode coil pattern of the substrate, thereby obtaining high inductance.

Abstract: A coil component assembly includes a support member, a plurality of processed spaces penetrating through the support member, a plurality of coils disposed in the plurality of processed spaces, respectively, and a magnetic material covering the support member and the plurality of coils. The coil component assembly can be diced to form individually coil components.