Patents by Inventor Jin Woo Kang
Jin Woo Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240179320Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.Type: ApplicationFiled: February 2, 2024Publication date: May 30, 2024Inventors: Sung Chang LIM, Jung Won KANG, Ha Hyun LEE, Jin Ho LEE, Hui Yong KIM, Yung Lyul LEE, Ji Yeon JUNG, Nam Uk KIM, Myung Jun KIM, Yang Woo KIM, Dae Yeon KIM, Jae Gon KIM, Do Hyeon PARK
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Publication number: 20240178188Abstract: Semiconductor packages and methods of fabricating the same are provided. The semiconductor package includes a first package substrate including a first area, a first semiconductor chip mounted on the first area, a second package substrate disposed on an upper surface of the first semiconductor chip and including a second area and a first hole penetrating through the second area, a second semiconductor chip mounted on the second area, a connection member electrically connecting the first package substrate and the second package substrate and between the first package substrate and the second package substrate, and a mold film covering the second semiconductor chip on the second package substrate, filling the first hole, and covering the first semiconductor chip and the connection member on the first package substrate.Type: ApplicationFiled: August 1, 2023Publication date: May 30, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Myung-Sung KANG, Kyong Hwan KOH, Jin-Woo PARK, Chung Sun LEE, Hyeon Jun JIN
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Publication number: 20240163466Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. Coding decision information of a representative channel of a target block is shared as coding decision information of a target channel of the target block, and decoding of the target block is performed using the coding decision information of the target channel. Since the coding decision information of the representative channel is shared with an additional channel, repeated signaling of identical coding decision information may be prevented. By means of this prevention, the efficiency of encoding and decoding of the target block or the like may be improved.Type: ApplicationFiled: December 27, 2023Publication date: May 16, 2024Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, RESEARCH AND BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Dong-San JUN, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Jin-Ho Lee, Ha-Hyun Lee, Byeung-Woo Jeon, Hui-Yong Kim, Jee-Yoon Park
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Patent number: 11969232Abstract: An apparatus for non-invasively estimating bio-information includes an image sensor configured to acquire a first contact image of an object, based on the object being in contact with the image sensor, an actuator, and a processor configured to determine a contact position and a direction of the object, based on the acquired first contact image, and control the actuator to adjust a position of the image sensor, based on the determined contact position and the determined direction of the object so that a field of view (FOV) of the image sensor moves to a predefined measurement area on the object.Type: GrantFiled: April 22, 2021Date of Patent: April 30, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Min Kang, Seung Woo Noh, Sang Yun Park, Jin Woo Choi
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Publication number: 20240138260Abstract: The present disclosure relates to a plurality of host materials, an organic electroluminescent compound, and an organic electroluminescent device comprising the same. By comprising a specific combination of host compounds and/or an organic electroluminescent compound according to the present disclosure as an organic electroluminescent material, an organic electroluminescent device having low driving voltage and/or high luminous efficiency and/or long lifespan characteristics can be provided.Type: ApplicationFiled: September 8, 2023Publication date: April 25, 2024Inventors: Ji-Song JUN, Hong-Se OH, Dong-Hyung LEE, Sang-Hee CHO, Du-Yong PARK, Hyun-Woo KANG, Jin-Man KIM
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11963439Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: GrantFiled: August 24, 2022Date of Patent: April 16, 2024Assignee: Rohm and Haas Electronic Materials Korea Ltd.Inventors: Eun-Joung Choi, Young-Kwang Kim, Su-Hyun Lee, So-Young Jung, YeJin Jeon, Hong-Se Oh, Dong-Hyung Lee, Jin-Man Kim, Hyun-Woo Kang, Mi-Ja Lee, Hee-Ryong Kang, Hyo-Nim Shin, Jeong-Hwan Jeon, Sang-Hee Cho
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Patent number: 11961679Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.Type: GrantFiled: November 2, 2021Date of Patent: April 16, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo Kim, Eun Jung Lee, Jong Suk Jeong, Chun Hee Seo, Jong Hoon Yoo, Tae Hyung Kim, Ho Sam Choi, Sim Chung Kang
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Publication number: 20240120251Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a base semiconductor chip, a chip structure on the base semiconductor chip, a connection terminal between the base semiconductor chip and the chip structure, and a molding layer surrounding the chip structure and the connection terminal. The chip structure includes a first semiconductor chip including a first frontside pad and a first backside pad, and a second semiconductor including a second frontside pad and a second backside pad. A lateral surface of the first semiconductor chip is aligned with that of the second semiconductor chip. The first backside pad and the second frontside pad partially overlap each other when viewed in plan while being in direct contact with each other. The first backside pad and the second frontside pad include the same metal and are formed into a single unitary piece.Type: ApplicationFiled: June 25, 2023Publication date: April 11, 2024Inventors: JIN-WOO PARK, UN-BYOUNG KANG, CHUNGSUN LEE
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Patent number: 11955124Abstract: An example electronic device includes a housing; a touchscreen display; a microphone; at least one speaker; a button disposed on a portion of the housing or set to be displayed on the touchscreen display; a wireless communication circuit; a processor; and a memory. When a user interface is not displayed on the touchscreen display, the electronic device enables a user to receive a user input through the button, receives user speech through the microphone, and then provides data on the user speech to an external server. An instruction for performing a task is received from the server. When the user interface is displayed on the touchscreen display, the electronic device enables the user to receive the user input through the button, receives user speech through the microphone, and then provides data on the user speech to the external server.Type: GrantFiled: January 10, 2022Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Ki Kang, Jang-Seok Seo, Kook-Tae Choi, Hyun-Woo Kang, Jin-Yeol Kim, Chae-Hwan Li, Kyung-Tae Kim, Dong-Ho Jang, Min-Kyung Hwang
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Publication number: 20240096888Abstract: A super-steep switching device and an inverter device using the same are disclosed. The super-steep switching device includes a semiconductor channel disposed on a substrate and made of a semiconductor material having impact ionization characteristic; a source electrode and a drain electrode in contact with the semiconductor channel, wherein the source electrode and the drain electrode are disposed on the substrate and are spaced apart from each other; and a gate electrode disposed on the semiconductor channel so as to overlap only a portion of the semiconductor channel, wherein a top surface of the semiconductor channel includes a first area overlapping the gate electrode, and a second area non-overlapping the gate electrode, wherein a ratio of a length of the first area and a length of the second area is in a range of 1:0.1 to 0.4.Type: ApplicationFiled: September 8, 2022Publication date: March 21, 2024Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Hae Ju CHOI, Tae Ho KANG, Chan Woo KANG, Hyeon Je SON, Jin Hong PARK, Sung Joo LEE, Sung Pyo BAEK
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Publication number: 20240098311Abstract: The present invention relates to an image encoding/decoding method and apparatus. An image encoding method according to the present invention may comprise generating a transform block by performing at least one of transform and quantization; grouping at least one coefficient included in the transform block into at least one coefficient group (CG); scanning at least one coefficient included in the coefficient group; and encoding the at least one coefficient.Type: ApplicationFiled: November 20, 2023Publication date: March 21, 2024Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITYInventors: Sung Chang LIM, Jung Won KANG, Hyun Suk KO, Jin Ho LEE, Dong San JUN, Ha Hyun LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI, Yung Lyul LEE, Jun Woo CHOI
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Patent number: 11930179Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.Type: GrantFiled: December 27, 2019Date of Patent: March 12, 2024Assignees: Electronics and Telecommunications Research Institute, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNI, CHIPS & MEDIA, INC, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITYInventors: Sung Chang Lim, Jung Won Kang, Ha Hyun Lee, Jin Ho Lee, Hui Yong Kim, Yung Lyul Lee, Ji Yeon Jung, Nam Uk Kim, Myung Jun Kim, Yang Woo Kim, Dae Yeon Kim, Jae Gon Kim, Do Hyeon Park
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Publication number: 20240072000Abstract: A semiconductor package includes a substrate; a substrate pad on the substrate; a first semiconductor chip and a second semiconductor chip on the substrate; a connective terminal between the substrate pad and the first semiconductor chip and between the substrate pad and the second semiconductor chip; a dummy pad on the substrate, and spaced apart from the substrate pad, wherein the dummy pad is between the first semiconductor chip and the second semiconductor chip; and an underfill material layer interposed between the substrate and the first semiconductor chip and between the substrate and the second semiconductor chip, wherein the dummy pad and the substrate pad include a same material.Type: ApplicationFiled: August 25, 2023Publication date: February 29, 2024Inventors: Jin-Woo PARK, Un-Byoung KANG, Chung Sun LEE
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Patent number: 11911134Abstract: An apparatus for non-invasively measuring bio-information is provided. The apparatus for estimating bio-information may include a pulse wave sensor configured to measure a pulse wave signal from an object; a sensor position sensor configured to obtain sensor position information of the pulse wave sensor with respect to the object, based on the object being in contact with the pulse wave sensor; and a processor configured to estimate the bio-information based on blood vessel position information of the object, the sensor position information, and the pulse wave signal.Type: GrantFiled: December 23, 2020Date of Patent: February 27, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Woo Choi, Sang Yun Park, Hye Rim Lim, Jae Min Kang, Seung Woo Noh
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Patent number: 11182887Abstract: In a method of processing an image which is a video image including a plurality of frame images, a first high dynamic range (HDR) image is generated by combining a first frame image and a second frame image subsequent to the first frame image. The first and second frame images are included in the plurality of frame images. The first frame image has a first exposure time. The second frame image has a second exposure time different from the first exposure time. A second HDR image is generated by combining the second frame image and a third frame image subsequent to the second frame image. The third frame image is included in the plurality of frame images and has the first exposure time.Type: GrantFiled: July 31, 2019Date of Patent: November 23, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Jin-Woo Kang, Seong-Wook Song, Hye-Yun Jung
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Publication number: 20200219240Abstract: In a method of processing an image which is a video image including a plurality of frame images, a first high dynamic range (HDR) image is generated by combining a first frame image and a second frame image subsequent to the first frame image. The first and second frame images are included in the plurality of frame images. The first frame image has a first exposure time. The second frame image has a second exposure time different from the first exposure time. A second HDR image is generated by combining the second frame image and a third frame image subsequent to the second frame image. The third frame image is included in the plurality of frame images and has the first exposure time.Type: ApplicationFiled: July 31, 2019Publication date: July 9, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Jin-Woo Kang, Seong-Wook Song, Hye-Yun Jung
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Patent number: 6913694Abstract: A selective membrane having a high fouling resistance. In one embodiment, the selective membrane is a composite polyamide reverse osmosis membrane in which a hydrophilic coating has been applied to the polyamide layer of the membrane, the hydrophilic coating being made by (i) applying to the membrane a quantity of a polyfunctional epoxy compound, the polyfunctional epoxy compound comprising at least two epoxy groups, and (ii) then, cross-linking the polyfunctional epoxy compound in such a manner as to yield a water-insoluble polymer.Type: GrantFiled: November 6, 2001Date of Patent: July 5, 2005Assignee: Saehan Industries IncorporationInventors: Ja-Young Koo, Sung Pyo Hong, Jin Woo Kang, Nowon Kim
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Publication number: 20030121844Abstract: A selective membrane having a high fouling resistance. In one embodiment, the selective membrane is a composite polyamide reverse osmosis membrane in which a hydrophilic coating has been applied to the polyamide layer of the membrane, the hydrophilic coating being made by (i) applying to the membrane a quantity of a polyfunctional epoxy compound, the polyfunctional epoxy compound comprising at least two epoxy groups, and (ii) then, cross-linking the polyfunctional epoxy compound in such a manner as to yield a water-insoluble polymer.Type: ApplicationFiled: November 6, 2001Publication date: July 3, 2003Inventors: Ja-Young Koo, Sung Pyo Hong, Jin Woo Kang, Nowon Kim
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Patent number: D958694Type: GrantFiled: August 14, 2019Date of Patent: July 26, 2022Inventors: Eung-tae Kang, Jin-woo Kang, Jin-yong Kang