Patents by Inventor Jin Oonuki

Jin Oonuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR INTEGRATED-CIRCUIT DEVICE AND METHOD OF PRODUCING THE SAME
    Publication number: 20140308811
    Abstract: A semiconductor integrated-circuit device using the copper wiring having increased electromigration resistance, low resistivity, and a line width of 70 nm or less, is provided. The present invention is characterized by the annealing treatment wherein a copper wiring having a line width of 70 nm or less is heated with a heating rate of 1K to 10K per second, and then the temperature is constantly maintained for a prescribed time duration.
    Type: Application
    Filed: April 18, 2014
    Publication date: October 16, 2014
    Applicant: IBARAKI UNIVERSITY
    Inventors: Yasushi SASAJIMA, Jin OONUKI, Suguru TASHIRO, Khyou Pin KHOO
  • SEMICONDUCTOR INTEGRATED-CIRCUIT DEVICE AND METHOD OF PRODUCING THE SAME
    Publication number: 20120146220
    Abstract: A semiconductor integrated-circuit device using the copper wiring having increased electromigration resistance, low resistivity, and a line width of 70 nm or less, is provided. The present invention is characterized by the annealing treatment wherein a copper wiring having a line width of 70 nm or less is heated with a heating rate of 1 K to 10 K per second, and then the temperature is constantly maintained for a prescribed time duration.
    Type: Application
    Filed: December 3, 2009
    Publication date: June 14, 2012
    Applicant: IBARAKI UNIVERSITY
    Inventors: Yasushi Sasajima, Jin Oonuki, Suguru Tashiro, Khyou Pin Khoo