Patents by Inventor Jin O Yoo
Jin O Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240055186Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers disposed in a first direction, a plurality of first internal electrodes disposed in the first direction, and a plurality of second internal electrodes disposed in the first direction. At least a portion of the plurality of first internal electrodes and the plurality of second internal electrodes are spaced apart from each other on a same dielectric layer among the plurality of dielectric layers to have a gap, and among at least three gaps adjacent in the first direction, a gap having a greater distance in the first direction from a reference of the body in the first direction has a greater distance in one direction from a reference of the body in the one direction.Type: ApplicationFiled: May 3, 2023Publication date: February 15, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Ghyu Ahn, Hwi Dae Kim, Jin O Yoo
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Publication number: 20230154678Abstract: A multilayer ceramic capacitor includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; and a first external electrode and a second external electrode disposed externally on the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first and second external electrodes are disposed on the body, and includes a first electrode layer including Ni and Cr, a second electrode layer disposed on the first electrode layer, and including Cu, and a plating layer disposed on the second electrode layer.Type: ApplicationFiled: October 25, 2022Publication date: May 18, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Taek Jung LEE, Beom Seock OH, Ho Jun LEE, Kyung Mi BAE, Jin O YOO
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Publication number: 20230091278Abstract: A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween; a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode; a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body.Type: ApplicationFiled: June 14, 2022Publication date: March 23, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae Kim, Won Chul Sim, Taek Jung Lee, Jin O Yoo, Young Ghyu Ahn
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Publication number: 20200304167Abstract: A front end module includes: a first filter and a second filter, the first filter and the second filter being configured to respectively support cellular communications in different frequency bands among a first frequency band and a second frequency band of a sub-6 GHz band; a third filter configured to support Wi-Fi communications in a third frequency band of a 5 GHz band, and having one end connected to an antenna terminal; and a switch configured to selectively connect one end of the first filter and one end of the second filter to the antenna terminal.Type: ApplicationFiled: July 11, 2019Publication date: September 24, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Wook KWON, Yun Tae LEE, Seong Jong CHEON, Sung Jae YOON, Jin O YOO
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Patent number: 9793223Abstract: There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode formed on one surface thereof; at least one electronic component mounted on one surface of the substrate; an insulation layer including an exposed part exposing the ground electrode and a cover part covering the electronic component; and a shielding layer electrically connected to the ground electrode and covering the insulation layer.Type: GrantFiled: September 26, 2016Date of Patent: October 17, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jin O Yoo
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Publication number: 20170012003Abstract: There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode formed on one surface thereof; at least one electronic component mounted on one surface of the substrate; an insulation layer including an exposed part exposing the ground electrode and a cover part covering the electronic component; and a shielding layer electrically connected to the ground electrode and covering the insulation layer.Type: ApplicationFiled: September 26, 2016Publication date: January 12, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jin O YOO
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Patent number: 9508624Abstract: There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode formed on one surface thereof; at least one electronic component mounted on one surface of the substrate; an insulation layer including an exposed part exposing the ground electrode and a cover part covering the electronic component; and a shielding layer electrically connected to the ground electrode and covering the insulation layer.Type: GrantFiled: August 27, 2012Date of Patent: November 29, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jin O Yoo
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Publication number: 20160255726Abstract: A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud.Type: ApplicationFiled: May 10, 2016Publication date: September 1, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jin O YOO
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Patent number: 9392697Abstract: A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud.Type: GrantFiled: July 10, 2014Date of Patent: July 12, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jin O Yoo
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Publication number: 20160029479Abstract: An electrostatic discharge (ESD) protection board may include an electrostatic discharge (ESD) protection board, including a substrate, a pattern layer including circuit patterns formed on the substrate, and a high-voltage conductive material formed on the circuit patterns, which are insulated from each other, and a portion of the substrate between the circuit patterns.Type: ApplicationFiled: July 23, 2015Publication date: January 28, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin O YOO, Keun Hoi KOO
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Publication number: 20150189749Abstract: A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud.Type: ApplicationFiled: July 10, 2014Publication date: July 2, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jin O YOO
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Publication number: 20150173197Abstract: A printed circuit board having an inductor embedded therein may include a conductive coil part embedded in an insulating layer; and a magnetic material part integrally formed so as to enclose a vicinity of the conductive coil part. In the printed circuit board having the inductor embedded therein, a gap between coils is narrowed and coils having a high height and a narrow width are formed, whereby resistance may be decreased and a higher inductance value may be implemented in a narrow area.Type: ApplicationFiled: August 6, 2014Publication date: June 18, 2015Inventors: Suk Hyeon Cho, Yong Sam Lee, Jin O Yoo
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Publication number: 20150004753Abstract: There are provided a semiconductor package including an electromagnetic shielding structure having excellent electromagnetic interference (EMI) and electromagnetic susceptibility (EMS) characteristics, while protecting individual elements in an inner portion thereof from impacts, and a manufacturing method thereof. The semiconductor package includes: a substrate having ground electrodes formed on an upper surface thereof; at least one electronic component mounted on the upper surface of the substrate; an insulating molding part including an internal space in which the electronic component is accommodated, and fixed to the substrate such that at least a portion of the ground electrode is externally exposed; and a conductive shield part closely adhered to the molding part to cover an outer surface of the molding part and electrically connected to the externally exposed ground electrodes.Type: ApplicationFiled: September 16, 2014Publication date: January 1, 2015Inventor: Jin O. YOO
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Patent number: 8558377Abstract: There is provided a semiconductor package module capable of minimizing a thickness of the module in spite of including an electronic element having a large size. The semiconductor package module includes: a semiconductor package having a shield formed on an outer surface and a side thereof and at least one receiving part provided in a lower surface thereof, the receiving part having a groove shape; and a main substrate having at least one large element and the semiconductor package mounted on one surface thereof, wherein the large element is received in the receiving part of the semiconductor package and is mounted on the main substrate.Type: GrantFiled: November 1, 2011Date of Patent: October 15, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jin O Yoo
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Publication number: 20130082367Abstract: There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode formed on one surface thereof; at least one electronic component mounted on one surface of the substrate; an insulation layer including an exposed part exposing the ground electrode and a cover part covering the electronic component; and a shielding layer electrically connected to the ground electrode and covering the insulation layer.Type: ApplicationFiled: August 27, 2012Publication date: April 4, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jin O YOO
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Publication number: 20130037923Abstract: There are provided a semiconductor package capable including an electromagnetic wave shielding structure having excellent electromagnetic interference (EMI) shielding characteristics while protecting individual elements therein from impacts, and a method of manufacturing the same. The semiconductor package includes: a substrate having ground electrodes formed on an upper surface thereof; at least one electronic component mounted on the upper surface of the substrate; an underfill resin filled in a space between the electronic component and the substrate; and a conductive shield part formed along an outer surface formed by the electronic component and the underfill resin and electrically connected to the ground electrodes.Type: ApplicationFiled: August 3, 2012Publication date: February 14, 2013Inventor: Jin O YOO
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Publication number: 20120104571Abstract: There are provided a semiconductor package including an electromagnetic shielding structure having excellent electromagnetic interference (EMI) and electromagnetic susceptibility (EMS) characteristics, while protecting individual elements in an inner portion thereof from impacts, and a manufacturing method thereof. The semiconductor package includes: a substrate having ground electrodes formed on an upper surface thereof; at least one electronic component mounted on the upper surface of the substrate; an insulating molding part including an internal space in which the electronic component is accommodated, and fixed to the substrate such that at least a portion of the ground electrode is externally exposed; and a conductive shield part closely adhered to the molding part to cover an outer surface of the molding part and electrically connected to the externally exposed ground electrodes.Type: ApplicationFiled: October 18, 2011Publication date: May 3, 2012Inventor: Jin O. YOO
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Publication number: 20120104572Abstract: There is provided a semiconductor package module capable of minimizing a thickness of the module in spite of including an electronic element having a large size. The semiconductor package module includes: a semiconductor package having a shield formed on an outer surface and a side thereof and at least one receiving part provided in a lower surface thereof, the receiving part having a groove shape; and a main substrate having at least one large element and the semiconductor package mounted on one surface thereof, wherein the large element is received in the receiving part of the semiconductor package and is mounted on the main substrate.Type: ApplicationFiled: November 1, 2011Publication date: May 3, 2012Inventor: Jin O. YOO
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Publication number: 20030171035Abstract: A connecting structure between a USB connector plugged into USB ports of a computer unit and a USB device, which enables a printed circuit board of the USB device and the USB connector to carry out their function even in the reversed position, is disclosed. The connecting structure includes a printed circuit to be electrically connected to the computer unit, which is provided at its both surfaces with signal terminals such that the printed circuit board has the same arrangement of the signal terminals, regardless of the position of the USB device, and a USB connector which is inserted into the USB device and a USB port of the computer unit at its both ends, the USB connector having conductive strips corresponding to the signal terminals of the printed circuit board.Type: ApplicationFiled: June 3, 2002Publication date: September 11, 2003Applicant: Samsung Electro-Mechanics Co., Ltd.Inventor: Jin O Yoo