Patents by Inventor Jing-Hui Zhuang

Jing-Hui Zhuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test kit for testing a device under test
    Patent number: 11879934
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: January 23, 2024
    Assignee: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Chih-Yang Liu, Che-Hsien Huang, Yi-Chieh Lin
  • TEST KIT FOR TESTING A DEVICE UNDER TEST
    Publication number: 20230236222
    Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Che-Hsien Huang, Shih-Chia Chiu, Yi-Chieh Lin, Wun-Jian Lin
  • TEST KIT FOR TESTING A DEVICE UNDER TEST
    Publication number: 20220397600
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.
    Type: Application
    Filed: May 3, 2022
    Publication date: December 15, 2022
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Chih-Yang Liu, Che-Hsien Huang, Yi-Chieh Lin