Patents by Inventor Jin-young Lee

Jin-young Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967746
    Abstract: Disclosed are an electrolyte membrane of a membrane-electrode assembly including an electronic insulation layer, which greatly improves the durability of the electrolyte membrane, and a method of preparing the same. The electrolyte membrane includes an ion exchange layer and an electronic insulation layer provided on the ion exchange layer, and the electronic insulation layer includes one or more catalyst complexes, and a second ionomer Particularly, each of the one or more catalyst complex includes a catalyst particle and a first ionomer coated on the entirety or a portion of the surface of the catalyst particle, and the one or more catalyst complexes are dispersed the second ionomer.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: April 23, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Byoung Su Kim, Yong Min Kim, Ha Yeong Yu, Jin Yi Choi, Ju Ahn Park, Ju Young Lee, Jung Ik Kim, Min Kyung Kim
  • Publication number: 20240128570
    Abstract: Discussed is a battery pack case that may include a first case and a second case configured such that outer peripheries of the first case and the second case are coupled to each other by ultrasonic welding, wherein the outer periphery of the first case comprises a flat portion and a projecting portion formed as a result of a middle of the first case in a thickness direction projecting from the flat portion. Further, the outer periphery of the second case comprises a receiving portion configured to be fused with the projecting portion and an outer guide portion projecting from the receiving portion so as to face the flat portion, and a control rib projecting from at least a part of the flat portion is provided.
    Type: Application
    Filed: February 23, 2022
    Publication date: April 18, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jae Young JANG, Jin Hyun LEE, Sang Jin KIM
  • Publication number: 20240124656
    Abstract: The present disclosure relates to a conductive hydrogel including a mussel adhesive protein, a liquid metal, and hyaluronic acid and a preparation method thereof.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 18, 2024
    Inventors: Hyung Joon Cha, Jae Yun Lee, Jin Young Yun, Hyun Tack Woo
  • Publication number: 20240127488
    Abstract: An image encoding/decoding method, device and recording medium based on accumulation of a region of interest of the present disclosure may include partitioning a current image to acquire a region of interest, cumulatively expressing the region of interest in a reference image of the current image and decoding the current image based on a reference image in which the region of interest is cumulatively expressed.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Inventors: Jin Young LEE, Hee Kyung LEE, Sang Kyun KIM
  • Publication number: 20240123817
    Abstract: A variable grille apparatus controls a flow rate of air circulated through the grille. Commercial properties are improved through an advanced opening and closing operation during adjustment of the air flow rate. The opening and closing operation of the grille is diversified, such as by sequential or simultaneous operation, so that the sense of operation is enhanced, an exterior design is diversified, and the air flow is secured through an optimization of the structural arrangement.
    Type: Application
    Filed: July 6, 2023
    Publication date: April 18, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.
    Inventors: Jin Young Yoon, Dong Eun Cha, Hong Heui Lee, Jae Sup Byun, Jang Ho Kim
  • Patent number: 11961867
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240119851
    Abstract: The present invention relates to a method and system for providing language learning services. The method of providing language learning services, according to the present invention, the method may include: activating, in response to receiving an input for acquiring a learning target image through a user terminal, a camera of the user terminal; specifying at least a portion of an image taken by the camera as the learning target image; receiving language learning information for the learning target image from a server; providing the language learning information to the user terminal; and storing, based on a request for storing of the language learning information, the language learning information in association with the learning target image, such that the learning target image is used in conjunction with learning of the language learning information.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 11, 2024
    Inventors: Eun Young LEE, Min Jung KIM, Yeun Hee KANG, Bong Hyun CHOI, Tae Un KIM, Soo Hyun LEE, Young Ho KIM, Chan Kyu CHOI, Jin Mo KU, Jong Won KIM
  • Publication number: 20240120224
    Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin Hyuk CHOI, Beom Soo HWANG, Kong Woo LEE, Myung Ki SONG, Ja-Yul KIM, Kyu Sang LEE, Hyun Joo JEON, Nam Young CHO
  • Publication number: 20240120211
    Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.
    Type: Application
    Filed: September 15, 2023
    Publication date: April 11, 2024
    Inventors: Jin Young Kim, Doo Hyun Park, Seung Jae Lee
  • Publication number: 20240120265
    Abstract: A circuit board according to an embodiment comprises an insulating layer; an electrode layer disposed on the insulating layer; and a protective layer disposed on the insulating layer and including an opening vertically overlapping at least a portion of an upper surface of the electrode layer; wherein the electrode layer includes: a first layer disposed on the insulating layer; a second layer disposed on the first layer; a third layer disposed on the second layer; and a fourth layer disposed on the third layer, wherein a width of the second layer is greater than a width of the third layer, wherein a thickness of the second layer is greater than a thickness of the third layer, and wherein a height of an upper surface of the protective layer is equal to or less than a height of an upper surface of the third layer.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sang Young LEE, Dong Min KIM, Jin Soo BAE
  • Patent number: 11956998
    Abstract: A display device includes: a first substrate including a pixel area and a transmissive area; a thin-film transistor on the first substrate; a planarization layer on the thin-film transistor; a first light emitting electrode on the planarization layer; a bank covering a part of the first light emitting electrode; a light emitting layer on the first light emitting electrode; and a second light emitting electrode on the light emitting layer and the bank. The transmissive area includes a transmissive hole penetrating the bank and the planarization layer.
    Type: Grant
    Filed: January 4, 2023
    Date of Patent: April 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Se Wan Son, Moo Soon Ko, Rae Young Gwak, Jin Seock Ma, Min Jeong Park, Ki Bok Yoo, So La Lee, Jin Goo Jung, Jong Won Chae, Ye Ji Han
  • Patent number: 11955531
    Abstract: An integrated circuit device includes a fin-type active region protruding from a top surface of a substrate and extending in a first direction parallel to the top surface of the substrate, a gate structure intersecting with the fin-type active region and extending on the substrate in a second direction perpendicular to the first direction, a source/drain region on a first side of the gate structure, a first contact structure on the source/drain region, and a contact capping layer on the first contact structure. A top surface of the first contact structure has a first width in the first direction, a bottom surface of the contact capping layer has a second width greater than the first width stated above in the first direction, and the contact capping layer includes a protruding portion extending outward from a sidewall of the first contact structure.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: April 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae-young Kwak, Ji-ye Kim, Jung-hwan Chun, Min-chan Gwak, Dong-hyun Roh, Jin-wook Lee, Sang-jin Hyun
  • Patent number: 11955471
    Abstract: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: April 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Ho Do, Dal-Hee Lee, Jin-Young Lim, Tae-Joong Song, Jong-Hoon Jung
  • Publication number: 20240112940
    Abstract: The present invention relates to an electrostatic chuck heater having a bipolar structure, the electrostatic chuck heater comprising: a heater body having an internal electrode and an external electrode for selectively performing any one of an RF grounding function and an electrostatic chuck function according to a semiconductor process mode; and a heater support mounted below the heater body so as to support the heater body.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Inventors: Jin Young CHOI, Jun Won SEO, Ju Sung LEE
  • Patent number: 11949881
    Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: April 2, 2024
    Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Research Institute for Industry Cooperation, Industry-Academia Cooperation Group of Sejong University
    Inventors: Se-Yoon Jeong, Hae-Chul Choi, Jeong-Il Seo, Seung-Kwon Beack, In-Seon Jang, Jae-Gon Kim, Kyung-Ae Moon, Dae-Young Jang, Jin-Woo Hong, Jin-Woong Kim, Yung-Lyul Lee, Dong-Gyu Sim, Seoung-Jun Oh, Chang-Beom Ahn, Dae-Yeon Kim, Dong-Kyun Kim
  • Publication number: 20240097297
    Abstract: A cylindrical secondary battery includes: an electrode assembly including a first electrode plate and a second electrode plate; a cylindrical case having a disk-shaped top portion and a side portion extending from the top portion, the cylindrical case accommodating the electrode assembly; a cathode terminal extending through the top portion and insulated therefrom; a first current collector plate electrically connected to the first electrode plate and the cathode terminal; a second current collector plate electrically connected to the second electrode plate and the side portion of the cylindrical case; a cap plate coupled to the side portion and insulated therefrom; and an insulation tape between the top portion of the cylindrical case and the first current collector plate and covering the first current collector plate.
    Type: Application
    Filed: August 16, 2023
    Publication date: March 21, 2024
    Inventors: Hyun Ki JUNG, Myung Seob KIM, Kyung Rok LEE, Jin Young MOON, Ho Jae LEE, Byung Chul PARK
  • Publication number: 20240097251
    Abstract: An embodiment of the present invention relates to a cylindrical secondary battery in which a positive electrode terminal is adhered and fixed to a cylindrical can by an insulating sheet, and thus sealing between the cylindrical can and the positive electrode terminal can be facilitated due to an increased contact area.
    Type: Application
    Filed: March 29, 2022
    Publication date: March 21, 2024
    Inventors: Hyun Ki JUNG, Byung Chul PARK, Gun Gue PARK, Gwan Hyeon YU, Jin Young MOON, Kyung Rok LEE, Myung Seob KIM, Sung Gwi KO, Woo Hyuk CHOI
  • Patent number: 11936052
    Abstract: Provided is a fluorine-doped tin oxide support, a platinum catalyst for a fuel cell having the same, and a method for producing the same. Also described is a high electrical conductivity and electrochemical durability by doping fluorine to the tin oxide-based support through an electrospinning process. Thus, while resolving a degradation issue of the carbon support in the conventional commercially available platinum/carbon (Pt/C) catalyst, what is designed is to minimize an electrochemical elution of dopant or tin, which is a limitation of the tin oxide support itself and has excellent performance as a catalyst for a fuel cell.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: March 19, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jin Young Kim, Jong Min Kim, Hee-Young Park, So Young Lee, Hyun Seo Park, Sung Jong Yoo, Jong Hyun Jang, Hyoung-Juhn Kim, Chang Won Yoon, Jonghee Han
  • Patent number: D1021834
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: April 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-Ho Kim, Seung-Ho Lee, Ji-Gwang Kim, Sang-Young Lee, Jin-Su Park