Patents by Inventor Jing-Cheng LEN

Jing-Cheng LEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three dimensional integrated circuits stacking approach
    Patent number: 9209156
    Abstract: A semiconductor package and a method of forming a semiconductor package with one or more dies over an interposer die are provided. By forming a first redistribution structure over the interposer die with TSVs, the die(s) bonded to the interposer die can have edge(s) beyond the boundary of the interposer die. In addition, a second redistribution structure may be formed on the opposite surface of the interposer die from the redistribution structure. The second redistribution structure enables reconfiguration and fan-out of bonding structures for external connectors of the interposer die.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: December 8, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jing-Cheng Len, Shang-Yun Hou
  • NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH
    Publication number: 20140091473
    Abstract: A semiconductor package and a method of forming a semiconductor package with one or more dies over an interposer die are provided. By forming a first redistribution structure over the interposer die with TSVs, the die(s) bonded to the interposer die can have edge(s) beyond the boundary of the interposer die. In addition, a second redistribution structure may be formed on the opposite surface of the interposer die from the redistribution structure. The second redistribution structure enables reconfiguration and fan-out of bonding structures for external connectors of the interposer die.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng LEN, Shang-Yun HOU